固结磨料研磨蓝宝石单晶过程中研磨液的作用

开展了固结磨料研磨单晶蓝宝石面板的实验研究,探索了不同研磨液对材料去除速率和工件表面质量的影响。分析了研磨液对蓝宝石表面的化学作用,探索了固结磨料研磨蓝宝石晶体的材料去除机理。实验显示:使用W14镀镍金刚石固结磨料研磨蓝宝石单晶,研磨液仅为去离子水时,材料去除率(MRR)为149.8nm/min、表面粗糙度(Ra)为76.2nm;而研磨液中加入2%的乙二醇后,相应的MRR为224.1nm/min,Ra为50.7nm。用光电子能谱仪(XPS)分析了工件表面,结果表明含有乙二醇的研磨液能够增加蓝宝石工件表面的活性。得到的结果显示:在溶液中加入乙二醇有利于表面软化层的生成并增加蓝宝石表面的活性,说明研磨液对蓝宝石单晶研磨效率的提升和表面质量的改善具有促进作用。     

三乙醇胺在镁铝尖晶石固结磨料研磨中的作用

探索了三乙醇胺在镁铝尖晶石固结磨料研磨中的作用机理并进行了系列实验。首先,通过显微压痕实验测量了三乙醇胺和去离子水作用下镁铝尖晶石样品的硬度。然后,采用X射线光电子能谱仪(XPS)分析了三乙醇胺的化学作用机理,研究了在三乙醇胺和去离子水作用下工件表面层化学组分随深度的变化,估算了其表面软化层的厚度。最后,通过研磨实验探索了去离子水和不同浓度的三乙醇胺对材料去除率和表面质量的影响。结果表明:三乙醇胺研磨液对工件的化学作用降低了其表面层的显微硬度,形成了软化层;三乙醇胺和去离子水形成软化层的机制是其中的OH-和吸附的CO2与尖晶石基体发生了反应,而三乙醇胺形成的软化层厚度约为2nm,去离子水形成的软化层厚度小于0.65nm;采用三乙醇胺研磨液的材料去除率高于采用去离子水,但表面质量较采用去离子水的差。实验证明,三乙醇胺对工件的化学作用可以显著地提高材料去除效率。     

光学硬脆材料固结磨料研磨中的亚表面损伤预测

研磨过程中亚表面损伤层深度的正确预测是研磨工艺参数制定的重要依据。针对固结磨料的研磨特点,选择两种典型光学硬脆材料(镁铝尖晶石和石英玻璃),采用离散元仿真技术,分别建立了两种材料的二维离散元模型,分析了工艺参数对光学硬脆材料亚表面损伤(裂纹)层深度的影响。而后,采用角度抛光法测量了镁铝尖晶石和石英玻璃的亚表面损伤层深度,进行了实验验证。结果表明:采用固结磨料研磨时,磨粒粒径对光学硬脆材料亚表面损伤的影响相当显著,在相同研磨工艺条件下,随着磨粒粒径的增大,亚表面损伤层深度和微裂纹密集程度明显增加。离散元仿真结果与实验结果的对比表明:采用离散元技术可以对光学硬脆材料的亚表面损伤深度进行快速有效的预测,从而为后续的研磨抛光工艺提供参考与指导。     

研磨压力对固结聚集体磨料垫自修正影响

固结磨料研磨过程中磨料的微破碎是实现固结磨料垫自修正特性的主要途径,研磨压力是影响磨粒微破碎的关键参数。选用单晶金刚石和聚集体金刚石作为磨粒制备固结磨料垫,在15 kPa压力下以石英玻璃为加工对象进行研磨实验,比较两者的材料去除率及加工稳定性;制备了4种陶瓷结合剂含量的聚集体金刚石,并制备成固结聚集体金刚石磨料垫,探索了不同压力下的固结聚集体金刚石磨料垫的自修正性能;分析了研磨后的工件表面粗糙度和表面微观形貌。结果表明:采用固结聚集体金刚石磨料垫,研磨后工件表面粗糙度低,去除效率稳定;在15~21 kPa的压力下,结合剂含量次高的聚集体金刚石研磨效率高,材料去除率达到8.94~12.43μm/min,加工性能较稳定,研磨后的工件表面粗糙度R a在60 nm左右;在3.5~7 kPa压力下,结合剂含量次低的聚集体金刚石研磨性能较稳定,材料去除率在2.67~3.12μm/min,研磨后的表面粗糙度R a在40 nm左右。高结合剂含量的聚集体金刚石磨粒更适合高研磨压力条件,而低结合剂的聚集体金刚石磨粒更适合于低研磨压力。     

Chemo-mechanical grinding by applying grain boundary cohesion fixed abrasive for monocrystal sapphire

This paper presents a novel fixed abrasive tool namely grain boundary cohesion fixed abrasive pellet (GBCFAP) which is able to provide higher finishing efficiency as well as better surface/subsurface quality of sapphire substrate during the chemo-mechanical grinding (CMG) process. The manufacturing procedures of GBCFAP are introduced in detail in this paper. It is found that the sintering temperature plays an important role to the strength of GBCFAP, and the strength of GBFCAP could be flexibly adjusted by sintering temperature. The experiment result suggests that the recommended sintering temperature ranges from 600 to 650 °C according to current CMG conditions. Meanwhile, comparing with conventional resin bound CMG wheel, 600 °C sintered GBCFAP CMG wheel performs better in terms of material removal rate and surface/subsurface quality since the chemical effect and mechanical effect during CMG process are well balanced. Meanwhile, the solid phase reaction between sapphire and Cr₂O₃ abrasive is demonstrated by TEM observation and XPS quantification.     

单晶蓝宝石的延性研磨加工

为实现单晶蓝宝石的延性研磨加工,采用纳米压痕和划痕法测试并分析了单晶蓝宝石(0001)面的微纳力学特性,建立了单颗圆锥状磨粒的压入模型并计算了延性研磨加工的受力临界条件,分析了金刚石磨粒嵌入合成锡研磨盘表面的效果.对单晶蓝宝石进行了延性研磨加工试验,采用NT9800白光干涉仪、扫描电子显微镜(SEM)和透射电子显微镜(TEM)等方法分析了单晶蓝宝石的延性研磨表面特征.试验结果表明:采用纳米压痕和划痕法可以为单晶蓝宝石的延性研磨加工提供工艺参数,单晶蓝宝石的延性堆积的极限深度为100 nm,金刚石磨粒的嵌入及在适当载荷下可以实现蓝宝石的延性研磨加工,实验条件下的最佳载荷为21 kPa,延性研磨后单晶蓝宝石表面划痕深度的分布情况较好,分散性小,研磨后的表面发生了位错滑移变形.     

Kinematics and trajectory analysis of the fixed abrasive lapping process in machining of interdigitated micro-channels on bipolar plates

The fixed abrasive lapping process is presented to investigate its ability and accuracy in machining of interdigitated micro-channels on bipolar plates that are used in the proton exchange membrane fuel cell. A kinematical equation to describing the relative movement between the fixed abrasive lapping plate and workpiece is developed and used to numerically simulate the trajectories of a single diamond abrasive and fixed diamond abrasives with 17 different arraying forms, respectively. It is shown that the lapping trajectory can be superposed periodically when the rotation ratio is a rational number. By assessing the uniformity of lapping trajectories and opening ratio of the bipolar plate the optimized rotation ratio is obtained which is 1:1, and the best arraying form of the fixed diamond abrasives on the lapping plate has been obtained as well that is the arraying form of C4. Then, a set of fixed abrasive lapping tests were conducted to explore its ability in machining of interdigitated micro-channels on bipolar plates. It is found that larger material removal rate can be achieved by employing bigger lapping pressure and higher rotation speed for both copper and stainless steel samples considered in this study. The maximum cell power density is found to be about 165 mW cm⁻² by testing the performance of a single micro fuel cell with a bipolar plate characterized by interdigitated micro-channels that shows a good cell performance.     

Effects of compound diamond slurry with graphene for lapping of sapphire wafers

Recently, sapphire has been used in a wide range of applications including optics, consumer electronics, and especially the rapidly growing LED wafer manuf     

Optimal cutting time and speed in abrasive lapping of ceramic

The cutting time and speed in the abrasive lapping of zirconia ceramics are investigated. Their influence on the productivity and final surface roughness is considered. The optimal cutting time and speed are determined     

A novel measurement method for the torque acting on the upper platen in a three-way double-sided lapping/polishing machine

In double-sided lapping and polishing processes, the friction coefficients between the workpiece and platens or pads are important parameters for understanding or improving the lapping and polishing processes. However, the friction coefficients have not been investigated in detail owing to insufficient measurement methods for the torques acting on the upper and lower platens, which are necessary to evaluate the friction coefficients. Thus, a novel measurement method for the torque acting on the upper platen in a three-way double-sided machine was proposed in this study. In the method, the torque is measured based on the forces acting on the holders supporting the upper platen rotation. The torques were measured with the method in double-sided lapping experiments, and they were confirmed to agree with the theoretical torque variation. Furthermore, the friction coefficient between the workpiece and upper pad identified with the proposed method was also verified by comparing with the friction coefficient measured in the single-sided lapping experiment. In addition, the estimation method of the lower platen torque based on the motor torque was investigated by utilizing the proposed method, and we found the lower platen torque was estimated accurately by taking a sufficient warm-up time or by modeling the torque loss in transmission path. Therefore, accurate measurement of the torques acting on the upper and lower platens, which is an effective tool for understanding or improving the process, was realized.     

基于UG的蓝宝石衬底基片双面研磨轨迹研究

通过数学理论建模与UG建模,建立了蓝宝石衬底基片双面研磨的运动模型并获得了在三种传动比情况下行星齿轮上不同点的轨迹。通过分析研磨轨迹和研磨速度可知在传动比为1时行星齿轮各点的轨迹为均匀分布的圆形且速度相等,所有点的运动周期相等而且比其它情况下的周期短,有利于提高研磨效率和形状精度,结果成功地解决了由于行星齿轮内的衬底基片各点处速度不一样而导致的平面度差的问题和行星齿轮中心不能放置蓝宝石衬底基片的问题。     

碳化硼研磨后蓝宝石晶体的亚表面损伤

介绍了蓝宝石材料的亚表面损伤形成机制。考虑碳化硼磨料可产生较小亚表面损伤的优点,本文基于游离磨料研磨方式,研究了不同粒度碳化硼磨料研磨后蓝宝石晶体的亚表面损伤。利用KOH化学腐蚀处理技术,对研磨后的样品进行了刻蚀;通过特定的腐蚀坑图像间接反映了蓝宝石晶体的亚表面损伤形貌特征,获得了W20、W10和W5碳化硼磨料产生的亚表面损伤深度,得到了在不同刻蚀时间下蓝宝石亚表面损伤形貌、表面粗糙度和刻蚀速率。研究结果显示:游离碳化硼磨料研磨造成的蓝宝石晶体的亚表面损伤密度相当显著,但损伤深度并不大,其随磨料粒度的增大而增大,W20、W10和W5粒度的磨料研磨后产生的亚表面损伤深度分别为7.4,4.1和2.9μm,约为磨料粒度的1/2。得到的结果表明采用碳化硼磨料研磨有利于获得低亚表面损伤的蓝宝石晶片,而采用由大到小的磨料逐次研磨可以快速获得低亚表面损伤的蓝宝石晶片。     

蓝宝石衬底基片工艺质量检测指标及方法的研究进展

根据蓝宝石衬底基片国家标准和国际质量保证体系标准,结合目前蓝宝石衬底基片生产和科研的实际情况,阐述了目前蓝宝石衬底基片生长、掏棒切片、研磨抛光和清洗加工过程中的质量检测指标、检测方法,以及检测设备.指出了蓝宝石衬底基片检测技术的研究对衬底基片生产的重要性.总结了蓝宝石衬底基片检测技术的现状,半导体材料GaN衬底用蓝宝石单晶的纯度要达到99.999％以上,位错密度在102/cm2范围内,晶片切片厚度偏差不超过20μm,表面粗糙度要达到Ra0.3nm水平.指出了现有检测技术的不足和今后的发展趋势,对蓝宝石衬底检测技术的进一步发展具有引导性的作用.     

蜂窝状结构半固结磨料研磨盘的制备及应用

针对传统半固结研磨盘由于盘面较软使得加工衬底面形精度难以保证的问题,提出一种蜂窝状结构的半固结磨料研磨盘的设计与制备方法。该研磨盘采用环氧树脂蜂窝结构作为支撑“骨架”,减小研磨盘的变形,以保证研磨衬底的面形精度,同时采用含有金刚石磨粒的凝胶体作为半固结研磨介质实现对衬底的研磨加工,获得了较好的衬底表面质量。基于该原理制备了一套新型研磨盘,并用于蓝宝石衬底的双面研磨加工。试验结果表明,研磨后衬底表面粗糙度较小,表面划痕和裂纹少,能够获得较好的表面质量;相应地,研磨后蓝宝石衬底的面形精度不仅没有变差,反而得到很大的改善,研磨后衬底的翘曲度、弯曲度和总厚度偏差均大幅减小。另外,研磨效率也相对较高,材料去除率可达0.3～0.4 μm/min。试验结果证明了该新型结构研磨盘不仅可以获得较好的表面质量和较高的研磨效率,同时还可提高衬底的面形精度,可用于面形精度要求较高的薄片衬底零件的精密研磨加工。     

六面体蓝宝石磨料冲击加工声学系统研制

针对蓝宝石等硬脆材料难加工的特点,研究了蓝宝石磨料冲击加工方法与加工原理,并进行了磨料冲击加工仿真模拟;从理论上分析、设计了磨料冲击加工声学系统,给出了参数设计和计算过程,得出了声学部件的基本尺寸和参数,并用有限元软件ANSYS对声学系统进行了模态分析。根据理论计算参数和分析结果,制造了20 kHz换能器、阶梯型变幅杆和工具头。采用HP4294A阻抗分析仪测量了声学系统的谐振频率,利用装配好的声学系统进行了试样加工。测量结果表明,与理想谐振频率相差0.019 452 kHz,符合设计、使用要求;研究结果表明,所研制的声学系统能够提高加工精度,改善产品表面质量。     

固着磨料加工碳化硅反射镜的微观理论模型

基于固着磨料加工碳化硅反射镜的微观作用原理,从理论上定量分析了金刚石磨料压入碳化硅工件的深度对材料去除率、光学元件表面粗糙度的影响,分别获得了材料去除率数学模型及粗糙度的仿真计算结果.实验与理论模型的对比结果表明:去除率实验值与理论值走势相同并稳定在同一数量级内;粗糙度实验所使用的W1.5,W3.5,W5等丸片获得的粗糙度理论值与实验偏差分别为5.97%,3.19%,3.59%,由此验证了理论分析的正确性.     

Abrasive removal depth for polishing a sapphire wafer by a cross-patterned polishing pad with different abrasive particle sizes

The paper establishes a new theoretical model for abrasive removal depth for polishing a sapphire wafer using chemical mechanical polishing with a polishing pad that has a cross pattern. The theoretical model uses binary image pixel division to calculate the pixel polishing times. An abrasive contact model for single-pixel multiple abrasive particles, to estimate the contact force between a single abrasive particle and the wafer, is then established. When the contact force is calculated, it is possible to calculate the abrasive depth of a single abrasive particle on the surface of the sapphire wafer. Using this theoretical model, carring a numerical simulation with a slurry of the same concentration, but with different abrasive particle diameters, determines the removal volume and average abrasive removal depth at each pixel position and the surface condition of the wafer. The simulation result is also compared with experimental data, in order to verify that the new model is feasible.     

固着磨料加工碳化硅反射镜的实验

考虑固着磨料加工工艺其固着磨料与工件相对运动关系固定,有利于精确加工,提出了采用该工艺加工碳化硅反射镜的方法,利用大颗粒金刚石磨料快速加工出了较好的镜面质量.在工艺实验中,分别测得了W7,W5,W3.5,W1.5 固着磨料丸片在特定转速和压力下对碳化硅材料的去除特性.对多组去除量曲线的分析表明,此工艺不仅有着较高的去除率,而且稳定性良好.对表面粗糙度测量的结果表明,使用W7丸片即可获得粗糙度为42.758 am rms的镜面.减小所用丸片的粒度,工件表面粗糙度随之减小,使用WI.5丸片抛光后,最终获得了粗糙度为1.591 nm rms的光滑镜面.实验结果表明,固着磨料加工碳化硅反射镜工艺在粗研、精研、粗抛等加工阶段内可以取代传统的散粒磨料加工工艺.