Thermosetting bismaleimide resins generating covalent and multiple hydrogen bonds

Prepolymerizations of 4,4′‐bismaleimidodiphenylmethane (BMI), diallyl isocyanurate (DAIC), and melamine (ML) at 160–170°C and subsequent compression molding at 200–280°C yielded cured BMI/DAIC/ML resins with feed molar ratios of 4/1/1, 3/1/1, and 2/1/1 (BMI‐DAIC‐ML411, 311, and 211). Similarly, cured BMI/DAIC 1/1 and BMI/ML 3/1 resins (BMI‐DAIC11 and BMI‐ML31) were prepared. The FT‐IR analysis revealed that the maleimide and allyl groups were almost consumed for all the cured resins, and the hydrogen bonding interaction became stronger with decreasing BMI contents for BMI‐DAIC‐MLs. Based on the cured structures elucidated from the FT‐IR result, the numbers of multiple hydrogen bonds and cross‐linking covalent bonds (N_MHB and N_CB), and total cross‐linking bond energy (E_TB) were evaluated to be 0, 7.92, and 618 for BMI‐DAIC‐ML411, 0.71, 7.81, and 627 for BMI‐DAIC‐ML311, and 0.95 mol kg^?1, 7.61 mol kg^?1, and 617 kcal kg^?1 for BMI‐DAIC‐ML211, respectively. A higher order of glass transition and 5% weight loss temperatures for BMI‐DAIC‐MLs was 411 > 311 > 211 in accordance with a higher order of N_CB. BMI‐DAIC‐MLs displayed a weak tan δ peak at 70–150°C due to dissociation of the hydrogen bonds. The flexural strength and modulus of BMI‐DAIC‐ML311 were higher than those of BMI‐DAIC‐ML411 in accordance with the difference of E_TB. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133, 43121.     

Synthesis and properties of novel phosphorus‐containing bismaleimide/epoxy resins

A novel soluble phosphorus‐containing bismaleimide (BMI) monomer, bis(3‐maleimidophenyl)phenylphosphine oxide (BMIPO), was synthesized by the imidization of bis(3‐aminophenyl) phenylphosphine oxide, in which its structural characterization was identified with ¹H‐NMR, ¹³C‐NMR, and Fourier transform infrared spectra. The BMIPO resin, with five‐membered imide rings and high phenyl density, was an excellent flame retardant with a high glass‐transition temperature (T_g), onset decomposition temperature, and limited oxygen index. In phosphorus‐containing BMI/epoxy/4,4′‐methylene dianiline (DDM)‐cured resins, homogeneous products were obtained from all proportions without phase separation. Because of the higher reactivity of BMIPO/DDM relative to that of 4,4′‐bismaleimidodiphenylmethane (BMIM)/DDM, the increase in the BMIPO/BMIM ratio in this blending resin increased the recrosslinking hazards of the postcuring stage and so lowered the T_g value and thermal stability. The thermal stability of the BMI/epoxy‐cured system was lower than that of the epoxy‐cured system because of the introduction of a phosphide group into BMIPO, whereas for the T_g value and flame retardancy, the former was significantly higher than the latter: the higher the BMIPO content in the blend, the higher the flame retardancy. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 2080–2089, 2002; DOI 10.1002/app.10607     

Synthesis and properties of silicon-containing bismaleimide resins

Two novel bismaleimide (BMI) monomers containing silicon atom in the structure, i.e., bis[4-(4-maleimidophenylcarbonyloxy)phenyl]dimethylsilane (BMI-SiE1) and bis[4-(4-maleimidophenyloxycarbonyl)phenyl]dimethylsilane (BMI-SiE2), were designed, synthesized, and polymerized with and without the use of diamine as comonomers to yield novel silicon-containing BMI resins. Both monomers obtained are readily soluble in organic solvents, such as chloroform and N, N-dimethylformamide. Differential scanning calorimetry and thermogravimetric analysis investigation of these two monomers indicated a high polymerization temperature (T_p > 240°C) and a good thermal and thermo-oxidative stability of cured BMI resins. The onset temperature for 5% weight loss was found to be above 450°C in nitrogen and above 400°C in the air. Polymerization of BMI-SiE1 and BMI-SiE2 with 4,4′-diaminodiphenylether (DPE) yielded a series of polyaspartimides that had good solubility and could be thermally cured at 250°C. TGA investigations of the cured diamine-modified BMI resins showed onset of degradation temperatures (T_ds) in the range of 344–360°C in nitrogen and 332–360°C in the air. Composites based on the cured diamine-modified BMI resins and glass cloth were prepared and characterized for their dynamic mechanical properties. All the composites showed high glass transition temperatures (e.g., >190°C) and high bending modulus in the range of 1000–2700 MPa. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Preparation and thermal properties of bismaleimide blends based on hydroxyphenyl maleimide

N‐(4‐hydroxyphenyl)maleimide was melt‐blended with the glycidyl ether of bisphenol‐A and various mole percentages of 4, 4′‐(diaminodiphenylsulfone) bismaleimide. The cure behaviour of the resins was evaluated by differential scanning calorimetry (DSC) and dynamic mechanical thermal analysis (DMTA). The blends showed distinct reductions in the onset of cure (T_o) and peak exothermic (T_exo) temperatures. The blends cured at low temperatures exhibited glass transition temperatures (T_gs) higher than the cure temperatures. The cured blends showed high moduli, glass transition temperatures in excess of 250 °C and good thermal stabilities up to 400 °C. Copyright © 2005 Society of Chemical Industry     

High glass transition temperature bismaleimide‐triazine resins based on soluble amorphous bismaleimide monomer

A novel bismaleimide (DOPO‐BMI) with unsymmetrical chemical structure and DOPO pendant group has been prepared. The particular molecular structure makes DOPO‐BMI show an intrinsic amorphous state with a T_g about 135°C and excellent solubility in most organic solvents, which is beneficial to the processability of bismaleimide composite materials. A series of bismaleimide‐triazine (BT) resins have been prepared based on DOPO‐BMI and 2,2‐bis(4‐cyanatophenyl)propane at various weight ratios. The prepared BT resins show outstanding solubility in organic solvent and low viscosity about 10–671 mPa s at 180°C. The cured BT resins exhibit high glass transition temperature (T_g) over 316°C. As the weight ratio of DOPO‐BMI increases to 80% (BT80), the T_g can rise to 369°C (tan δ). The cured BT resins also show good thermal stability with the 5% weight loss temperature over 400°C under both nitrogen and air atmosphere. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133, 42882.     

Fluorinated bismaleimide resin with good processability,high toughness,and outstanding dielectric properties

In this study, novel fluorinated bismaleimide (BMI) resins were prepared by the copolymerization of 2,2′‐bis[4‐(4‐maleimidephenoxy)phenyl]hexafluoropropane (6FBMP) and diallyl hexafluorobisphenol A (6FDABPA) to enhance their dielectric properties. The dielectric properties of the resins were investigated in the frequency range 7–18 GHz through a cavity method. Through the incorporation of a hexafluoroisopropyl group with the polymer chain, the dielectric constant (ε) was effectively decreased because of the small dipole and the low polarizability of the carbon‐fluorine (C? F) bonds. The 6FBMP/6FDABPA resin possessed excellent dielectric properties, with ε being 2.88 and the dielectric loss being 0.009 at 10 GHz and 25°C. In comparison with the 4,4′‐bismaleimidodiphenylmethane (BDM)/2,2′‐diallyl bisphenol A (DABPA) resin, the glass‐transition temperature (T_g) of 6FBMP/6FDABPA decreased. The flexible ether group in the long chain of 6FBMP was considered to disrupt chain packing and cause a decreased crosslinking density and a lower T_g. 6FBMP/6FDABPA showed a similar thermal decomposition temperature and good thermal properties like the BDM/DABPA resin, whereas the impact strength of the 6FBMP/6FDABPA resin was almost 1.6 times higher than that of the BDM/DABPA resin. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 42791.     

Bio-based thermosetting bismaleimide resins using eugenol,bieugenol and eugenol novolac

5,5′-Bieugenol (BEG) and eugenol novolac (EGN) were synthesized by the oxidative coupling reaction of eugenol (EG) and the addition–condensation reaction of EG with formaldehyde, respectively. The EG, BEG and EGN were prepolymerized with 4,4′-bismaleimidediphenylmethane (BMI) at 180 °C and then compression-molded at finally 250 °C for 6 h to produce cured EG/BMI (EB), BEG/BMI (BB) and EGN/BMI (NB) resins with eugenol/maleimide unit ratios of 1/1, 1/2 and 1/3. The FT-IR analysis of EBs and ¹³C NMR analysis of the model reaction product of EG/N-phenylmaleimide (PMI) 1/3 at 200 °C for 12 h suggested that the ene reaction and subsequent Diels-Alder/ene reactions mainly occurred for EBs. The FT-IR analyses of BBs and NBs supported the occurrence of ene reaction and subsequent thermal addition copolymerization in a similar manner to the well-known curing reaction of 2,2′-diallylbisphenol A and BMI. The glass transition temperature (T_g) and 5% weight loss temperature (T₅) of the cured resin increased with increasing BMI content, and EB 1/3 showed the highest T_g 377 °C and T₅ 475 °C. The flexural strengths and moduli of EBs and NBs were higher than those of BBs, and EB 1/2 showed the most balanced flexural strength and modulus (84.5 MPa and 2.75 GPa). The FE-SEM analysis revealed that there is no phase separation for all the cured resins.     

Preparation and properties of bismaleimide resins of aromatic sulfone ether diamine

Aromatic sulfone ether diamine, bis[4-(4-aminophenoxy)phenyl]-sulfone (SED), was prepared by the nucleophilic aromatic substitution of 4,4′-dichlorodiphenylsulphone by p-aminophenolate. The reaction was conducted in the presence of excess potassium carbonate as a weak base, toluene as the dehydrating agent and N-methylpyrrolidone as the dipolar aprotic solvent. SED showed good solubility in common organic solvents, such as dioxan, tetrahydrofuran, butanone and acetone. SED was reacted with maleic anhydride to obtain aromatic sulfone ether bismaleimide, bis[4-(4-maleimidophenoxy)phenyl]-sulfone (SEM). The compounds were characterized by FTIR and ¹H NMR analysis. Furthermore, copolymer resins of SED with 4,4′-bismaleimidodiphenyl methane (BMI) and SEM were prepared. After curing, crosslinked resins with better thermal stability resulted. The temperature at maximum rate of weight loss (T_max) and the heat-resistant temperature index (T_i) in air were found to be 426°C, 208°C and 579°C, 221°C for BMI/SED and SEM/SED resins, respectively. Compared with the corresponding 4,4′-diaminodiphenyl methane (DDM) system, BMI/SED and SEM/SED showed a slight decrease in T_max and T_i SED-modified BMI/amine resin based glass cloth laminates for printed circuit boards showed higher mechanical properties than those of the corresponding unmodified system. With SED instead of the original amine component in 3–5% weight fraction, the tensile strength, flexural strength and impact strength of the laminates increased markedly. Meanwhile, the stripping strength and weld resistance were also improved by the addition of SED.     

Chemically stable polyphenylene ether microcapsules prepared using a facile method for the self‐healing of polymers

Chemically stable polyphenylene ether (PPO) microcapsules (MCs) filled with epoxy resins (PPO‐EP MCs) were prepared using low‐molecular‐weight PPO with vinyl end‐groups as shell wall and epoxy resins as core material using an oil‐in‐water emulsion solvent evaporation method. This method for synthesizing MCs with PPO shell walls is simple, convenient and novel, which can avoid the influence of processing parameters on the chemical stability of the epoxy resin core material. The resulting PPO‐EP MCs exhibit good chemical stability below 255 °C mainly owing to the absence of a polymerization catalyst of the epoxy resins. The initial thermal decomposition temperature of the MCs is about 275 °C. The MCs were embedded in a 4,4′‐bismaleimidodiphenylmethane/O,O′‐diallylbisphenol A (BMI/BA) thermosetting resin system. When processed at high temperature (up to 220 °C), the microencapsulated epoxy resins could be released from the fractured MCs to matrix crack surfaces and bond the crack surfaces. An amount of 8 wt% MCs restored 91 and 112% of the original fracture toughness of the BMI/BA matrix when heated at 220 °C/2 h and 80 °C/1 h + 220 °C/2 h, respectively. The MCs only slightly decreased the thermal property of the matrix. © 2016 Society of Chemical Industry     

Building and origin of bio‐based bismaleimide resins with good processability,high thermal,and mechanical properties

Bio‐based high performance thermosetting resins have been urgently required by cutting‐edge fields for meeting sustainable development. A new kind of high performance thermosetting resins (BA‐n) with good processability, high thermal resistance, and mechanical properties was developed based on 4,4′‐bismaleimidodiphenylmethane (BDM) and renewable bis(5‐allyloxy)‐4‐methoxy‐2‐methylphenyl)methane (ABE) from bio‐based lignin derivative. The effect of the molar ratio of allyl to imide (n) on structures and properties of BA resins were systematically researched. BA‐n resins have much better processability, thermal, and mechanical properties than their petroleum‐based counterparts, 2,2′‐diallylbisphenol A‐modified BDM (BD‐n) resins. Compared with BD‐0.86, the best available bismaleimide (BMI) resin, BA‐0.86 not only has 6 h longer process window and 13.7 °C higher glass transition temperature, but also owns the highest flexural strength and modulus among all bio‐based allyl compound‐modified BMI resins reported. The origin behind these attractive performances of BA resins is revealed by discussing the unique crosslinked structure. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 45947.     

Eugenol‐Derived Bismaleimide High Performance Resins and Composites Using Diisocyanate as Property Modifier

A new kind of high performance bismaleimide resin with good processability and improved toughness is synthesized by chemical modification of 4,4′‐bismaleimidodiphenylmethane (BMI) by eugenol (EG) and different contents of 4,4′‐diphenylmethane diisocyanate (MDI). MDI‐EG‐BMI resins exhibit good thermal stability for its 5% weight loss temperatures around 300 °C and its residue of 41.61% at 900 °C, which are much higher than those of EG‐BMI resin. Then, the carbon fiber‐reinforced MDI‐EG‐BMI composites are fabricated. The mechanical properties of the composites matrixed by MDI‐EG‐BMI resins are better than those by EG‐BMI resin. For carbon/MDI‐EG‐BMI composites, their glass transition temperatures are higher than 300 °C, and their flexural strength, moduli, and toughness are maintained at a range of 217.47–404.36 MPa, 35.12–48.49 GPa, and 1.16–2.63 MJ m^?3 respectively; with the contents increasing of MDI in the resin formulation, the flexural properties first increase then decrease; comprehensively the composite with 30 wt% MDI has the best mechanical and thermal properties.     

Synthesis of a novel series of propargyloxyphenyl maleimides and their characterization as thermal‐resistance resins

Novel thermosetting monomers possessing both maleimide and propargyl groups were first designed and synthesized. The monomers included N‐(2‐propargyloxyphenyl) maleimide (2‐PPM), N‐(3‐propargyloxyphenyl) maleimide (3‐PPM), and N‐(4‐propargyloxyphenyl) maleimide (4‐PPM), and their structures were confirmed with Fourier transform infrared (FTIR) spectroscopy, ¹H‐NMR, and elemental analysis. The cure behaviors of these monomers were characterized with differential scanning calorimetry and FTIR spectroscopy, and the results indicated that the monomers had a broader processing window than normal bismaleimide (BMI) resins. The thermal properties of the cured monomers were characterized with thermogravimetric analysis and dynamic mechanical analysis. The 5% mass loss temperatures of the cured monomers were high (ca. 400°C), and the glass‐transition temperatures of cured 2‐PPM, 3‐PPM, and 4‐PPM were 386, 373, and 387°C, respectively, which were much higher than those of typical commercial blended BMI resins. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Studies of phosphonate‐containing bismaleimide resins. I. Synthesis and characteristics of model compounds and polyaspartimides

Two phosphonate‐containing bismaleimide (BMI) [(4,4′‐bismaleimidophenyl)phosphonate] monomers with different melting temperatures and similar curing temperatures were synthesized by reacting N‐hydroxyphenylmaleimide with two kinds of dichloride‐terminated phosphonic monomers. The BMI monomers synthesized were identified with ¹H‐, ¹³C‐, and ³¹P‐nuclear magnetic resonance (NMR) spectroscopy and elemental analysis. The phosphonate‐containing BMI monomers react with a free‐radical initiator to prepare phosphonate‐containing BMI polymers and also with various aromatic diamines to prepare a series of polyaspartimides as reactive flame retardants. The polymerization degrees of polyaspartimides depend on the alkalinity and nucleophility of diamines as chain extenders. Differential scanning calorimetry (DSC) and thermogravimetry analysis (TGA) were used to study the thermal properties of the phosphonate‐containing BMI resins such as the melting temperature, curing temperature, glass transition temperature (T_g), and thermal resistance. All the phosphonate‐containing BMI resins, except the BMI polymers, have a T_g in the range of 210–256°C and show 5% weight loss temperatures (T_5%) of 329–434 and 310–388°C in air and nitrogen atmospheres, respectively. The higher heat resistance of cured BMI resin relative to the BMI polymer is due to its higher crosslinking density. Since the recrosslinking reactions of BMI polymers and polyaspartimides occur more easily in an oxidation environment, their thermal stabilities in air are higher than are those in nitrogen gas. In addition, the thermal decomposition properties of polyaspartimides depend on the structures and compositions of both the diamine segments and the BMI segments. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 1919–1933, 2002     

Synthesis and properties of novel 4,4′‐biphenylene‐bridged flame‐retardant cyanate ester resin

The bisphenol‐containing 4,4′‐biphenylene moiety was prepared by the reaction of 4,4′‐bis(methoxymethyl) biphenyl with phenol in the presence of p‐toluenesulfonic acid. The bisphenol was end‐capped with the cyanate moiety by reacting with cyanogen chloride and triethylamine in dichloromethane. Their structures were confirmed by Fourier transform infrared spectroscopy, ¹H‐NMR, and elemental analysis. Thermal behaviors of cured resin were studied by differential scanning calorimetry, dynamic mechanical analysis, and TGA. The flame retardancy of cured resin was evaluated by limiting oxygen index (LOI) and vertical burning test (UL‐94 test). Because of the incorporation of rigid 4,4′‐biphenylene moiety, the cyanate ester (CE) resin shows good thermal stability (T_g is 256°C, the 5% degradation temperature is 442°C, and char yield at 800°C is 64.4%). The LOI value of the CE resin is 42.5, and the UL‐94 rating reaches V‐0. Moreover, the CE resin shows excellent dielectric property (dielectric constant, 2.94 at 1 GHz and loss dissipation factor, 0.0037 at 1 GHz) and water resistance (1.08% immersed at boiling water for 100 h). © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Structure and Properties Relationships of Epoxy Resins Part 1: Crosslink Density of Cured Resin: (II) Model Networks Properties

Carefully designed resin precursors of high purity, viz. N,N-bis-(2,3-epoxypropyl)-N',N-dimethyl-4,4′-diaminodiphenylenemethane (G2A) and N,N-bis-(2,3-epoxypropyl)-N,N-dimethyl-4,4′-diamino-diphenylenemethane (G2S) were used in combination with N,N,N',N-tetrakis-(2,3-epoxypropyl)-4,4′-diaminodiphenylene methane, TGDDM, and cured with stoichiometric amounts of 4,4′-diamino-diphenylene methane (DDM) to produce networks with a range of controlled crosslink density. The tensile moduli E of the networks in the rubbery state, at T_g+30°C, T_g+45°C and T_g+60°C, were measured using a thermal mechanical analyser. Using the statistical theory of rubber elasticity and the observed values of E, the number average molecular weights between crosslink points M_c for the cured resins were deduced. The experimental M_c values were then compared with those derived by calculations based on a probabilistic model of the network proposed by Chu and Seferis.¹ The experimental M_c values were 2.5 to 5.5 times larger than the calculated ones. The differences were attributable to a consumption of only 40% of the available secondary amino hydrogen via epoxy-amine reaction. A direct relationship was established between the glass transition temperature and the crosslink density 1/M_c for the resins, and the dynamic mechanical properties were studied. The thermal stability of cured resins studied by thermo-gravimetric analysis indicated an enhancement of stability as 1/M_c was reduced. The amount of water absorbed by cured resin was directly proportional to 1/M_c.     

Forced torsional properties of PMR composites with varying nadic ester concentrations and processing histories

PMR polyimide resin was prepared from 4,4′-methylenedianiline (MDA), the dimethyl ester of 3,3′,4,4′- benzophenonetetracarboxylic acid (BTDE) and the monomethyl ester of 5-norbornene-2,3-dicarboxylic acid (NE). The NE group serves as a chain terminator and crosslinking site. PMR/Celion 6000 composites were fabricated from resins having varying NE concentrations using two molding processes, and the laminates characterized in forced torsion. Glass transition temperatures (T_g) of 360–390°C were observed in the crosslinked resins, as compared with the literature value of 284°C reported for the uncrosslinked systemT_g did not decrease with decreasing NE concentrations over the range from 2.0 to 1.25 moles. Stoichiometry, within the range studied, showed little influence on shear properties; however, a 25% variation in matrix shear modulus with processing was observed. The G₁₂ values determined in forced torsion were in excellent agreement with those reported from tensile tests of ±45° laminates. A branching and possible secondary crosslink mechanism is proposed based on dynamic mechanical behavior and infrared spectra of the composites.     

Thermal and dielectric properties of bismaleimide‐triazine resins containing octa(maleimidophenyl)silsesquioxane

Octa(maleimidophenyl)silsesquioxane (OMPS) was synthesized, characterized, and employed to modify the BT resin which composed of 4,4′‐bismaleimidodiphenylmethane (BMI) and 2,2′‐bis(4‐cyanatophenyl)propane (BCE). The curing reaction between OMPS and BT resin was first investigated. It was found that OMPS accelerate the curing reaction of BCE, and the onset temperature of the cyclotrimerization was reduced up to 95.5°C (by DSC). As demonstrated by DSC and FTIR, there was no evidence that indicated the coreaction between maleimide and cyanate ester. 2,2′‐diallyl bisphenol A (DBA) and diglycidyl ether of bisphenol A (E‐51) (Wuxi Resin Factory, Jiangsu Province, China) were also used to enhance the toughness of BT resin, and the formulated BTA (containing DBA) and BTE (containing E‐51) resins were obtained. The thermal properties of BT, BTA, and BTE resins incorporated with OMPS were then investigated. The results of DMA and TG showed that the BT, BTA, and BTE resins containing 1 wt % of OMPS exhibit enhanced thermal properties in comparison with their pristine resins respectively, while more contents of OMPS may impair the thermal properties of the polymer matrix, though the effect of OMPS was slight. Finally, the dielectric constant of these hybrid materials were detected, and their dielectric constant were distinctly reduced by the incorporation of OMPS, while overmuch contents of OMPS were disadvantageous for dielectric constant because of the aggregation of OMPS. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci 2008     

Bis[4‐(4‐maleimidephen‐oxy)phenyl]propane/N,N‐4,4′‐bismaleimidodiphenylmethyene blend modified with diallyl bisphenol A

In this article, 2,2′‐bis[4‐(4‐maleimidephen‐oxy)phenyl)]propane (BMPP) resin and N,N‐4,4′‐bismaleimidodiphenylmethyene (BDM) resin blends were modified by diallyl bisphenol A (DABPA). The effects of the mole concentration of BMPP on mechanical properties, fracture toughness, and heat resistance of the modified resins were investigated. Scanning electron microscopy was used to study the microstructure of the fractured modified resins. The introduction of BMPP resin improves the fracture toughness and impact strength of the cured resins, whose thermal stabilities are hardly affected. Dynamic mechanical analysis shows that the modified resins can maintain good mechanical properties at 270.0°C, and their glass transition temperatures (T_g) are above 280.0°C. When the mole ratio of BDM : BMPP is 2 : 1(Code 3), the cured resin performs excellent thermal stability and mechanical property. Its T_g is 298°C, and the Charpy impact strength is 20.46 KJ/m². The plane strain critical stress intensity factor (K_IC) is 1.21 MPa·m^0.5 and the plane strain critical strain energy release rate (G_IC) is 295.64 J/m². Compared with that of BDM/DABPA system, the K_IC and G_IC values of Code 3 are improved by 34.07% and 68.10%, respectively, which show that the modified resin presented good fracture toughness. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40395.     

Effects of water sorption at different temperatures on permanent changes in an epoxy

Crosslinked epoxy resins, tetraglycidyl 4,4′-diamino diphenyl methane cured with 4,4′-diamino diphenyl sulfone, were soaked in water at either 25°C or 70°C for varying lengths of time. The infrared spectra and DSC thermograms were obtained for samples that were soaked, or soaked and dried. There was a monotonic decrease in exothermic reaction energy with water content. The glass transition was also lowered, although samples soaked at 70°C showed a leveling in the T_g around 115°C. When the soaked samples were dried, the exothermic reaction energy showed near reversibility for samples soaked at 25°C while the 70°C samples were highly irreversible. IR of the latter samples showed that the 70°C water soaking resulted in reaction of some of the unreacted epoxide groups that remained after the initial cure.     

Multifunctional epoxy resins

The curing behavior of epoxy resins prepared by reacting epichlorohydrin with 4,4′-diaminodiphenyl methane (DADPM)/4,4′-diaminodiphenyl ether (DADPE) or 4,4′-diaminodiphenyl sulfone (DDS) was investigated using DDS and tris-(m-aminophenyl)phosphine oxide (TAP) as curing agents. A broad exothermic transition with two maxima were observed in the temperature range of 100–315°C when TAP was used as the curing agent. The effect of varying DDS concentration on curing behavior of epoxy resin was also investigated. Peak exotherm temperature (T_exo) decreased with increasing concentration of DDS, whereas heat of curing (ΔH) increased with an increase in amine concentration up to an optimum value and then decreased. Thermal stability of the resins, cured isothermally at 200°C for 3 h, was investigated using thermogravimetric analysis in a nitrogen atmosphere. Glass fiber-reinforced multifunctional epoxy resin laminates were fabricated and the mechanical properties were evaluated. © 1993 John Wiley & Sons, Inc.