Diffusion bonding of copper alloy to stainless steel with Ni and Cu interlayer

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Study of diffusion bonding of Ti-6Al-4V and ZQSn10-10 with metal interlayer

The diffusion bonding was carried out to join Ti alloy (Ti-6Al-4V) and tin-bronze (ZQSn10-10) with Ni and Ni Cu interlayer. The microstructures of the diffusion bonded joints were analyzed by scanning electron microscope (SEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD). The results show that when the interlayer is Ni or Ni Cu transition metals both could effectively prevent the diffusion between Ti and Cu and avoid the formation of the Cu-Ti intermetallic compounds (Cu3Ti, CuTi etc.). But the Ni-Ti intermetallic compounds (NiTi, Ni3Ti) are formed on the Ti-6Al-4V/Ni interface. When the interlayer is Ni, the optimum bonding parameters are 830℃/10 MPa/30min. And when the interlayer is Ni Cu, the optimum bonding parameters are 850℃/10MPa/20min. With the optimum bonding parameters, the tensile strength of the joints with Ni and Ni Cu interlayer both are 155.8MPa, which is 65 percent of the strength of ZQSn10-10 base metal.     

中间过渡金属对钛合金与不锈钢扩散焊接头强度的影响

采用加中间过渡金属的工艺方法，对钛合金ＴＣ４与不锈钢１Ｃｒ１８Ｎｉ９Ｔｉ扩散焊接头的结合强度进行了试验研究，利用扫描电镜，电子探针仪等对接头进行了微观分析。结果表明，采用纯镍作中间过过渡金属虽然有效地防止了钛与铁，碳间的相互扩散和迁移，但在镍与钛之间却形成了金属间化合物薄层，致使接头的最高强度在３８０ＭＰａ左右；采用钒＋铜复合过渡金属彻底地消除了钛合金－不锈钢接头中的金属间化合物和碳化物。     

以铜和Cu-Ti作为中间层的TiAl/GH3536扩散焊

采用铜箔和Cu-Ti合金作为中间层进行了TiAl和GH3536的扩散焊试验.以铜箔作为中间层在935℃/10 MPa/1 h参数下获得的焊缝组织以Ti（Cu,Al）2,AlCu2Ti和AlNi2Ti相为主,焊缝中存在裂纹.接头室温平均抗剪强度仅有31 MPa.以Cu-Ti合金作为中间层在935℃下采用三种不同参数进行了TiAl和GH3536的液相扩散焊试验.当加压3 MPa,保温10 min时,扩散焊缝中央还存在着宽度约5μm的残留相.保温时间延长至1 h,焊缝形成了较为均匀的分层组织,获得的接头室温抗剪强度最高,达180 MPa.增大压力至20 MPa,保温2 h获得的接头中出现AlNi2Ti相,接头平均室温抗剪强度下降至90 MPa.     

镍作中间层脉冲加压扩散连接钛合金与不锈钢

采用纳米Ni粉、纳米Ni镀层、Ni箔作中间过渡层,对TA17近。型钛合金与0Cr18Ni9Ti不锈钢进行了脉冲加压扩散连接,接头抗拉强度分别达到了175,212,334MPa。在金相显微镜下,对拉伸断口形貌进行了观察和分析;利用扫描电镜（SEM）、能谱仪（EDS）、X射线衍射分析（XRD）测定了连接接头各区域内的微区成分和物相。结果表明,纳米Ni粉致密度不够高,纳米Ni镀层质量不够高,在很大程度上限制了接头强度的提高;Ni箔中间层的存在成功地阻止了Fe与Ti之间的互扩散,避免了形成脆而硬的Fe—Ti系金属间化合物。     

瞬时液相扩散焊接CuAlBe合金和1Cr18Ni9Ti不锈钢

采用ＣｕＭｎ合金为中间层对ＣｕＡｌＢｅ合金和１Ｃｒ１８Ｎｉ９Ｔｉ不锈钢进行了瞬时液相扩散焊接。通过扫描电镜、电子探针和Ｘ射线省射分析等手段对接头的微观组织和相结构进行了分析,并用拉伸试验评价了接头的连接强度。研究结果表明,焊接压力、焊接温度、焊接时间及ＣｕＭｎ合金中间层Ｍｎ的含量等焊接参数对接头强度影响很大。在本试验中,当ＣｕＭｎ中间层中Ｍｎ元素含量为３０％、Ｔｔ＝１２２３Ｋ、ｔｂ＝４０ｍｉｎ、Ｐ     

TiB2金属陶瓷与TiAl金属间化合物的扩散连接

对TiB2金属陶瓷与TiAl金属间化合物进行了扩散连接试验，研究了直接扩散连接和采用Ni为中间层进行扩散连接的接头界面结构及工艺参数对界面结构和连接性能的影响。直接扩散连接时，连接界面处生成了Ti(Cu，Al)2金属间化合物，采用Ni为中间层进行扩散连接时，界面处生成了单层TiAlNi2金属间化合物层和两层T1，Al，N2扩散层共三层结构。直接扩散连接时，连接温度T＝1223K，时间t=1．8ks，压力p＝80MPa时接头强度为103MPa；采用Ni为中间层时，连接温度T＝1273K，时间t=1．8ks，压力p=80MPa时接头强度为110MPa。     

铍／HR—1不锈钢热等静压扩散连接界面特性研究

采用热等静压（HIP）方法，对铍与HR－1不锈钢（SS）在加Cu单层或Cu/Ni双层过渡材料的条件下进行扩散连接。利用金相显微镜，扫描电镜（SEM）、俄歇电子能谱（AES）、显微力学探针（MPM）及拉伸试验分析了接头扩散区的显微组织，微区成分和力学性能。探讨了扩散区成分，组织，硬度及弹性模量分布的关系。研究表明，加Cu单层过渡材料能有效阻挡Fe向铍端的扩散，但不能阻挡铍向不锈钢端的扩散和消除合金元素Ni向Be/Fe及Be/Cu的偏聚，存在幅度较大的弹性模量跃变，造成应力集中和开裂。加Cu/Ni双层过渡材料能实现Be,Cu,Ni与不锈钢间的互扩散，其结合强度为50MPa，是实现铍与不锈钢扩散连接和提高接头质量的可选方法。     

W与Cu合金瞬时液相连接分析

采用金属粉末67Cu-33Mn,67Cu-33Mn-5Ni（质量百分比）为中间层对W与Cu合金进行了瞬时液相连接,利用SEM、EDX分别对试样进行显微组织及成分分析,并探讨其连接机理。结果表明,中间层67Cu-33Mn-5Ni获得的接头比中间层67Cu-33Mn的显微组织更致密,结合性更好。分析认为,M的加入,提高了中间层溶质的扩散率,加速了液相的等温凝固;Ni还溶解一定量的W,形成Ni（W）固溶体。其连接机理是通过中间层Cu-Mn形成液相,与母材Cu实现瞬时液相连接;与母材W实现钎焊连接。     

Characterization of diffusion-bonded joint between Al and Mg using a Ni interlayer

Aluminum and magnesium were joined through diffusion bonding using Ni interlayer. The microstructure and mechanical performance of the Al/Ni/Mg joints at different temperatures was investigated by means of scanning electron microscope(SEM), electro-probe microanalyzer(EPMA), X-ray diffraction(XRD), Vickers hardness testing, and shear testing. The results show that the addition of Ni interlayer eliminates the formation of Mg–Al intermetallic compounds and improves the bonding strength of the Al/Mg joints. The Al/Ni/Mg joints are formed by the diffusion of Al, Ni and Mg, Ni. The microstructure at the joint interface from Al side to Mg side is Al substrate/Al–Ni reaction layer/Ni interlayer/Mg–Ni reaction layer/Mg substrate multilayer structure. The microhardness of the Mg–Ni reaction layer has the largest value of HV 255.0 owing to the existence of Mg_2Ni phase.With the increase of bonding temperature, the shear strength of the joints increases firstly and then decreases.The Al/Ni/Mg joint bonds at 713 K for 90 min, exhibiting the maximum shear strength of 20.5 MPa, which is greater than that of bonding joint bonded directly or with Ag interlayer. The fracture of the joints takes place at the Mg–Ni interface rather than the Al–Ni interface, and the fracture way of the joints is brittle fracture.     

Nb、Cu金属层厚度对Si3N4/Nb/Cu/Ni/Incone l600接头组织和性能的影响

采用Nb／Cu／Ni作中间层，在连接温度为1403K、连接时间为50min、连接压力为7．5MPa的条件下，采用不同尺寸的中间层进行了Si3N4陶瓷与Inconel 600高温合金的部分液相扩散连接。通过改变Nb层、Cu层厚度，研究了Cu层、Nb层厚度变化对Si3N4／Nb／Cu／Ni／Inconel 600接头的组织和性能的影响。研究发现，当Cu层厚度小于0．05mm时，随着Cu层厚度的增加，接头中的Cu—Ni合金层厚度增加，接头强度快速增加；当Cu层厚度超过0．05mm时，接头中的Cu—Ni合金层厚度由于压力的作用不明显增加，接头强度增加缓慢。随着Nb层厚度的增加，反应层厚度增加，接头的强度先增大后减小。     

Effect of immersion Ni plating on interface microstructure and mechanical properties of Al/Cu bimetal

A nickel-based coating was deposited on the pure Al substrate by immersion plating, and the Al/Cu bimetals were prepared by diffusion bonding in the temperature range of 450–550 °C. The interface microstructure and fracture surface of Al/Cu joints were studied by scanning electron microscopy (SEM) and X-ray diffraction (XRD). The mechanical properties of the Al/Cu bimetals were measured by tensile shear and microhardness tests. The results show that the Ni interlayer can effectively eliminate the formation of Al-Cu intermetallic compounds. The Al/Ni interface consists of the Al₃Ni and Al₃Ni₂ phases, while it is Ni-Cu solid solution at the Ni/Cu interface. The tensile shear strength of the joints is improved by the addition of Ni interlayer. The joint with Ni interlayer annealed at 500 °C exhibits a maximum value of tensile shear strength of 34.7 MPa.     

钛合金与不锈钢的纳米扩散焊接工艺探索

采用纳米镍粉为中间层对TA17钛合金与1Cr18Ni9Ti进行了扩散焊接试验。通过金相分析、能谱分析、X射线衍射等手段对焊接接头进行了较详细的分析。结果表明,纳米镍粉成功地阻止了钛合金与不锈钢的互扩散,抑制了TiFe,TiFe2等脆性相的形成,在接头形成了具有一定塑性的Ni-Ti型金属间化合物,但由于纳米镍粉中间层不致密,从而导致接头强度较低。     

93W/Ni/QSn4-3扩散焊接接头的显微结构和力学性能

采用扩散焊接的方法制备出加入Ni箔中间层的钨合金(93w)与锡青铜合金(QSn4-3)焊接接头样品.利用XRD,SEM和EPMA对焊接接头的物相组成和显微结构进行了分析,并测量了焊接接头样品的抗拉强度.结果表明,加镍的93W与QSn4-3进行扩散焊接时,焊接层的显微结构结合紧密,Ni与Cu元素之间以及93W合金的添加剂元素在Ni箔中分布存在明显的连续变化层.物相分析和显微硬度结果表明Ni元素与QSn4-3中的Cu元素和93W的添加剂元素的固溶反应,促进了93W,Ni/QSn4-3焊接接头强度的大幅度提高.

Abstract：

The 93W/Ni/QSn4-3 joint was prepared by diffusion bonding at vacuum using pure nickel foil as interface layer. The microstructure and composition were characterized by SEM and EP-MA. The tensile strength of joint was also measured. The test results show that Ni foil improves the tensile strength of 93W/Ni/QSn4-3 joint. The thickness of Ni interlayer becomes thiner obviously because of the diffusion layer between Ni element of Ni foil and W and additional elements of 93W alloy, as well as the gradient layer of Ni and Cu elements. Solution reactions between Ni element of Ni foil and Cu element of QSn4-3 alloy, W and additional elements of 93W alloy achieve the joint of 93W/Ni/QSn4-3, that is why tensile strength of 93W/Ni/QSn4-3 joint welded is improved.     

Transient liquid phase diffusion bonding of copper alloy to stainless steel using CuMn alloys as interlayer

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Investigation on reactive diffusion bonding of SiCp/6063 MMC by using mixed powders as interlayers

Mixed Al–Si, Al–Cu and Al–Si–SiC powders were used as interlayers to reactive diffusion bond SiCp/6063 MMC. The microstructure and the effects of bonding parameters on the shear strength of SiCp/6063 MMC joints were investigated. The results show that SiCp/6063 MMC joints bonded by using the interlayers of mixed Al–Si, Al–Cu powders have a dense joining layer of high quality. The mass transfer between the bonded materials and the interlayers during bonding leads to the hypoeutectic microstructure of the joining layers. Using mixed Al–Si–SiC powder as an interlayer, SiCp/6063 MMC can be reactive diffusion bonded by a composite joint. Because of the SiC segregation, however, there are a number of porous zones in the joining layer. This is responsible for the low shear strength of the joints, even lower than those reactive diffusion bonded by using the interlayers of mixed Al–Si and Al–Cu powders. Ti added in the interlayer obviously improves the joint strength reactive diffusion bonded by using the mixed Al–Si–SiC powder.     

Zr基非晶合金与铜的扩散连接研究

利用Gleeble 3500热模拟试验机在添加和未添加扩散连接中间层条件下对Zr41.25Ti13.75Cu12.5Ni10Be22.5块体非晶合金与纯铜的扩散连接性进行了研究。实验结果表明,在两种条件下均获得了无裂纹和空洞的良好的连接界面。通过扫描能谱分析和电子探针分析在连接界面处观察到明显的元素扩散,但元素扩散距离较窄。非晶合金中晶化相的出现促进了界面处元素的扩散。     

Joining of tungsten to CuCrZr alloy with Cu-TiH2-Ni filler and Cu interlayer

Joining of refractory tungsten to CuCrZr alloy has been performed using Cu-TiH₂-Ni filler and Cu interlayer at 1203 K. Microstructure characterization of the joint with Cu-TiH₂-Ni filler reveals a satisfactory interfacial bonding. The filler layer is composed of Cu solid solution, TiCu₄, Ti₂(Cu, Ni), τ₁-Ti(Cu_xNi_1-x)₂ and TiCu phases. The diffusion of W atoms from the W substrate into the filler layer occurs due to its high affinity with Ni in the filler. For the joint obtained with Cu-TiH₂-Ni filler and Cu interlayer, the favorable bonding is achieved and similar phase compositions of the filler layers are developed as that obtained with Cu-TiH₂-Ni filler. The thickness of Cu interlayer is reduced by about 50% owing to its dissolution into the molten filler. The microhardness distributions of the joints are highly related to the phases developed during brazing. The decrease in the hardness on the W side of the joint is attributed to the formation of vacancies in the W substrate. The joining strength of the joint obtained with Cu-TiH₂-Ni filler and Cu interlayer is higher than that without Cu interlayer, implying that the application of Cu interlayer is beneficial for the residual stress relaxation of the joint and the improvement of the joint strength.     

The study on interfacial bonding strength of Ag-Ni, Ag-Cu in cold pressure welding

The area of combination actually is a kind of interfacial phenomena that exist on the surface or thin film. The properties of interface have important effect on the whole welded joint, even decide directly the interfacial bonding strength.The bonding strength of metals in cold pressure welding such as Ag-Ni (they are hardly mutual soluble ) and Ag-Cu( they are limited soluble ) are discussed in this paper. The results of the tensile test suggest that two kinds of welded joints have enough strength to satisfy with the demand for being used. Moreover, thermodynamics, crystal logy, physics and metal electronic microscopic analysis etc are adopted to further calculate the bonding strength. The results of test and theoretical analyses prove that Ag-Ni, Ag-Cu, especially, for Ag-Ni can .form strong welded joint which is higher than that of the relative soft base metals in cold pressure welding.     

钴/镍复合中间层真空扩散连接钨与钢

以钴粉/镍箔为复合中间层,采用800,900和1 000 ℃等三种连接温度,加压10 MPa并保温120 min的工艺条件,对钨/钢真空扩散连接. 研究了接头的微观组织、成分分布、力学性能及断口特征. 结果表明,连接温度为800 ℃和900 ℃时,钨/中间层界面金属间化合物生成很少,对应接头抗剪强度分别为186 MPa和172 MPa,断口均位于钨母材中近界面的位置,为典型解理断裂形貌;当连接温度升至1 000 ℃时,钨/中间层界面生成厚度小于2 μm的连续金属间化合物层,接头抗剪强度降至115 MPa,断裂也发生在钨母材中近界面的位置,断口大部分区域为沿晶断裂特征.