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1.
Novel polyimides were successfully synthesized through copolymerization of diamine monomers p‐phenylenediamine (p‐PDA) and 4,4'‐diaminodiphenylmethane (MDA) with different proportions and 2,3,3',4'‐biphenyltetracarboxylic dianhydride (a‐BPDA) using 4‐phenylethynylphthalic anhydride (4‐PEPA) as an end‐capping agent. The melt rheological properties, thermal properties, and crystallinity of PI oligomers were investigated via rheometer, dynamic mechanical analysis (DMA), thermal gravimetric analysis (TGA), differential scanning calorimetry (DSC), and X‐ray diffraction (XRD). The results indicate that melt viscosity and solubility of the PI oligomers were improved, but the glass transition temperature (Tg) and crystallinity decreased with the increasing molar ratio of MDA. PI oligomer 3 with the molar ratio of MDA/p‐PDA = 2/1 shows a lower minimum melt viscosity (66 Pa.s) at 313°C and better solubility in aprotic solvents. The corresponding PI‐3 exhibits a high glass transition temperature of 406°C and excellent thermal stability. This copolyimide shows good processability and thermal properties, and could become a good candidate of matrix resins for high performance composites in aerospace field. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 41303.  相似文献   

2.
Formaldehyde resins (FR) at 1/1/2 molar ratios of monomers (Cl‐phenol/amino monomers/p‐formaldehyde) were synthesized under acid catalysis. The obtained resins were characterized using elemental analysis, FTIR and RMN spectroscopic methods, being used as crosslinking agents for epoxy resin formulations. The curing of epoxy resins with FR were investigated. The glass transition temperature (Tg) and decomposition behavior of crosslinked resins were studied by differential scanning calorimetry (DSC) and thermogravimetric (TGA) techniques. All DSC scans show two exothermic peaks, which implied the occurrence of cure reactions between epoxy ring and amine or carboxylic protons, in function of chemical structures of FR. The crosslinked products showed good thermal properties, high glass transitions, and low water absorption. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2010  相似文献   

3.
A novel bismaleimide (DOPO‐BMI) with unsymmetrical chemical structure and DOPO pendant group has been prepared. The particular molecular structure makes DOPO‐BMI show an intrinsic amorphous state with a Tg about 135°C and excellent solubility in most organic solvents, which is beneficial to the processability of bismaleimide composite materials. A series of bismaleimide‐triazine (BT) resins have been prepared based on DOPO‐BMI and 2,2‐bis(4‐cyanatophenyl)propane at various weight ratios. The prepared BT resins show outstanding solubility in organic solvent and low viscosity about 10–671 mPa s at 180°C. The cured BT resins exhibit high glass transition temperature (Tg) over 316°C. As the weight ratio of DOPO‐BMI increases to 80% (BT80), the Tg can rise to 369°C (tan δ). The cured BT resins also show good thermal stability with the 5% weight loss temperature over 400°C under both nitrogen and air atmosphere. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133, 42882.  相似文献   

4.
2,4,6-Tri(4-propargyloxy-phenyl)pyridine(POPP) was made from 2,4,6-tri (4-hydroxyphenyl)pyridine(HPP) and propargyl bromide. The chemical structures of POPP and HPP were well characterized by means of FTIR, 1H-NMR, 13C-NMR, and elemental analysis. Novel polytriazole resins (P-PTA resins) were prepared from POPP and azide compounds via 1, 3-dipolar cycloaddition reaction and characterized by solubility, FTIR, DSC, and TGA analyses. The P-PTA resins show good solubility in common solvents. The resins could be cured at 80 °C. The glass transition temperature (Tg) and the 5% weight loss temperature (Td5) of the cured P-PTA-33 resin arrive at 310 and 365 °C in nitrogen atmosphere, respectively.  相似文献   

5.
A series of novel naphthoxazine monomers containing allyl functionalities were synthesized from the reaction of 1‐naphthol, 2‐naphthol, and 1,5‐dihdroxynaphthalene with allylamine and formalin. Another series of naphthoxazines were similarly prepared by using aniline instead of allylamine for comparison. The chemical structures of these novel monomers were confirmed by IR, 1H NMR, and elemental analysis. DSC of the aniline‐ based naphthoxazines showed an exotherm due to the ring‐opening polymerization of oxazine. For allylamine‐based naphthoxazines, two exotherms were observed. The first exotherm is attributed to the thermal crosslinking of the allyl group and the second is due to the ring‐ opening polymerization of oxazine. The thermal cure of the allylamine‐based naphthoxazine monomers gave thermoset resins with novel structure comprising of polynaphthoxazine with extended network via the polymerization of allyl functionalities. Dynamic mechanical analyses and thermogravimetric analyses showed that the thermosets derived from allyl‐ functional naphthoxazines have high Tg's and stable storage moduli to higher temperature as well as better thermal stability than that of aniline‐based naphthoxazines. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 3769–3777, 2006  相似文献   

6.
In this article, 2,2′‐bis[4‐(4‐maleimidephen‐oxy)phenyl)]propane (BMPP) resin and N,N‐4,4′‐bismaleimidodiphenylmethyene (BDM) resin blends were modified by diallyl bisphenol A (DABPA). The effects of the mole concentration of BMPP on mechanical properties, fracture toughness, and heat resistance of the modified resins were investigated. Scanning electron microscopy was used to study the microstructure of the fractured modified resins. The introduction of BMPP resin improves the fracture toughness and impact strength of the cured resins, whose thermal stabilities are hardly affected. Dynamic mechanical analysis shows that the modified resins can maintain good mechanical properties at 270.0°C, and their glass transition temperatures (Tg) are above 280.0°C. When the mole ratio of BDM : BMPP is 2 : 1(Code 3), the cured resin performs excellent thermal stability and mechanical property. Its Tg is 298°C, and the Charpy impact strength is 20.46 KJ/m2. The plane strain critical stress intensity factor (KIC) is 1.21 MPa·m0.5 and the plane strain critical strain energy release rate (GIC) is 295.64 J/m2. Compared with that of BDM/DABPA system, the KIC and GIC values of Code 3 are improved by 34.07% and 68.10%, respectively, which show that the modified resin presented good fracture toughness. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40395.  相似文献   

7.
Two phosphonate‐containing bismaleimide (BMI) [(4,4′‐bismaleimidophenyl)phosphonate] monomers with different melting temperatures and similar curing temperatures were synthesized by reacting N‐hydroxyphenylmaleimide with two kinds of dichloride‐terminated phosphonic monomers. The BMI monomers synthesized were identified with 1H‐, 13C‐, and 31P‐nuclear magnetic resonance (NMR) spectroscopy and elemental analysis. The phosphonate‐containing BMI monomers react with a free‐radical initiator to prepare phosphonate‐containing BMI polymers and also with various aromatic diamines to prepare a series of polyaspartimides as reactive flame retardants. The polymerization degrees of polyaspartimides depend on the alkalinity and nucleophility of diamines as chain extenders. Differential scanning calorimetry (DSC) and thermogravimetry analysis (TGA) were used to study the thermal properties of the phosphonate‐containing BMI resins such as the melting temperature, curing temperature, glass transition temperature (Tg), and thermal resistance. All the phosphonate‐containing BMI resins, except the BMI polymers, have a Tg in the range of 210–256°C and show 5% weight loss temperatures (T5%) of 329–434 and 310–388°C in air and nitrogen atmospheres, respectively. The higher heat resistance of cured BMI resin relative to the BMI polymer is due to its higher crosslinking density. Since the recrosslinking reactions of BMI polymers and polyaspartimides occur more easily in an oxidation environment, their thermal stabilities in air are higher than are those in nitrogen gas. In addition, the thermal decomposition properties of polyaspartimides depend on the structures and compositions of both the diamine segments and the BMI segments. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 1919–1933, 2002  相似文献   

8.
A novel polyhedral oligomeric octadiphenylsulfonylsilsesquioxane (ODPSS) was synthesized from octaphenylsilsesquioxane and benzenesulfonyl chloride via a Friedel–Crafts reaction with a high yield. ODPSS was identified by Fourier transform infrared spectroscopy, 1H‐NMR, 13C‐NMR, 29Si‐NMR, matrix‐assisted laser desorption/ionization time‐of‐flight mass spectrometry (MALDI–TOF MS), wide‐angle X‐ray diffraction, and elemental analysis to be a kind of polyhedral oligomeric silsesquioxane of a T8R8 structure. ODPSS exhibited superior thermal stability according to thermogravimetric analysis. Its initial thermal decomposition temperature (Tonset) was at 491°C in air and 515°C in nitrogen. Thermal and mechanical properties of epoxy resin (EP) composites with ODPSS added were studied by differential scanning calorimetry and tensile testing. The results show that the incorporation of ODPSS at a low loading content not only improved the glass‐transition temperature of the EP composites but also enhanced their tensile strength. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40892.  相似文献   

9.
N‐(4‐hydroxyphenyl)maleimide was melt‐blended with the glycidyl ether of bisphenol‐A and various mole percentages of 4, 4′‐(diaminodiphenylsulfone) bismaleimide. The cure behaviour of the resins was evaluated by differential scanning calorimetry (DSC) and dynamic mechanical thermal analysis (DMTA). The blends showed distinct reductions in the onset of cure (To) and peak exothermic (Texo) temperatures. The blends cured at low temperatures exhibited glass transition temperatures (Tgs) higher than the cure temperatures. The cured blends showed high moduli, glass transition temperatures in excess of 250 °C and good thermal stabilities up to 400 °C. Copyright © 2005 Society of Chemical Industry  相似文献   

10.
A series of phthalonitrile terminated polyaryl ether nitrile oligomers containing fluorene group (BPPENs) were synthesized and cured in the presence of bis[4‐(4‐aminophenoxy)phenyl]sulfone. Additionally, the quartz fiber reinforced composites were prepared by hot‐pressing process. The structure of oligomers was characterized by 1H‐NMR and GPC. The curing behavior of BPPENs was studied by DSC, IR, and rheological tests in detail. Thermal stability and mechanical properties were also investigated. The results showed that the oligomers showed excellent solubility. BPPENs could be dissolved in common solvents at ambient temperature. TGA and DMA results showed that the cured polymer and composites possessed excellent thermal properties with high residual weight of 72.4% at 1000 °C and 5% thermal degradation temperature (T5%) of 548 °C under inert atmosphere. The bending strength of quartz fiber reinforced composites was about 500 MPa, exhibiting good mechanical property. The products could be used as high performance polymers or a modifier for heat‐resistant resins. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 46606.  相似文献   

11.
Amino‐functionalized multiwalled carbon nanotubes (MWCNT‐NH2s) as nanofillers were incorporated into diglycidyl ether of bisphenol A (DGEBA) toughened with amine‐terminated butadiene–acrylonitrile (ATBN). The curing kinetics, glass‐transition temperature (Tg), thermal stability, mechanical properties, and morphology of DGEBA/ATBN/MWCNT‐NH2 nanocomposites were investigated by differential scanning calorimetry (DSC), thermogravimetric analysis, a universal test machine, and scanning electron microscopy. DSC dynamic kinetic studies showed that the addition of MWCNT‐NH2s accelerated the curing reaction of the ATBN‐toughened epoxy resin. DSC results revealed that the Tg of the rubber‐toughened epoxy nanocomposites decreased nearly 10°C with 2 wt % MWCNT‐NH2s. The thermogravimetric results show that the addition of MWCNT‐NH2s enhanced the thermal stability of the ATBN‐toughened epoxy resin. The tensile strength, flexural strength, and flexural modulus of the DGEBA/ATBN/MWCNT‐NH2 nanocomposites increased increasing MWCNT‐NH2 contents, whereas the addition of the MWCNT‐NH2s slightly decreased the elongation at break of the rubber‐toughened epoxy. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40472.  相似文献   

12.
4,4′-Methylenedianiline (MDA) is utilized to produce high temperature epoxy resins as well as other high-performance composites; however, MDA is a known carcinogen and liver toxicant. Novel dianilines derived from both petroleum and biomass with different quantities and types of methyl and methoxy substituents on the aromatic ring were prepared and studied to reduce toxicity and carcinogenic aspects of the resulting material while maintaining thermal and mechanical integrity. These dianilines were primarily prepared by coupling commercial anilines using paraformaldehyde under acidic conditions. Another dianiline was prepared by nitration of bisphenol A and subsequent reduction of the nitrates to amines. Structure–toxicity relationships indicate that multiple substituents on the aromatic ring are necessary to reduce the toxicity of the dianiline. Epoxy-amine resins were prepared by blending the dianilines with 50 wt % Epikure W liquid amine curing agent and mixing with a stoichiometric amount of EPON 828 epoxy resin. Methoxy and methyl substituents increase the melting point of the dianilines by as much as 65 °C, thereby worsening the processing of these monomers as liquid thermoset resins. Structure–property relationships show that the addition of a methoxy group to the aromatic ring and moving the amine from the 4,4′ position on the dianiline reduces the glass transition temperature (T g) by approximately 10 °C. A single methyl group has little effect on T g and two methyl groups increase the T g only when both are ortho to the amine, yet this causes a large 14 °C increase in T g. Thermal degradation profiles are not significantly affected by the dianiline. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 137, 48707.  相似文献   

13.
A novel bisphthalonitrile monomer containing allyl groups (DBPA‐Ph) had been synthesized via the reaction of diallyl bisphenol A (DBPA) and 4‐nitrophthalonitrile. The chemical structure of DBPA‐Ph was confirmed by 1HNMR, 13CNMR, and FTIR spectroscopy. The curing behaviors and processability of DBPA‐Ph were studied by differential scanning calorimetry (DSC) and dynamic rheological analysis. The monomer manifested a two‐stage thermal polymerization pattern. The first stage was attributed to the polymerization of allyl groups and the second to the ring‐form polymerization of cyano groups. The result of dynamic rheological analysis indicated the monomer had wide curing window and the self‐catalyzed curing behavior. DBPA‐Ph polymers were prepared from the thermal polymerization with short curing time, showing high glass transition temperature (>350°C) and attractive thermal decomposition temperature (>430°C). The outstanding glass transition temperature, desirable thermo‐oxidative stabilities, good processability and sound process conditions could provide more applications to the DBPA‐Ph polymers. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 41203.  相似文献   

14.
Poly(arylene ether nitriles) (PEN) with pendant phthalonitrile groups (PEN? CN) were obtained via the Yamazaki‐Higashi phosphorylation route of 4‐(4‐aminophenoxy)phthalonitrile (APN) with acid‐contained PEN (PEN? COOH) in the presence of CaCl2. The chemical structure and molecular weight of PEN? CN were characterized by 1H‐NMR, Fourier transform infrared spectroscopy, and Gel permeation chromatography. The synthesized PEN? CN had superior solubility in polar organic solvent and can be easily processed into thin films from the solutions of N‐methylpyrrolidone, dimethylsulfoxide, N,N′‐dimethylformamide, dimethylacetamide, and tetrahydrofuran. Compared with PEN? COOH, PEN? CN showed higher thermal stability with 5% weight loss temperatures (T5%) up to 430°C. The glass transition temperature of PEN? CN was improved from 211 to 235°C measured by differential scanning calorimetry (DSC). In addition, it also exhibited excellent mechanical properties that Young's modulus reached to 3.5 GPa. Meanwhile, the effects of different aromatic amines and Lewis acid on the crosslinking behavior of PEN? CN were investigated by DSC. The results indicated that anhydrous Zinc chloride (ZnCl2) was the best catalyst to lower the curing temperature among 2,6‐bis(4‐diaminobenzoxy) benzonitrile, 4,4‐diaminediphenyl sulfone, APN and ZnCl2. © 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012  相似文献   

15.
Four novel bis‐benzocyclobutene‐endcapped arylene ether monomers, 1,1′‐bis[4‐(4′‐benzocyclobutenyloxy)phenyl]‐1‐phenyl‐2,2,2‐trifluoroethane (BOPP3FE), 1,1′‐bis[4‐(4′‐benzocyclobutenyloxy)phenyl]‐1‐(3′,5′‐ditrifluoromethyl)phenyl‐2,2,2‐trifluoroethane(BOPP9FE), 2,2′‐bis[4‐(4′‐benzocyclobutenyloxy)phenyl]‐1,1,1,3,3,3‐hexfluoropropane (BOP6FP), and 2,2′‐bis[4‐(4′‐benzocyclobutenyloxy)phenyl]‐propane (BOPP) were prepared and characterized. All the four monomers showed similar curing behaviors under N2 (Differential scanning calorimetry: extrapolated onset and peak temperatures at 225–229°C and 261–263°C) and demonstrated low and steady melt viscosities between 110 and 200°C, indicating their good processability. After cure, the resulting BCB resins exhibited high Tg (232–282°C) and excellent thermal stability (T5% > 433°C). The resins also showed good mechanical properties with the flexural strengths of 68–88 MPa and the flexural modulus of 2.52–3.15 GPa. Moreover, the resins also exhibited low dielectric constants (2.58–2.88), low dissipation factors (2.7 to 8.4 × 10?4) and low water absorptions in boiling water for 24 h (0.29–0.59%). © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009  相似文献   

16.
Terpolymerization of L‐lactide (LA) and bisphenol A derivatives was performed on few hundred gram scale, and the resultant terpolymer (TP) was characterized by gel permeation chromatography, infrared spectroscopy (FTIR), differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), and thermogravimetric analysis. Moderate molecular weight (Mn ~ 12 kg/mol) TP was achieved with glass transition temperatures about 100°C (DSC and DMA). The TP exhibited improved thermal stability compared with polylactide (PLA), with a thermal degradation temperature of about 80°C higher than PLA. Although the TP exhibited distinctly different surface morphology compared with that of PLA, both showed similar contact angle and surface energy (ca. 40 mN/m) properties. Blends of PLA and TP showed enhanced glass transition (~ 5°C change in Tg) temperatures compared with PLA homopolymer. This is due to the compatibility of PLA and TP. Thus, TP could be used as an additive for PLA‐based blends to enhance compatibility with phenolic‐based resins. TP electrospun fiber morphology is also reported. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011  相似文献   

17.
Four cyclotriphosphazene‐based benzoxazine monomers (I, II, III, and IV) with relatively high molecular weight were synthesized by a nucleophilic substitution reaction, and their chemical structures were confirmed by 1H‐NMR and 31P‐NMR. A new term, oxazine value (OV, similar to epoxy value), was first proposed to explain the structure–property relationship of the cured polymers. The polymerization behaviors of the four monomers were studied by differential scanning calorimetry and Fourier transform infrared spectroscopy. The maximum exothermic peaks of the four monomers are in the range 244–248 °C. All monomers possess a wide processing window despite their high molecular weight. The thermal stability, glass‐transition temperature (Tg), and mechanical properties of each cured polymer were studied by thermogravimetric analysis and dynamic mechanical thermal analysis. The char yield at 850 °C, Tg, and storage moduli of PIV (polybenzoxazine obtained from monomer IV) are 60.0%, 218 °C, and 9.0 GPa, respectively. The surface property and humidity absorption character of the cured polybenzoxazines were also studied. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44453.  相似文献   

18.
Two novel bismaleimide (BMI) monomers containing silicon atom in the structure, i.e., bis[4-(4-maleimidophenylcarbonyloxy)phenyl]dimethylsilane (BMI-SiE1) and bis[4-(4-maleimidophenyloxycarbonyl)phenyl]dimethylsilane (BMI-SiE2), were designed, synthesized, and polymerized with and without the use of diamine as comonomers to yield novel silicon-containing BMI resins. Both monomers obtained are readily soluble in organic solvents, such as chloroform and N, N-dimethylformamide. Differential scanning calorimetry and thermogravimetric analysis investigation of these two monomers indicated a high polymerization temperature (Tp > 240°C) and a good thermal and thermo-oxidative stability of cured BMI resins. The onset temperature for 5% weight loss was found to be above 450°C in nitrogen and above 400°C in the air. Polymerization of BMI-SiE1 and BMI-SiE2 with 4,4′-diaminodiphenylether (DPE) yielded a series of polyaspartimides that had good solubility and could be thermally cured at 250°C. TGA investigations of the cured diamine-modified BMI resins showed onset of degradation temperatures (Tds) in the range of 344–360°C in nitrogen and 332–360°C in the air. Composites based on the cured diamine-modified BMI resins and glass cloth were prepared and characterized for their dynamic mechanical properties. All the composites showed high glass transition temperatures (e.g., >190°C) and high bending modulus in the range of 1000–2700 MPa. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008  相似文献   

19.
A molecular glass resist with an ionic photoacid generator and a single protection group (MR‐1) has been developed. MR‐1 exhibited good thermal properties, such as a 5% weight loss temperature (Td5%) of 167°C and a glass transition temperature (Tg) of 80°C. MR‐1 showed the good sensitivity of 80 μC/cm2 and high contrast of 4.9 with e‐beam exposure (50 keV). A relatively high resolution of 50 nm and low Line‐Edge‐Roughness of 3.8 nm were obtained by e‐beam exposure (100 keV). © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 39769.  相似文献   

20.
A novel benzoxazine containing maleimide and carboxylic moieties, 1‐[3‐(4‐carboxylphenyl)‐3,4‐dihydro‐2H‐benzo[e][1,3]‐oxazin‐6‐yl]maleimide (Mal‐Bz‐Co), was synthesized and the structure was identified by 1H‐NMR and FTIR. Mal‐Bz‐Co exhibited good solubility in common organic solvents. The cure behavior of Mal‐Bz‐Co and cocure behavior of Mal‐Bz‐Co with o‐cresol formaldehyde epoxy resin were investigated by differential scanning calorimetry. Results indicated that Mal‐Bz‐Co showed a single curing exothermic peak at about 238.3°C. However, the maximum curing temperature (Tp) decreased to 146.1°C when Mal‐Bz‐Co cocured with o‐cresol formaldehyde epoxy resin in the molar ratio of 1 : 1. The Tp was about 92°C lower than that of Mal‐Bz‐Co. Thermogravimetric analysis showed that high‐decomposition temperature and char yield were observed for the cured resins of Mal‐Bz‐Co and Mal‐Bz‐Co/o‐CFER. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010  相似文献   

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