分子束外延GaAs／AlGaAs超晶格缓冲层量子阱材料的研究

采用分子束外延技术生长了ＧａＡｓ／ＡｌＧａＡｓ单量子阱得多量子阱材料。采用ＧａＡｓ／ＡｌＧａＡｓ超晶格缓冲层掩埋衬底缺陷，获得的量子阱结构材料被成功地用于制作量子阱激光器。波长为７７８ｎｍ的激光器，最低阈值电流为３０ｍＡ，室温下线性光功率大于２０ｍＷ。     

InGaAs／InP分别限制量子阱激光器的阱数优化设计和实验制备

根据对ＩｎＧａＡｓＰ－ＩｎＰ分别限制量子阱激光器结构的注入效率的分析和利用Ｘ射线衍射结ＩｎＧａＡｓＰ－ＩｎＰ２０个周期的多量子阱结构异质界面的研究，设计，制备了４个阱的ＩｎＧａＡｓＰ－ＩｎＰ分别限制量子阱激光器结构，利用质子轰击制得条形激光器，阈值电流为１００ｍＡ，直流室温连续工作，单面输出外微分子效率为３６％。     

InGaAs／GaAs应变量子阱中的激子发光动力学

本文详细测量并分析了ＩｎＧａＡｓ／ＧａＡｓ应变量子阱中的激子发光衰退特性，研究了激子发光寿命与Ｉｎ组分和阱宽的关系．发现Ｉｎ组分增大时，激子寿命变短，而发光寿命与阶宽的关系不大．文章分析了影响发光寿命的诸多因素，指出在ＩｎＧａＡｓ／ＧａＡｓ量子阱中，由合金无序造成的散射对激子发光寿命有重要的影响．     

由浅离子注入实现的MQW混合

用浅Ｐ＾＋离子注入ＩｎＧａＡｓ／ＩｎＧａＡｓＰ应变多量子阱（ＭＱＷ）激光器Ｈ２／Ｎ２混合气氛下的快速退火,体内ＭＱＷ层发生组份混合（ｉｎｔｅｒｍｉｘｉｎｇ）,导致器件的带隙波长蓝移（ｂｌｕｅ ｓｈｉｆｔ）,结构的光荧光（ＰＬ）峰值波长向短波方向移动了７６ｎｍ。作者认为,有源区中的应力对量子阱混合起到了十分关键性的作用。     

GaAs/GaAlAs量子阱激子能量调谐的新方法

用分子束外延技术（ＭＢＥ）在ＧａＡｓ量子阱中嵌入ＩｎＡｓ亚单层,可以有效地改变量子阱的激子能量,从而达到波长调谐的目的．激子能量的调谐范围取决于量子阱宽度,并和ＩｎＡｓ层厚度有关．利用有效质量近似,计算给出了能量调谐曲线,结果与实验符合较好．本文给出的结果提供了一种改变量子阱发光器件波长的新方法．     

浅离子注入InGaAs/InGaAsP SL-MQW激光器的混合蓝移效应

利用３００ｋｅＶ的Ｐ＋离子对ＩｎＧａＡｓ／ＩｎＧａＡｓＰ应变层多量子阱（ＭＱＷ）激光器外延结构实施浅注入,经Ｈ２／Ｎ２混合气氛下的快速退火,结构的光致发光（ＰＬ）峰值波长蓝移了７６ｎｍ,所作宽接触激光器的激射波长蓝移了７７．９ｎｍ．发现具有应变结构的ＩｎＧａＡｓ／ＩｎＧａＡｓＰＭＱＷ,在较低的诱导因素作用下即可产生较大的量子阱混合（ｉｎｔｅｒｍｉｘｉｎｇ）效应     

半导体激光器激活区中一维量子线的研制

采用一维量子线阵列结构作为激活区的半导体激光器与采用二维量子阱结构激活区的常用激光器相比，具有许多优越的性能。利用能量为４０ＫｅＶ的Ｇａ＾＋离子注入到Ａｌ０．３Ｇａ０．７Ａｓ／ＧａＡｓ二维量子阱，再经白光快速退火，制备了线宽５００￣４０ｎｍ的一维量子线并研究其光电特性。     

GaAs／GaAlAs中红外量子阱探测器和双色量子阱红外探测器

本文报道我们在国内率先研制的ＧａＡｓ／ＧａＡｌＡｓ中红外（３～５μｍ）量子阱探测器和双色量子阱红外探测器的制备和性能．ＧａＡｓ／ＧａＡｌＡｓ中红外量子阱探测器是光伏型，探测峰值波长为５．３μｍ，８５Ｋ下的５００Ｋ黑体探测率为３e９ｃｍ·Ｈｚ１／２／Ｗ，峰值探测率达到５×１０１１ｃｍ·Ｈｚ１／２／Ｗ，阻抗为５０ＭΩ．ＧａＡｓ／ＧａＡｌＡｓ双色量子阱红外探测器是偏压控制型的两端器件，在零偏压下该探测器仅在３～５μｍ波段有响应，响应峰值波长为５．３μｍ，８５Ｋ温度下５００Ｋ黑体探测率为３e９ｃｍ     

量子阱无序的窗口结构InGaAs/GaAs/AlGaAs量子阱激光器

对ＳｉＯ２薄膜在快速热退火条件下引起的空位诱导ＩｎＧａＡｓ／ＧａＡｓ应变量子阱无序和ＳｒＦ２薄膜抑制其量子阱无序的方法进行了实验研究。并将这两种技术的结合（称为选择区域量子阱无序技术）应用于脊形波导ＩｎＧａＡｓ／ＧａＡｓ／ＡｌＧａＡｓ应变量子阱激光器，研制出具有无吸收镜面的窗口结构脊形波导量子阱激光器。该结构３μｍ条宽激光器的最大输出功率为３４０ｍＷ，和没有窗口的同样结构的量子阱激光器相比，最大输出功率提高了３６％。在１００ｍＷ输出功率下，发射光谱中心波长为９７８ｎｍ，光谱半宽为１．２ｎｍ。平行和垂直方向远场发散角分别为７．２°和３０°     

用于氦原子泵浦的1080nm半导体激光器

ＩｎＧａＡｓ／ＧａＡｓ 应变量子结构半导体激光器有其特有的波长输出范围,介绍了１ ０８０ ｎｍ ＩｎＧａＡｓ／ＧａＡｓ 应变量子阱激光器的结构、典型的特性参数及其用途。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.