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采用粉状中间层合金D1P对镍基单晶高温合金DD3进行了TLP扩散焊,并对接头组织与性能进行分析研究.结果表明,D1P粉状中间层合金TLP扩散焊接头的焊缝主要由γ+γ'双相组织、枝状化合物(Mo,W,Cr,Ni)3B2和条状化合物(Cr,Mo)23(C,B)6组成,近缝区中存在块状或针状化合物相(Mo,W,Cr,Ni)3B2.接头中存在明显的组织不均匀现象,对接头性能具有明显的不利影响.接头组织不均匀现象可经过高温长时间保温消除,1 250℃/24 h/空冷扩散焊的接头,并在焊后进行时效处理,其980℃持久强度可达到母材的90%. 相似文献
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采用KNi3中间层,对Ni3Al单晶高温合金进行过渡液相扩散焊,分析不同焊接保温时间的接头和基体组织的变化,测试接头的高温持久性能.结果表明,1 240℃保温12 h,TLP扩散焊接头局部区域有少量的γ+γ'共晶组织及小块状的硼化物组织,其它区域均为与基体组织一致的γ+γ'双相组织;基体γ'相由四方形转变成不规则状.焊接接头在1 000℃高温持久强度达到标准状态的基体强度90%.试样组织出现γ'相筏形化,焊缝区域筏形组织粗化,且形状不规则,与持久应力方向呈一定角度. 相似文献
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从焊接进程、凝固、氧化物的破碎、中间层与钎料的区别、接头组成、脆性相的形成与消除、压力的作用、接头强化机理等方面总结分析了瞬间液相扩散焊与钎焊的区别。强调指出了下述关键点 :(1)中间层的选取是获得两种不同焊接方法接头的首要前提 ;(2 )在钎焊中侧重点是润湿性 ,它是保证接头获得一定强度的首要前提与主要手段 ;(3 )在瞬间液相扩散焊过程中 ,除了润湿性之外 ,更为关注的是降熔元素的扩散。中间层中降熔元素向母材的持续扩散是TLP接合中液态区增宽、破碎氧化膜、等温凝固、均匀化现象的本质原因 ;降熔元素向母材的充分扩散及由此而出现的中间层成分的合理改变是TLP焊接成败的命脉 相似文献
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采用铜箔和Cu-Ti合金作为中间层进行了TiAl和GH3536的扩散焊试验.以铜箔作为中间层在935℃/10 MPa/1 h参数下获得的焊缝组织以Ti(Cu,Al)2,AlCu2Ti和AlNi2Ti相为主,焊缝中存在裂纹.接头室温平均抗剪强度仅有31 MPa.以Cu-Ti合金作为中间层在935℃下采用三种不同参数进行了TiAl和GH3536的液相扩散焊试验.当加压3 MPa,保温10 min时,扩散焊缝中央还存在着宽度约5μm的残留相.保温时间延长至1 h,焊缝形成了较为均匀的分层组织,获得的接头室温抗剪强度最高,达180 MPa.增大压力至20 MPa,保温2 h获得的接头中出现AlNi2Ti相,接头平均室温抗剪强度下降至90 MPa. 相似文献
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0Introduction DD6isasecondgenerationsinglecrystalsuperalloy developedbyBeijingInstituteofAeronauticalMaterials, whichpossessesmanyadvantagessuchashighstrengthat elevatedtemperature,excellentcomprehensiveperform anceandgoodmicrostructuralstability.DD6allo… 相似文献
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MGH956合金是采用机械合金化方法制造的氧化物弥散强化高温合金,具有高温力学性能好、高温抗氧化和抗腐蚀性能好的综合优势。自行研制了中间层合金KCol进行MGH956合金过渡液相(TLP)扩散连接试验,分析了接头组织、成分和连接工艺的关系,确定了MGH956合金TLP扩散连接机理。同时,对MGH956合金焊接接头中产生的夹渣缺陷进行了深入的分析。结果表明:在连接温度1240℃、保温8h条件下,可以获得焊接缺陷少、完整连续的焊接接头。 相似文献
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Bonding phenomena of transient liquid phase bonded joints of a Ni base single crystal superalloy 总被引:1,自引:0,他引:1
The bonding phenomena of Ni base single crystal superalloy CMSX-2 during transient liquid phase (TLP) bonding have been investigated using MBF-80 and F-24 insert metals. TLP bonding of the superalloy was carried out at 1373-1548K for 0-19.6ks in vacuum and the (100) plane of each test specimen was always aligned perpendicular to the joint interface. The dissolution width increased when the bonding temperature and holding time increased. The eutectic width decreased linearly with the square root of holding time during isothermal solidification. After homogenization treatment, the microstructure, distributions of hardness and alloying elements in the bonded interlayer become similar to those of the base metal. 相似文献
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采用金属粉末67Cu-33Mn,67Cu-33Mn-5Ni(质量百分比)为中间层对W与Cu合金进行了瞬时液相连接,利用SEM、EDX分别对试样进行显微组织及成分分析,并探讨其连接机理。结果表明,中间层67Cu-33Mn-5Ni获得的接头比中间层67Cu-33Mn的显微组织更致密,结合性更好。分析认为,M的加入,提高了中间层溶质的扩散率,加速了液相的等温凝固;Ni还溶解一定量的W,形成Ni(W)固溶体。其连接机理是通过中间层Cu-Mn形成液相,与母材Cu实现瞬时液相连接;与母材W实现钎焊连接。 相似文献
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Bong Keun Lee Woo Young Song Dae Up Kim In Su Woo Chung Yun Kang 《Metals and Materials International》2007,13(1):59-65
The bonding phenomenon and the mechanism involved in the transient liquid phase bonding (TLP Bonding) of directionally solidified
Ni-based superalloy GTD-111 was investigated. At a bonding temperature of 1403 K, the liquid insert metal was eliminated by
isothermal solidification, which was controlled by the diffusion of B and Si into the base metal. The solids in the bonded
interlayer simultaneously grew epitaxially from the mating base metal inward from the insert metal. The number of grain boundaries
formed at the bonded interlayer corresponded with those of the base metal. Liquefaction at the grain boundary and dendrite
boundary occurred at a temperature of 1433 K. At a bonding temperature of 1453 K which is higher than the liquefaction temperature
of the grain boundary, liquids of the insert metal were connected with liquated grain boundaries; this connection extended
as far as the grain boundary, which was approximately 1.5 mm from the interface. The composition of this liquid was a mixture
of the insert metal and phase that existed at the grain boundary. At extended holding times, liquid phases gradually decreased,
and liquids with a continuous band shape develop into distinct islands. However, the liquid phases did not disappear after
a holding period of 7.2 ks at 1453K. The extended isothermal solidification process at the bonding temperature, which is higher
than the liquefaction temperature for the grain boundary, was controlled by the diffusion of Ti. This resulted in its preferential
liquefaction compared to B or Si in the insert metal. 相似文献
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TiNi形状记忆合金与不锈钢的瞬时液相扩散焊 总被引:1,自引:0,他引:1
采用AgCu金属箔作中间过渡层,对TiNi形状记忆合金与不锈钢进行了瞬时液相扩散焊,分析了接头的显微组织、元素分布和物相组成等,研究了接头的抗剪强度和断裂方式。结果表明:接头界面区由TiNi侧过渡区,中间区,不锈钢侧过渡区组成,主要相分别为Ti(Cu,Ni,Fe),AgCu,TiFe等。连接温度为860℃,保温时间为60min,连接压力为0.05MPa时,接头最大抗剪强度为239MPa。断裂发生在TiNi母材和AgCu中间层扩散界面上,断口为混合断裂形貌。通过中间层等温凝固过程动力学模型,结合界面形貌和元素扩散分析,认为TiNiSMA与不锈钢异种材料瞬时液相扩散焊过程存在明显的非对称性。 相似文献
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In this paper, experiments and theoretical analysis were conducted to elucidate the internal relation between base metal misorientation and the characteristics of DD5 single-crystal superalloy TLP joints. The alloy was bonded at 1513 K for 10 h in vacuum environment. High-temperature creep rupture tests were carried out to determine the joint’s quality. Results revealed that base metal misorientation exerted a remarkable influence on DD5 alloy TLP joints. The joints of base metals with [001] orientation were used in this research. When the misorientation was smaller than 9°-10°, the single crystallization of joints can be realized and joints can achieve excellent mechanical properties. When the misorientation was more than 10°, there would be second-phase particles distributed in grain boundaries, thus resulting in poor mechanical property of joint; moreover, the characteristics of joint did not change with base metal misorientation in this case. 相似文献
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为了探明单晶过渡液相(TLP)扩散焊接头组织与性能的关系,采用扫描电镜(SEM)研究接头微观组织,并进行力学性能测试. 结果表明,接头由连接区和基体区所组成. 当等温凝固过程未完成时,连接区由等温凝固区和快速凝固区组成,而等温凝固区主要由γ和γ'相组成,快速凝固区主要是由共晶组织组成. 当等温凝固完成而固态均匀化过程不充分时,连接区由等温凝固区和分布在接头中心的硼化物相组成. 采用低温等温凝固,高温固态均匀化的焊接工艺可以获得高性能的接头. 相似文献
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Transient liquid phase (TLP) bonding of Mg-AZ31 and Ti-6Al-4V alloys was performed using pure thin Ni electro-deposited coat interlayer (12 μm). The effect of bonding temperature, time and pressure on microstructural developments and subsequent mechanical properties across joint interface was studied at a temperature range from 500 to 540 °C, bonding time from 1 to 60 min and bonding pressure from 0 to 0.8 MPa. The mechanisms of bond formation varied across the joint region, with solid-state diffusion dominant at the Ti-6Al-4V interface and eutectic diffusion at the Mg-AZ31 interface. Joint microstructure was examined by scanning electron microscopy (SEM), and energy dispersive spectroscopy (EDS). X-ray diffraction (XRD) was used to detect the formation of intermetallic phases at the fracture surface. The maximum joint shear strength of 61 MPa was obtained at a temperature of 520 °C, 20 min and at a bonding pressure of 0.2 MPa. This joint strength was three times the bond strength reported for joints made using adhesives and represents 50% of the Mg-AZ31 alloy shear strength. 相似文献
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Formation process, microstructure and mechanical property of transient liquid phase bonded aluminium-based metal matrix composite joint 总被引:3,自引:0,他引:3
1 INTRODUCTIONThealuminium basedmetalmatrixcomposites(MMCs)areadvancedmaterialsthathavesuperiorproperties ,especiallyincreasedstiffness ,highstrength ,goodwearresistanceandsuperiorelevatedtemperatureproperties .Theyhavereceivedconsider ableattentionascandidatesforadvancedindustrialapplications[1,2 ] .But ,theirapplicationshavebeenseverelyrestrictedbythelackofasuitablejoiningmethod[3] .AlthougthfusionweldingmethodscanbeusedtojointheMMCs ,themethodsnormallytendtoresultinunfavourablejoint… 相似文献
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"相变-扩散钎焊(T/DB)"新工艺及其接头界面形貌 总被引:3,自引:0,他引:3
为减小相变超塑性扩散连接的循环次数,提出了一种新型焊接工艺"相变-液相扩散焊(T/DB)",即在待焊母材间预先放入液相扩散焊用的中间层,然后按传统相变超塑性扩散连接工艺施焊,但要求温度循环的峰值温度须同时大于母材的相变点与中间层的熔点.试验以低碳钢为母材,以镍基非晶箔带(BNi2)为中间层,进行了低碳钢的相变-扩散钎焊(循环3次)与液相扩散焊接(1200℃×3 min)的对比试验.结果表明相变-液相扩散焊所需温度循环次数少,接头无界面空洞,其接合线呈非平面状;而液相扩散焊接头的接合线较平直.分析认为,界面的起伏是母材的适度溶解与超塑性流变共同作用的结果;非平面状界面有利于增大金属-金属接触面积及扩散通道的面积,为获得合格接头做出了相应贡献. 相似文献