Properties and pervaporation performance of poly(vinyl alcohol) membranes crosslinked with various dianhydrides

In this work, three dianhydrides with similar chemical structures, 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride (BTDA), 4,4′‐oxydiphthalic anhydride (ODPA), and pyromellitic dianhydride (PMDA), are employed for the crosslinking modification of poly(vinyl alcohol) (PVA) membranes for ethanol dehydration via pervaporation. The changes in crosslinking degree, surface hydrophilicity, and glass‐transition temperature are investigated and compared. Compared to the pure PVA membrane, all crosslinked membranes show higher fluxes but lower separation factors, because of the higher fractional free volume and the lower hydrophilicity by the crosslinking of the PVA matrix, respectively. In addition, all crosslinked PVA membranes exhibit similar flux, and the separation factor presents a decreasing order of PVA/PMDA‐2 > PVA/ODPA‐2 > PVA/BTDA‐2, which is in the reverse order of their hydrophilicity, probably because of the reduction in the swelling resistance. With the PMDA content increasing from 0.01 to 0.04 mol/(kg PVA) in the PVA/PMDA crosslinked membranes, the crosslinking degree is enhanced and the hydrogen bonding is weakened, resulting in a flux increase from 120.2 to 190.8 g m^?2 h^?1, but the separation factor declines from 306 to 58. This work is believed to provide useful insight on the chemical modification of PVA membranes for pervaporation and other membrane‐based separation applications. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 46159.     

Formation of honeycomb films based on a soluble polyimide synthesized from 2,2′‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]hexafluoropropane dianhydride and 3,3′‐dimethyl‐4,4′‐diaminodiphenylmethane

A soluble polyimide was synthesized from 2,2′‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]propane dianhydride (BPADA) and 3,3′‐dimethyl‐4,4′‐diaminodiphenylmethane (DMMDA) by a two‐step method, and it had good solubility both in strong bipolar solvents and in common low‐boiling‐point solvents. The BPADA–DMMDA polyimide was dissolved in chloroform (CHCl₃) and cast onto a glass substrate in a humid atmosphere. The BPADA–DMMDA/CHCl₃ solution easily formed honeycomb films. Some affecting factors, such as the polymer solution concentration, atmospheric humidity, and solvent volatility, were tested. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Polyimide foams with ultralow dielectric constants

To explore ultralow dielectric constant polyimide, the crosslinked polyimide foams (PIFs) were prepared from 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA), 4,4′‐oxydianiline (ODA), and 2,4,6‐triaminopyrimidine (TAP) via a poly(ester–amine salt) (PEAS) process. FTIR measurements indicated that TAP did not yield a negative effect on imidization of PEAS precursors. SEM measurement revealed the homogeneous cell structure. Through using TAP as a crosslinking monomer, the mechanical properties of PIFs could be improved in comparison with uncrosslinked BTDA/ODA based PIF. The crosslinked PIFs still exhibited excellent thermal stability with 5% weight loss temperatures higher than 520°C. In the field with frequency higher than 100 Hz, the dielectric constants of the obtained PIFs ranged from 1.77 to 2.4, and the dielectric losses were smaller than 3 × 10^?2 at 25–150°C. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 1734–1740, 2006     

Solvent-resistant ultrafine nonwoven fibrous membranes by ultraviolet-assisted electrospinning of organo-soluble photosensitive polyimide resin

An ultraviolet-assisted electrospinning (UVAES) method was investigated to improve the solvent stability of soluble polyimide (PI) electrospun ultrafine fibrous membranes (UFMs) to assist in the development of fibrous polymeric materials with improved resistance to harsh environmental conditions and to expand the potential applications for such soft filaments. A preimidized soluble negative photosensitive polyimide (PSPI) was synthesized via an one-step thermal polycondensation from 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA) and 1,1′-bis(4-amino-3,5-dimethylphenyl)-1-(3′-trifluoromethylphenyl)methane (TFMDA). The PI resin was then fabricated into UFMs by both conventional electrospinning (ES) and UVAES with N,N-dimethylacetamide (DMAc) as the solvent. During spinning, photo crosslinking reaction occurred, accompanied by simultaneous micro-jets of PI-UV ultrafine fibers in the UVAES procedure. This created fibers that were thermally stable at higher than 500°C, reflection over 77% of the 457-nm- wavelength light, whiteness index (WI) higher than 83, and enhanced solvent resistance in DMAc. Generally speaking, compared with the PI UFMs fabricated by conventional ES procedure, the PI-UV UFMs obtained by the newly-developed UVAES procedure showed much superior solvent resistance, comparable thermal stability, slightly decreased optical reflectance and WI values, and reduced fiber diameters. These properties are of great value to future applications in microelectronics and wearable technology.     

The pyrolysis behaviors of polyimide foam derived from 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride/4,4′‐oxydianiline

The thermal stability and pyrolysis behaviors of polyimide (PI) foam derived from 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride (BTDA)/4,4′‐oxydianiline (4,4′‐ODA) in air and in nitrogen were studied. The decomposition products of PI foam were analyzed by thermogravimetry‐Fourier transform infrared spectroscopy (TG‐FTIR). Several integral and differential methods reported in the literatures were used in decomposition kinetics analysis of PI foam. The results indicated that the PI foam was easier to decompose in air than in nitrogen, with ～ 55% residue remaining in nitrogen versus zero in air at 800^oC. The main pyrolysis products were CO₂, CO, and H₂O in air and CO₂, CO, H₂O, and small organic molecules in nitrogen. The different dynamic methods gave similar results that the apparent activation energies, pre‐exponential factors, and reaction orders were higher in nitrogen than those in air. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Functionalized KIT‐6/Terpolyimide composites with ultra‐low dielectric constant

Polyimides with low dielectric constants are important raw materials for the fabrication of flexible printed circuit boards and other microelectronic applications. As creation of voids in polyimide matrix could decrease dielectric constant, in this study mesoporous KIT‐6, synthesized hydrothermally, was functionalized with 3‐aminopropyltriethoxysilane (APTS) and mixed with 4,4′‐oxydianiline (ODA) in the synthesis of terpoly(amic acid) using 3,3′,4,4′‐biphenyldianhydride (BPDA), 3,3′,4,4′‐oxydiphthalic dianhydride (ODPA) and 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA) and subsequently stage‐cured to obtain APTS‐KIT‐6/Terpolyimide composites (APTS‐KIT‐6/TPI). The asymmetric and symmetric vibrations of imide O?C? N? C?O groups of APTS‐KIT‐6/TPI composites showed their peaks at 1772 and 1713 cm^?1. The dielectric constant decreased with the increase in KIT‐6 loading from 2 to 4%, but increased at higher loadings, and at 4% loading it was 1.42. Its tensile strength (103 MPa), tensile modulus (2.5 GPa), and percentage elongation (8.2) and high thermal stability (>540°C) were also adequate for application in microelectronics such as flexible printed circuits. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40508.     

Polyimide/organo‐montmorillonite nanocomposites: A comparative study of the organoclays modified with aromatic diamines

Six organophilic clays have been obtained through cation‐exchange between sodium montmorillonite (Na^+‐Mt) and the hydrochloride salts of aromatic diamines (DA1–6). The results obtained by thermogravimetric analysis (TGA) showed that the organophilic clays start to decomposition within 150–340°C, which shows that they are thermally stable compared with conventional montmorillonite modified with aliphatic long‐chain quaternary alkyl ammonium salts. The highest thermal stability and interlayer basal spacing were observed for the organoclay obtained from 3,3′‐sulfonyl dianiline (DA2), and therefore it was chosen for preparing clay/polymer nanocomposite materials (CPN). Polyimide/clay nanocomposite materials consisting of benzophenone‐3,3′,4,4′‐tetracarboxylic dianhydride (BTDA) and 2‐(5‐(3,5‐diaminophenyl)‐1,3,4‐oxadiazole‐2‐yl)pyridine (POBD) were also obtained by an in situ polymerization reaction through a thermal imidization. DA2‐Mt was used as filler at different concentrations. Both the thermal stability and the glass transition temperature (T_g) are increased with respect to pure polyimide (PI) at low clay loadings. At high clay concentrations, the organoclay particles make aggregate and as results of this phenomena T_g and thermal stability are decreased. POLYM. COMPOS., 36:613–622, 2015. © 2014 Society of Plastics Engineers     

Preparation and properties of soluble copolysulfoneimide and performance of solvent‐resistant ultrafiltration membrane

Soluble copolysulfoneimides were synthesized by thermal two‐step method in solution of N‐methyl‐2‐pyrrolidone. The used aromatic diamines were bis[4‐(3‐aminophenoxy)phenyl]sulfone (BAPS‐m) and 3,3′‐diaminosulfone, and dianhydrides were pyromellitic dianhydride, 4,4′‐oxyphthalic anhydride, and 3,3′,4,4′‐diphenylsulfone tetracarboxylic dianhydride. The molar ratio of diamines was changed to reduce the content of BAPS‐m. The thermal and mechanical properties of polyimides were investigated. The polyimide ultrafiltration membrane with molecular weight cut‐off of 10 kDa could be successfully prepared by phase‐inversion method. Various solvent (water, alcohols, acetone, and hexane) fluxes were measured to investigate solvent‐resistance and membrane behavior during solvent permeation. The activation energy relationship between hexane flux and viscosity with temperature was also studied. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 85: 1024–1030, 2002     

Preparation and properties of poly(amide acid) gels

Poly(amide acid) gels were first synthesized by the reaction of a poly(amide acid) with diisocyanates as crosslinking agents. Poly(amide acid) was synthesized from 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA) and bis(4-amino-3-ethylphenyl)methane (DEDPM). From the change in the IR spectra, the key process of crosslinking was determined to be the decarboxylation from the reaction product of the carboxyl group and isocyanate group. The gels markedly change their volume with the composition change of NMP–water mixed solvent. Thermal properties of the poly(amide acid) gels are also studied.     

Polysiloxaneimide membranes for removal of VOCs from water by pervaporation

For the separation of volatile organic compounds (VOCs) from water by pervaporation, three polysiloxaneimide (PSI) membranes were prepared by polycondensation of three aromatic dianhydrides of 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride (6FDA), 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA), and pyromellitic dianhydride (PMDA) with a siloxane‐containing diamine. The PSI membranes were characterized using ¹H‐NMR, ATR/IR, DSC, XRD, and a Rame‐Hart goniometer for contact angles. The degrees of sorption and sorption selectivity of the PSI membranes for pure organic compounds and organic aqueous solutions were investigated. The pervaporation properties of the PSI membrane were investigated in connection with the nature of organic aqueous solutions. The effects of feed concentration, feed temperature, permeate pressure, and membrane thickness on pervaporation performance were also investigated. The PSI membranes prepared have high pervaporation selectivity and permeation flux towards hydrophobic organic compounds. The PSI membranes with 150‐μm thickness exhibit a high pervaporation selectivity of 6000–9000 and a high permeation flux of 0.031–0.047 kg/m² h for 0.05 wt % of the toluene/water mixture. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 77: 2691–2702, 2000     

Copolyimides using 3-phenyl tricyclo [6,2,2,02,7] dodeca-2,11-ene-5,6,9,10-tetracarboxylic dianhydride as a thermosetting functional group: Preparation,characterization, and thermal curing chemistry

Copolyimides were prepared by the reaction of 4,4-oxydianiline (ODA) with two dianhydrides, namely, 3,3′,4,4′-benzophenone tetracarboxylic dianhydride (BTDA) and 3-phenyl tricyclo [6,2,2,0^2,7] dodeca-2,11-ene-5,6,9,10-tetracarboxylic dianhydride (PTDDA). ODA and BTDA first reacted in DMAc solvent, then following the addition of PTDDA, which was used as a thermosetting functional group in the polymer's backbone. Two homopolyimides prepared from the reaction of ODA with BTDA or PTDDA were also synthesized. The properties of homopolyimides such as solubility, thermal properties, and thermal curing mechanism were compared to those of copolyimides. The results showed that the tricyclic structure of the PTDDA unit underwent a reverse Diels-Alder reaction at near 300°C and it controlled the thermal behaviors of copolyimides.     

Synthesis and properties of ultraviolet‐curable resins via a thio–ene (thiol and allyl) addition reaction

Benzophenone diallyl ester (I) and benzophenone tetraallyl ester (II) based on 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride (BTDA) with allyl alcohol (AAL) were synthesized. Glycidyl methacrylate (GMA) was added to I and formed diallyl diglycidyl methacrylate (III). These BTDA‐based allyl‐containing compounds (II and III) reacted with 1,4‐butanedithiol and 4,4′‐thiol‐bisbenzene‐thiol to produce ultraviolet (UV)‐curable resins via a thio–ene addition reaction. The ester (III) was cured easily when exposed to UV or sunlight radiation without any photoinitiator and only required a lower thermal curing temperature. The diallyl ester (I) and tetraallyl ester (II) required the addition of benzophenone to increase the photosensitivity, which reduced the exposition time. These resins used AAL as a monomer to successfully reduce the oxygen effect of the photocuring. The resin BTDA–2Allyl–2GMA had a glass‐transition temperature of 166°C and a hardness of 6H. The resultant UV‐curable coatings had excellent hardness, chemical resistance, adhesion, and tensile properties. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 86: 1878–1885, 2002     

Gas Permeation Properties of Copolyimides from 1,4-Bis(3,4-dicarboxyphenoxy)benzene Dianhydride and 2,2-Bis(3,4- dicarboxyphenyl)hexafluoroisopropane Dianhydride

A series of aromatic copolyimides was prepared from 1,4-bis(3,4-dicarboxyphenoxy)benzene dianhydride (HQDPA) and 2,2-bis(3,4-dicarboxy-phenyl)hexafluoroisopropane dianhydride (6FDA) with 3,3′-dimethyl-4,4′-methyl-ene dianiline (DMMDA) by a chemical imidization. The gas permeability coefficients of the copolyimides to H₂, CO₂, O₂, N₂ and CH₄ were measured under 7atm. pressure. The fractional free volume of 6FDA–DMMDA is larger than that of HQDPA–DMMDA, while the chain segmental mobility of 6FDA–DMMDA is lower than that of HQDPA–DMMDA. The gas permeability of 6FDA–DMMDA is much higher than that of HQDPA–DMMDA but the perm-selectivity of 6FDA–DMMDA for H₂, CO₂, O₂, N₂ over CH₄ is lower than that of HQDPA–DMMDA. The experimental values of the gas permeability coefficients of the copolyimides are in satisfactory agreement with the values estimated from the gas permeability coefficients of the constituent homopolyimides and their weight fractions. © of SCI.     

Effect of montmorillonite on thermal and moisture absorption properties of polyimide of different chemical structures

The thermal properties and the moisture absorption of three types of polyimide/montmorillonite nanocomposite were investigated: 3,3′,4,4′‐biphenyltetracarboxylic dianhydride‐4,4′‐oxydianiline (BPDA‐ODA); pyromellitic dianhydride‐ODA (PMDA‐ODA); and 3,3′,4,′‐benzophenone tetracarboxylic dianhydride‐ODA (BTDA‐ODA). The inhibition effect on in‐plane coefficients of thermal expansion (CTE) and moisture absorption of these polyimide nanocomposites by layered silicates from montmorillonite was found to decrease with the crystallinity in the pristine polyimides. The largest reduction, 30% in in‐plane CTE occurred in the case of amorphous BTDA‐ODA containing 5 wt % montmorillonite as compared with that of pure BTDA‐ODA, while the reduction in in‐plane CTE was 20% for the case of semicrystalline BPDA‐ODA. The maximum reduction in moisture absorption, 43%, also took place for the case of 3/97 ODA‐Mont/BTDA‐ODA as compared with that of pure BTDA‐ODA, whereas the semicrystalline 1/99 PPD‐Mont/BPDA‐ODA showed a 30% reduction as compared with that of pure BPDA‐ODA. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 81: 1742–1747, 2001     

Synthesis and properties of ultralow dielectric constant porous polyimide films containing trifluoromethyl groups

In this research, a series of porous copolyimide (co‐PI) films containing trifluoromethyl group (CF₃) were facilely prepared via a phase separation process. The co‐PI were synthesized by the reaction of benzophenone‐3,3′,4,4′‐tetracarboxylic dianhydride (BTDA) with two diamines of 4,4′‐diaminodiphenyl ether (ODA) and 3‐trifluoromethyl‐4,4'‐diaminodiphenyl ether (FODA) with various molar ratios. The flexible and tough porous co‐PI films with about 300 μm thickness and 8～10 μm average diameter could be obtained by solution casting conveniently. The thermal properties of the obtained porous co‐PI films were excellent with a glass transition temperature at 270 °C ～ 280 °C and only 5% weight loss in temperature from 530 °C to 560 °C under nitrogen atmosphere. In addition, the dielectric and hydrophobic properties of porous co‐PI films were remarkably improved owing to the presence of trifluoromethyl groups (CF₃) in the polymer chains. Moreover, our synthesized porous co‐PI films also showed good mechanical properties. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44494.     

Organosoluble polyimides derived from asymmetric 2‐substituted‐and 2,2′,6‐trisubstituted‐4,4′‐oxydianilines

We report a new method for the preparation of asymmetric diamines using 4,4′‐oxydianiline (4,4′‐ODA) as the starting material. By controlling the equivalents of bromination agent, N‐bromosuccinimide, we were able to attach bromide and phenyl substituents at the 2‐ or 2,2′,6‐positions of 4,4′‐ODA. Thus, four new asymmetric aromatic diamines, 2‐bromo‐4,4′‐oxydianiline (6), 2,2′,6‐tribromo‐4,4′‐oxydianiline (7), 2‐phenyl‐4,4′‐oxydianiline (8) and 2,2′,6‐triphenyl‐4,4′‐oxydianiline (9), were synthesized by this method. Their structural asymmetry was confirmed using ¹H NMR spectroscopy. Asymmetric polyimides (PI10–PI13) were prepared from these diamines and three different dianhydrides (pyromellitic dianhydride (PMDA), 3,3′,4,4′‐biphenyltetracarboxylic dianhydride and 2,2‐bis(3,4‐dicarboxyphenyl)hexafluoropropane dianhydride) in refluxing m‐cresol. The formed polyimides, except PI10a derived from 6 and PMDA, were all soluble in m‐cresol without premature precipitation during polymerization. These polyimides with inherent viscosity of 0.41–0.96 dL g^?1, measured at a concentration of 0.5 g dL^?1 in N‐methyl‐2‐pyrrolidone at 30 °C, can form tough and flexible films. Because of the structural asymmetry, they also exhibited enhanced solubility in organic solvents. Especially, polyimides PI11a and PI13a derived from 7 and 9 with rigid PMDA were soluble in various organic solvents at room temperature. The structural asymmetry of the prepared polyimides was also evidenced from ¹H NMR spectroscopy. In the ¹H NMR spectrum of PI11a, the protons of pyromellitic moiety appeared in an area ratio of 1:2:1 at three different chemical shifts, which were assigned to head‐to‐head, head‐to‐tail and tail‐to‐tail configurations, respectively. These polyimides also exhibited good thermal stability. Their glass transition temperatures ranged from 297 to 344 °C measured using thermal mechanical analysis. © 2013 Society of Chemical Industry     

Effect of silanes on the morphology,hydrophobicity, and dynamical mechanical properties of polyimide/silica hybrid membranes

Polyimide (PI)/silica hybrid membranes with high contact angles were prepared through the in situ sol–gel process. The precursor, poly(amic acid) with controlled block chain length, was synthesized using 4,4′‐diaminodiphenyl ether (ODA), 3,3′,4,4′‐benzophenone‐tetracarboxylic dianhydride (BTDA) and 3‐aminopropyl‐trimethoxysilane (APrTMOS) or 3‐aminopropyldimethylethoxysilane (APDiMOS). And then, phenyltrimethoxysilane (PTS) or tetramethoxysilane (TMOS) or methyltrimethoxysilane (MTrMOS) was respectively, added to the above polyamic acid and mixed thoroughly. Following curing reaction, the PI/silica hybrid membranes with different cross‐linkages, silica content, and hydrophobic properties were prepared. The effect on the formation of PI imide ring during imidization reaction is increased as the increase of silanes content and characterized by frequency shiftment and absorbance ratio of Fourier transform infrared (FTIR) measurements. All the hybrid membranes show high transparency though with high silica contents. The storage modulus, tan δ, and damping intensity by DMA measurements are all correlated with silane content or block chain length. And all these membranes with silane content possess high contact angle as compared to pure PI without any silanes added and the contact angles increase with increasing the silane content. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Dynamics of solvent diffusion in an aromatic polyimide

Diffusion behaviors of two polyimides (PIs) synthesized from 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA), 4,4′-oxydianiline (ODA), and 4,4′-diaminodiphenylsulfone (DDS) were investigated by the gravimetric method. The weight uptake of penetrants (solvents) was nearly proportional to the exposure time in solvent. This phenomenon was considered as the Case II diffusion (non-Fickian) mechanism. Two PI films had an affinity to N-methyl-2-pyrrolidinone (NMP) rather than to dimethylsulfoxide (DMSO). The solubility parameter differences between two polyimides and NMP are less than 5, whereas that between polyimides and DMSO are greater than 5, as calculated by Hoy's group contribution method. The solvent uptake of anisotropic films contributed to an increase in the thickness. The swollen amount of anisotropic films increased with the swelling temperature but tended to decrease with the imide content and the thickness of the anisotropic films. Isotropic films of two PIs did not swell in both NMP and DMSO. © 1994 John Wiley & Sons, Inc.     

Facile preparation of ODPA‐ODA type polyetherimide‐based carbon membranes by chemical crosslinking

A chemical crosslinking protocol was developed to prepare carbon membranes from 3,3′,4,4′‐oxydiphthalic dianhydride‐4,4′‐oxydianiline (ODPA–ODA) type polyetherimide on the support of phenolic resin sheets. The effects of support pretreatment, membrane‐coating methods and crosslinking protocols on the resultant carbon membranes were investigated. The microstructure, functional group evolution, thermal stability, mechanics, morphology, and gas separation performance of samples were characterized by XRD, FTIR, TGA, mechanical testing technique, and gas permeation technique, respectively. Results have shown that the chemical crosslinking is more beneficial than the popular thermal crosslinking protocol to fabricate supported carbon membranes for the advantage of simple preparation process. In addition, spin‐coating is superior to drop‐coating in terms of good membrane formation on the support. Under the preferred preparation conditions of crosslinker ethylene glycol usage at 10 wt % and spin‐coating, supported carbon membranes can be obtained with good hydrogen separation performance. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44889.     

Preparation and characterization of 3,3′,4,4′-benzophenone tetracarboxylic dianhydride-pyromellitic diahydride alternating polyimides

Four kinds of 3,3′,4,4′-benzophenone tetracarboxylic dianhydride (BTDA)-pyromelliitic dianhydride (PMDA) alternating polyimide (BTDA-PMDA API) were obtained by reacting 1 mol BTDA with 2 mol diamines to form BTDA chain-extended diamines (BTDA CED), followed by the addition of 1 mol PMDA to yield the BTDA-PMDA alternating polyamic acids (BTDA-PMDA APA), and finally by imidizing them thermally. BTDA CED were characterized by elemental analysis, infrared (IR), and ¹H-NMR spectroscopy. The structures of BTDA-PMDA APA and BTDA-PMDA API were investigated by IR and ¹H-NMR spectroscopy, and their thermal properties and interfacial tension were also studied. Furthermore, the characteristic properties of BTDA-PMDA API were compared with their corresponding homopolyimides from BTDA (BTDA HPI) and from PMDA (PMDA HPI). It was found that the alternating condensation polymerization is an effective method to modify polyimides interfacial tension with a small influence on the thermal stability. © 1997 John Wiley & Sons, Inc. J Appl Polym Sci 64: 1585–1593, 1997