A study on the improved performances of OLED using CMP process parameters determined by DOE method

In order to study the chemical-mechanical polishing (CMP) characteristics of indium-tin oxide (ITO) thin film with a sufficient removal amount and a good planarity, the optimal CMP process conditions were determined by using a design of experiment (DOE) approach. The electrical and optical properties, such as current-voltage (I-V) curve and photoluminescence spectrum, were discussed in order to evaluate the possibility of the CMP application for an organic light emitting diode (OLED) device using an ITO film. The electrical I-V characteristics and optical properties of ITO thin film were improved after the CMP process using optimized process conditions compared to that of as-deposited thin film before the CMP process.     

Surface planarization of ZnO thin film for optoelectronic applications

In this paper, surface morphology and optical properties are investigated to find the optimum microstructure of zinc oxide (ZnO) thin films deposited by radio frequency (RF) magnetron sputtering. To achieve a high transmittance and a low resistivity, we examined various film deposition conditions. The transmittance and surface morphology of ZnO thin films were measured by an ultraviolet (UV)-visible spectrometer and atomic force microscopy (AFM), respectively. In order to improve the surface quality of ZnO thin films, we performed chemical mechanical polishing (CMP) by change of process parameters, and compared the optical properties of polished ZnO thin films. As an experimental result, we were able to obtain good uniformity and improved transmittance efficiency by the CMP technique.     

Platinum chemical mechanical polishing (CMP) characteristics for high density ferroelectric memory applications

The key component of ferroelectric random access memory (FeRAM) is a capacitor including a ferroelectric thin film and electrode materials. Platinum is one of the suitable metals which meet requirements such as low resistivity, high thermal stability, and good oxygen resistance. Generally, the ferroelectric and the electrode materials were patterned by a plasma etching process. The application possibility of chemical mechanical polishing (CMP) processes to the patterning of ferroelectric thin film instead of plasma etching was investigated in our previous study for improvement of an angled sidewall which prevents the densification of FeRAM. In this study, the characteristics of platinum CMP for FeRAM applications were also investigated by an approach as bottom electrode materials of ferroelectric material in CMP patterning. The removal rate was increased from 24.81 nm/min by the only alumina slurry (0.0 wt% of H₂O₂ oxidizer) to 113.59 nm/min at 10.0 wt% of H₂O₂ oxidizer. Electrochemical study of platinum and alumina slurry with various concentrations of H₂O₂ was performed in order to investigate the change of the removal rate. The decreased particle size in the alumina slurry with an addition of 10.0 wt% H₂O₂ oxidizer made the improved surface roughness of the platinum thin films. Micro-scratches were observed in all polished samples.     

p-GaN与ITO欧姆接触的研究

针对GaN基发光二极管中p-GaN与透明导电薄膜ITO之间的接触进行研究,尝试找出透明导电层ITO的优化制程条件。将在不同氧流量、ITO厚度及退火温度下制备的透明电极ITO薄膜应用于GaN基发光二极管,来增加电流扩展,减小ITO与p-GaN欧姆接触电阻,降低LED工作电压及提高透过率、增强LED发光亮度。将ITO薄膜应用于218μm×363μm GaN基发光二极管LED,分析其在20 mA工作电流条件下正向电压和光输出功率的变化,在优化条件下制得的蓝光LED在直流电流20 mA下的正向电压3.23 V,光输出效率为23.25 mW。     

铝薄膜CMP影响因素分析

提出了在碱性抛光液中铝薄膜化学机械抛光的机理模型,对抛光液的pH值、磨料、氧化剂浓度对过程参数的影响做了一些试验分析。试验结果表面粗糙度的铝薄膜所需的最优化CMP过程参数:硅溶胶粒径为15～20nm,pH值为10.8～11.2,氧化剂浓度为2.5%～3%。     

聚苯乙烯球掩膜干法粗化提高LED发光效率

采用聚苯乙烯球作为掩膜层,对ITO(氧化铟锡)薄膜进行干法蚀刻实现ITO表面的粗化,提高GaN基大功率LED芯片外量子效率。利用AFM及SEM对ITO表面进行表征,比较了微球尺寸对ITO表面形貌及芯片光电参数的影响。结果表明,ITO表面经过350nm聚苯乙烯球图形化后,在未影响芯片正向电压和波长的前提下所制备的1mm×1mm波长为457nm的大功率LED芯片,亮度增加可达30%以上。     

低翘曲度ITO透明导电膜玻璃的工艺研究

研究了不同厚度ITO膜的大尺寸超薄导电玻璃的翘曲度,ITO膜形成期间基片温度对ITO膜层晶体化程度的影响及不同基片温度下形成的ITO膜层在不同的退火条件下的退火前、后的电阻率和膜压应力.实验发现,ITO膜层的很高的压应力是导致导电膜玻璃翘曲的直接原因;采用室温沉积非晶ITO膜,然后经高温热退火可获得低膜压应力多晶相ITO膜.基于实验结论,提出了一种适合批量生产的低翘曲度ITO膜导电玻璃的制备工艺.     

Design of experiment (DOE) method considering interaction effect of process parameters for optimization of copper chemical mechanical polishing (CMP) process

Chemical mechanical polishing (CMP) has been widely accepted for the metallization of copper interconnection in ultra-large scale integrated circuits (ULSIs) manufacturing. It is important to understand the effect of the process variables such as turntable speed, head speed, down force and back pressure on copper CMP. They are very important parameters that must be carefully formulated to achieve desired the removal rates and non-uniformity. Using a design of experiment (DOE) approach, this study was performed investigating the interaction effect between the various parameters as well as the main effect of the each parameter during copper CMP. A better understanding of the interaction behavior between the various parameters and the effect on removal rate, non-uniformity and ETC (edge to center) is achieved by using the statistical analysis techniques. In the experimental tests, the optimized parameters combination for copper CMP which were derived from the statistical analysis could be found for higher removal rate and lower non-uniformity through the above DOE results.     

ITO衬底上LiTaO3薄膜的制备与介电特性

用溶胶凝胶法在ITO衬底上制备了钽酸锂(LiTaO3)薄膜,利用XRD、SEM和AFM对薄膜的晶向、表面形态等作了表征;研究了不同溶剂对LiTaO3溶胶稳定性的影响和不同退火条件对LiTaO3薄膜结晶的影响;利用Al/LiTaO3/ITO结构,测试了薄膜的介电系数和介电损耗.结果表明:每层薄膜都晶化退火比交替使用焦化、结晶退火能生长出质量更好的LiTaO3薄膜;频率1KHz时,介电损耗约0.4,相对介电系数约53.并讨论了介电损耗增大的原因.     

Cu CMP过程中背压对膜厚一致性影响

在极大规模集成电路Cu布线的化学机械平坦化过程中,抛光后表面薄膜厚度的一致性是检验平坦化能力的重要参数。从抛光过程中晶圆所受背压方面着手,研究了在不同背压参数情况下抛光后表面薄膜的一致性,得出了在工作压力为103 mdaN/cm2(1 kPa=10 mdaN/cm2)时,最佳的背压参数为108 mdaN/cm2。采用此工艺参数进行抛光后得到的晶圆表面薄膜非均匀性为5.04%,即一致性可以达到94.96%,而且此时表面粗糙度为0.209 nm,从而得到了良好的抛光效果,为极大规模集成电路Cu布线化学机械平坦化的进一步发展提供了新的途径。     

采用碳纳米管导电薄膜作为OLED的阳极

采用碳纳米管(CNT)替代ITO作为OLED阳极可以 解决ITO薄膜存在的可弯曲性能差,可靠性低等缺 点,使得柔性显示成为可能。本文采用混合型CNT导电薄膜作为阳极,探讨了CNT薄膜的制备 工艺、掺 杂方式及表面修饰等因素对绿光OLED性能的影响。实验结果表明,P型掺杂对CNT薄 膜的导电性能影响 有限;而PEDOT修饰层可以很好的提高CNT导电薄膜的平整度;此外,采用“十字交叉 ”的阳极形状有助于降低 阳极拐角处毛刺。通过优化器件各参数,制备的PET/CNTs/PEDOT/NPB/ALq₃/LiF/Al绿光OL ED发光效率达 到了195 cd/m²,结果表明采用混合型CNT作为OLED阳极是可行的。     

An efficient polymer solar cell using graphene oxide interface assembled via layer-by-layer deposition

Graphene oxide (GO) is widely used as an interfacial material in applications such as organic light emitting diodes and photovoltaic devices. Herein we report a layer-by-layer (LbL) assembled GO thin film as an anode interfacial layer (AIL) for efficient polymer solar cells (PSCs). The GO thin film is fabricated by alternately depositing cationic polyelectrolyte poly(diallyldimethylammonium chloride) (PDDA) and GO on ITO/glass substrate, which possesses controllable thickness by adjusting LbL deposition frequency. The presence of ultrathin GO films improves the work function of ITO, leading to a better contact between the active layer and ITO anode. With the optimized number of deposition times, the efficiency of 6.04% for the PSC with PDDA-GO bilayer (GO-2) as the AIL was achieved.     

Enhancement of hole injection with an ultra-thin Ag2O modified anode in organic light-emitting diodes

The interface between the organic layer and the Indium Tin Oxide (ITO) layer of an organic light-emitting diode (OLED) is crucial to the performance of the device. An ultra-thin Ag₂O film, used as an anode modification layer, has been employed on ITO surface through the UV-ozone treatment of Ag films. The insertion of this thin film with higher work function enhances the hole injection in the organic light-emitting diode and improves the performance of the devices effectively. The maximum electroluminescence (EL) efficiency of the device with the Ag₂O film is 4.95 cd/A, it is about 60% higher than that of the device without it.     

ICP dry etching ITO to improve the performance of GaN-based LEDs

In order to improve the light efficiency of the conventional GaN-based light-emitting diodes(LEDs), the indium tin oxide(ITO) film is introduced as the current spreading layer and the light anti-reflecting layer on the p-GaN surface.There is a big problem with the ITO thin film’s corrosion during the electrode preparation.In this paper,at least,the edge of the ITO film was lateral corroded 3.5μm width,i.e.6.43%—1/3 of ITO film’s area. An optimized simple process,i.e.inductively couple plasma(ICP),was introduced to solve this problem.The ICP process not only prevented the ITO film from lateral corrosion,but also improved the LED’s light intensity and device performance.The edge of the ITO film by ICP dry etching is steep,and the areas of ITO film are whole. Compared with the chip by wet etching,the areas of light emission increase by 6.43%at least and the chip’s lop values increase by 45.9%at most.     

用白光干涉测量法描述化学机械抛光面

化学机械抛光(CMP)在半导体工业内获得了广泛的赞同,对控制形貌起伏的硅片表面当作首选方法。一种可供选择的基于白光测量原理之上的非接触光学形貌测量法被推出。和大多数商业化只能以纳米精度测量不透明表面的白光干涉测量仪不同,新推出的方法是通过单频相位干涉测量仪(PMI)能够以相似的精度测量透明的可变化反射像的表面结构,这个可变化的反射相也许是由于单层或多层薄膜堆叠在一个底层上的多层表面材料特性所引起的,或者是硅片上其它微结构所引起的。因而,在化学机械抛光加工处理过程中的某些不合格项,例如,碟形腐蚀,可以直接用光学形貌测量法在几秒内做出定量的检测结果。此外,这一方法也能评价附加的,例如特种专用薄膜堆叠层厚的表面特性。由于高精度和高生产能力的结合特征使得这一被提议的方法可能确定为可行的化学机械抛光加工研发和生产的监测方法。     

ITO薄膜的近零介电常数波长的调控研究

近年来,氧化铟锡(ITO)薄膜因其可实现介电常数近零(Epsilon-Near-Zero,ENZ)且易于调制的特性,已经成为非线性光学和微纳光学等领域的研究热点.文章先使用射频磁控溅射法在硅基底上制备ITO薄膜,再通过椭圆偏振光谱仪测试并拟合其光学参数,探究了本底真空度、溅射功率、溅射气压、衬底温度和膜厚等因素对ITO薄膜ENZ波长的调节机制.通过优化工艺,使ITO薄膜最短ENZ波长蓝移至1 094.4 nm,突破了以往文献报道的极限.该研究将ITO薄膜的ENZ波长延伸至近红外短波区域,有望实现微纳光电器件相关领域向短波方向的应用拓展.     

以ZnO为空穴缓冲层的高效率有机电致发光器件

研制了在传统双层有机电致发光器件(OLED) ITO/NPB/AlQ/Al的阳极与空穴传输层间加入ZnO缓冲层的新型器件.研究了加入缓冲层后对OLED性能的影响,并比较了新型与传统OLED的性能,结果表明,新型器件比传统器件的耐压能力有了显著提高;当电压达到7 V时,发光效率提高了35%.分析认为,ZnO缓冲层的加入,改善了界面, 减少了漏电流,并且阻碍了空穴的注入,有利于改善空穴和电子的注入平衡,提高复合效率.     

ITO/PTCDA/p-Si薄膜器件的表面和界面特性研究

界面态对于薄膜器件的性能具有非常重要的影响。有米用真空蒸发和溅射沉积的方法制备了ITO／PTCDA／p—Si薄膜器件,并采用X射线光电子能谱（xPs）和Ar^＋溅射技术对其表面和界面电子态进行了研究。结果表明,在ITO／PTCDA／pSi薄膜器件的界面,不仅ITO与PTCDA薄膜之间存在扩散,PTCDA与Si衬底材料之间也存在扩散现象。此外,每种原子的XPS谱表现出一定的化学位移,并以Cls和Ols谱的化学位移最为显著。     

快速热退火对ITO薄膜及LED芯片性能的影响

采用金属有机化学气相沉积(MOCVD)技术在蓝宝石衬底上制备了GaN基LED外延层,采用磁控溅射法制备了氧化铟锡(ITO)薄膜,ITO薄膜用于制作与p-GaN的欧姆接触.研究了快速热退火温度为550℃,退火时间为200 s时,不同氧气体积流量对ITO薄膜性能及LED芯片光电性能的影响.结果表明:不通氧气时,ITO薄膜的方块电阻和透过率分别为33 Ω/口和93.1％,LED芯片出现电流拥挤效应,其电光转换效率只有33.3％;氧气体积流量为1 cm3/min时,ITO薄膜的方块电阻和透过率分别为70 Ω/口和95.9％,LED芯片的电流扩展不佳,其正向电压较高,电光转换效率为43.8％;氧气体积流量为0.4 cm3/min时,ITO薄膜的方块电阻和透过率分别为58 Ω/口和95.4％,LED芯片的电流扩展最佳,其亮度最高、正向电压最低,电光转换效率较高,为52.9％.     

二氧化锡覆盖层对ITO透明导电薄膜热稳定性的改良

采用射频磁控溅射法在ITO玻璃表面沉积了一层15 nm左右的SnO2薄膜。利用霍尔效应测试仪、四探针电阻测试仪、场发射电子显微镜及紫外–可见–近红外光谱仪分析了所制薄膜的电学性质、表面形貌和光学性质。结果表明,在300~600℃退火后镀有SnO2覆盖层的ITO(SnO2/ITO)薄膜具有相对好的热学稳定性。在600℃退火后,ITO薄膜的方阻和电阻率分别为88.3Ω/□和2.5×10–3.cm,而此时,SnO2/ITO薄膜的方阻和电阻率仅为43.8Ω/□和1.2×10–3Ω.cm。最后,阐述了SnO2覆盖层提高ITO薄膜热稳定性的机制。