8GHz带有RC稳定网络的AIGaN/GaN HEMTs内匹配功率合成放大器的设计

设计了工作在8GHz的基于AIGaN/GaN HEMTs的内匹配功率合成放大器.输入和输出匹配电路制作在0.381mm厚的氧化铝陶瓷基片上,为了提高整个电路的稳定因子K,在电路输入端增加了片上RC有损网络.在8GHz测出连续波ldB压缩点时的输出功率为PldB=43dBm(20W),线性增益7.3dB,最大PAE为38.1%,合成效率达到70.6%.     

8GHz带有RC稳定网络的AlGaN/GaN HEMTs内匹配功率合成放大器的设计

设计了工作在8GHz的基于AlGaN/GaN HEMTs的内匹配功率合成放大器.输入和输出匹配电路制作在0.381mm厚的氧化铝陶瓷基片上,为了提高整个电路的稳定因子K,在电路输入端增加了片上RC有损网络.在8GHz测出连续波1dB压缩点时的输出功率为P1dB=43dBm（20W）,线性增益7.3dB,最大PAE为38.1%,合成效率达到70.6%.     

一种新型的双频整流电路

提出一种双频微带整流电路。电路由一个十字型匹配枝节、二极管和直通滤波器组成。匹配枝节实现了二极管在两个频率下同时与50赘匹配,直通滤波器有效抑制了基频和高次谐波。用ADS2011 软件进行分析和设计,10mW 输入功率时,整流电路工作在1. 8GHz 和2. 4GHz 的射频-直流(RF-DC)转换效率分别为75. 8% 和71.1%。实测结果显示,在1. 8GHz 和2. 2GHz 频率上电路有最大RF-DC 转换效率,分别为50%和54%,分析了产生误差的原因。该双频整流电路具有输入功率低、易集成的特点,可用于RFID、嵌入式传感器等电子设备的无线供能。     

八胞合成X波段140W AlGaN/GaNHEMT的研究与应用

主要研究第三代半导体AlGaN/GaN功率管内匹配问题.采用8个2.5 mm GaN功率芯片设计、合成以及内匹配电路的测试,在漏极电压40 V,脉冲占空比10％,脉宽100μs的条件下进行功率匹配,实现了GaN功率HEMT在X波段8 GHz 140 W功率输出的内匹配电路,并使整个电路的输入、输出电路阻抗提升至50 Ω...     

19WC-波段MMIC多芯片合成功率放大器

报告了一个两级 C-波段功率单片电路的设计、制作和性能 ,该单片电路包括完全的输入端和级间匹配 ,输出端的匹配在芯片外实现 ,该放大器在 5.2～ 5.8GHz带内连续波工作 ,输出功率大于 36.6d Bm,功率增益大于 18.6d B,功率附加效率 34 % ,4芯片合成的功率放大器在 4 .7～ 5.3GHz带内 ,输出功率大于 4 2 .8d Bm( 19.0 W) ,功率增益大于 18.8d B,典型的功率附加效率为 34 %。     

大功率SiC MESFET内匹配技术及测试电路研究

采用管壳内匹配及外电路匹配相结合的方法,成功制作四胞合成大功率高增益SiC MESFET.优化了芯片装配形式,采用内匹配技术提高了器件输入、输出阻抗.优化了测试电路结构,成功消除了输入信号对栅极偏置电压的影响,提高了电路稳定性.四胞器件在脉宽为300 μs、占空比为10%脉冲测试时,2 GHz Vds=50 V脉冲输出功率为129 W(51.1 dBm),线性增益为13.0 dB,功率附加效率为31.4%.     

基于AlGaN/GaN HEMT的X波段内匹配功率合成放大器的设计

利用内匹配和功率合成技术设计了X波段AlGaN/GaN HEMT功率合成放大器.电路包含有四个AlGaN/GaN HEMT和制作在Al2O3陶瓷基片上的输入输出匹配电路.在偏置条件VDS=30 V,IDS=700 mA时8 GHz测出连续波饱和输出功率达到Pat=40 dBm(10 W),最大PAE=37.44%,线性增益9 dB.     

Ku波段20W AlGaN/GaN功率管内匹配技术研究

文章的主要目的是研究第三代半导体AlGaN/GaN功率管内匹配问题。以设计Ku波段20WGaN器件为例,研究了内匹配电路的设计、合成以及内匹配电路的测试,实现了GaN功率HEMT在Ku波段20W连续波输出功率的内匹配电路,并使整个电路的输入、输出电路阻抗提升至50Ω。最终所研制的AlGaN/GaNKu波段内匹配功率管在11.8GHz～12.2GHz频带内,输出功率大于20W。在12GHz功率增益大于5dB,功率附加效率29.07%,是目前国内关于GaN功率器件在Ku波段连续波输出的最高报道。     

一种改进LC匹配电路的Class-F射频功率放大器

为了改善传统F类射频功放LC输出匹配电路二阶阻抗不为零而造成的效率损害,提出了一种更加理想的新型LC输出匹配电路.根据双极型功放的特点,提出的新型LC输入匹配电路可以进一步提高输出效率.通过在Jazz SiGe BiCMOS 0.35μm工艺上的电路仿真设计表明,效率可以由63%增加到73%.工作在2.4GHz频段上的此F类功率放大器可以适用于采用非线性调制的射频发送端.     

一个采用0.18μm CMOS工艺的3－5GHz超宽带平坦增益低噪声放大器

本论文设计并实现了一个用于UWB脉冲体制的3-5GHz超宽带平坦增益的全差分低噪声放大器。在电路设计上,采用了一种增益平坦化技术,并且利用了串连建峰与并联建峰技术,分别实现了宽带的输入匹配与整个电路大的增益带宽积。同时,利用反馈技术,进一步拓展带宽和削减带内增益波动。此LNA才用SMIC 0.18um CMOS射频工艺流片验证。测试结果表面电路3dB带宽为2.4~5.5GHz,最高增益可达13.2dB,在3－5GHz的带内增益波动仅为＋/- 0.45dB,最低噪声系数为3.2dB．输入匹配性能良好,在2.9~5.4GHz范围内S11<-13dB,电路的输入P1dB为－11.7dBm@5GHz,电路采样1.8v供电,整个差分电路消耗电流9.6mA.     

A Ku band internally matched high power GaN HEMT amplifier with over 30%of PAE

正We report a high power Ku band internally matched power amplifier(IMPA) with high power added efficiency(PAE) using 0.3μm AlGaN/GaN high electron mobility transistors(HEMTs) on 6H-SiC substrate.The internal matching circuit is designed to achieve high power output for the developed devices with a gate width of 4 mm.To improve the bandwidth of the amplifier,a T type pre-matching network is used at the input and output circuits,respectively.After optimization by a three-dimensional electromagnetic(3D-EM) simulator,the amplifier demonstrates a maximum output power of 42.5 dBm(17.8 W),PAE of 30%to 36.4%and linear gain of 7 to 9.3 dB over 13.8-14.3 GHz under a 10%duty cycle pulse condition when operated at V_(ds) = 30 V and V_(gs)=—4 V.At such a power level and PAE,the amplifier exhibits a power density of 4.45 W/mm.     

High-performance 2 mm gate width GaN HEMTs on 6H-SiC with output power of 22.4 W @ 8 GHz

Optimized AlGaN/AlN/GaN high electron mobility transistors (HEMTs) structures were grown on 2-in. semi-insulating (SI) 6H-SiC substrate by metal–organic chemical vapor deposition (MOCVD). The 2-in. HEMT wafer exhibited a low average sheet resistance of 305.3 Ω/sq with a uniformity of 3.85%. The fabricated large periphery device with a dimension of 0.35 μm × 2 mm demonstrated high performance, with a maximum DC current density of 1360 mA/mm, a transconductance of 460 mS/mm, a breakdown voltage larger than 80 V, a current gain cut-off frequency of 24 GHz and a maximum oscillation frequency of 34 GHz. Under the condition of continuous-wave (CW) at 8 GHz, the device achieved 18.1 W output power with a power density of 9.05 W/mm and power-added-efficiency (PAE) of 36.4%. While the corresponding results of pulse condition at 8 GHz are 22.4 W output power with 11.2 W/mm power density and 45.3% PAE. These are the state-of-the-art power performance ever reported for this physical dimension of GaN HEMTs based on SiC substrate at 8 GHz.     

14W X波段AlGaN/GaN HEMT功率MMIC

报道了研制的SiC衬底AIGaN/GaN HEMT微带结构微波功率MMIC,芯片工艺采用凹槽栅场板结构提高AlGaN/GaNHEMTs的微波功率特性.S参数测试结果表明AlGaN/GaN HEMTs的频率特性随器件的工作电压变化显著.研制的该2级功率MMIC在9～11GHz带内30V工作,输出功率大于10W,功率增益大于12dB,带内峰值输出功率达到14.7W,功率增益为13.7dB,功率附加效率为23%,该芯片尺寸仅为2.0mm×1.1mm.与已发表的X波段AlGaN/GaN HEMT功率MMIC研制结果相比,本项工作在单位毫米栅宽输出功率和芯片单位面积输出功率方面具有优势.     

Fabrication and characterization of AlGaN/GaN HEMTs with high power gain and efficiency at 8 GHz

State-of-the-art AlGaN/GaN high electron mobility structures were grown on semi-insulating 4H-SiC substrates by MOCVD and X-band microwave power high electron mobility transistors were fabricated and characterized.Hall mobility of 2291.1 cm2/(V·s) and two-dimensional electron gas density of 9.954 × 1012 cm-2 were achieved at 300 K.The HEMT devices with a 0.45-μm gate length exhibited maximum drain current density as high as 1039.6 mA/mm and peak extrinsic transconduct-ance of 229.7 mS/mm.The fT of 30.89 GHz and fmax of 38.71 GHz were measured on the device.Load-pull measurements were performed and analyzed under (-3.5,28) V,(-3.5,34) V and (-3.5,40) V gate/drain direct current bias in class-AB,respectively.The uncooled device showed high linear power gain of 17.04 dB and high power-added efficiency of 50.56％ at 8 GHz when drain biased at (-3.5,28) V.In addition,when drain biased at (-3.5,40) V,the device exhibited a saturation output power dens-ity up to 6.21 W/mm at 8 GHz,with a power gain of 11.94 dB and a power-added efficiency of 39.56％.Furthermore,the low fmax/fT ratio and the variation of the power sweep of the device at 8 GHz with drain bias voltage were analyzed.     

X波段AlGaN/GaN HEMTs厂栅场板结构研究

基于SiC衬底成功研制X波段0.25um栅长带有г栅场板结构的AlGaN/GaN HEMT,对比T型栅结构器件,研究了г栅场板引入对器件直流、小信号及微波功率特性的影响.结果表明,г栅场板结构减小器件截止频率及振荡频率,但明显改善器件膝点电压和输出功率密度.针对场板长度分别为0.4、0.7、0.9、1.1 um,得出一定范围内增加场板长度,器件输出功率大幅度提高,并结合器件小信号模型提参结果分析原因.在频率8 GHz下,总栅宽1 mm,场板长度0.9um的器件,连续波输出功率密度7.11 W/mm,功率附加效率(PAE)35.31%,相应线性增益10.25 dB.     

A Ku-band 3.4 W/mm power AlGaN/GaN HEMT on a sapphire substrate

This Daper describes the first domestic Ku-band power AlGaN/GaN HEMT fabricated on a sapphire substrate.The device with a gate width of 0.5 mm and a gate length of 0.35 μm has exhibited an extrinsic current gain cutoff frequency of 20 GHz and an extrinsic maximum frequency of oscillation of 75 GHz.Under V_(DS)=30 V, CW operating conditions at 14 GHz,the device exhibits a linear gain of 10.4 dB and a 3-dB-gain-compressed output power of 1.4 W with a Dower added efficiency of 41%.Under pulse operating conditions,the linear gain is 12.8 dB and the 3-dB-compressed output power is 1.7 W The power density reaches 3.4 W/mm.     

具有平坦增益的X波段GaN单片功率放大器

A flat gain two-stage MMIC power amplifier with a 2.8 GHz bandwidth is successfully developed for X band frequency application based on a fully integrated micro-strip Al Ga N/Ga N HEMT technology on a semiinsulating Si C substrate. Designed with a binary-cluster matching structure integrated with RC networks and LRC networks, the developed power MMIC gets a very flat small signal gain of 15 d B with a gain ripple of 0.35 d B over 9.1–11.9 GHz at the drain bias of 20 V. These RC networks are very easy to improve the stability of used Ga N HEMTs with tolerance to the MMIC technology. Inside the frequency range of 9–11.2 GHz where the measurement system calibrated, the amplifier delivers a pulsed output power of 39 d Bm and an associated power added efficiency of about 20% at 28 V without saturation, as the available RF power is limited.     

11 GHz and 12 GHz multiwatt internal matching for power GaAs f.e.t.s

Multiwatt internal-matching techniques for multichip power GaAs f.e.t.s at 11 GHz and 12 GHz bands have been developed, adopting a lumped-element input circuit and a semidistributed output circuit. The internally matched device for the 11 GHz band exhibits 4 W power output with 3.4 dB associated gain, and the 12 GHz device 3.6 W power output with 3 dB associated gain.     

14W X波段AlGaN/GaN HEMT功率MMIC

报道了研制的SiC衬底AIGaN/GaN HEMT微带结构微波功率MMIC,芯片工艺采用凹槽栅场板结构提高AlGaN/GaNHEMTs的微波功率特性.S参数测试结果表明AlGaN/GaN HEMTs的频率特性随器件的工作电压变化显著.研制的该2级功率MMIC在9～11GHz带内30V工作,输出功率大于10W,功率增益大于12dB,带内峰值输出功率达到14.7W,功率增益为13.7dB,功率附加效率为23%,该芯片尺寸仅为2.0mm×1.1mm.与已发表的X波段AlGaN/GaN HEMT功率MMIC研制结果相比,本项工作在单位毫米栅宽输出功率和芯片单位面积输出功率方面具有优势.