Flip-around结构高速采样保持电路的设计

分析了Flip-around结构采样保持电路产生失真的原因。采用增加哑开关管的自举开关,消除与输入有关的电荷注入和时钟馈通;采用增益增强技术,提高运算放大器的直流增益,并通过调整辅助运放的负载电容大小,实现主运放建立时间特性的优化。设计了一个Flip-around结构的高速采样保持电路;对电路各模块进行了功能仿真,给出了整个采样保持电路的仿真结果。     

一种欠采样应用的高精度低功耗采样/保持电路

设计了一种可用于欠采样情况的高精度、低功耗采样/保持电路。在40 MHz时钟频率下,采样90 MHz输入信号时可达11位以上精度。采用电容翻转结构的采样/保持电路,以消除电容失配的影响;使用栅压自举开关,以提高线性度,实现欠采样输入;并设计了一种高增益、大带宽、低功耗的增益自举套筒式共源共栅(telescopic cascode)运算放大器。电路采用SMIC 0.35μmCMOS工艺实现,电源电压为3.3 V,功耗仅为7.6 mW。     

高性能CMOS采样保持电路的设计

给出了一种适合于高速模数转换器(ADCs)的高性能采样/保持电路的设计方法,该电路采用全差分结构、底板采样和高性能增益自举运算放大器来抑制电荷注入误差和时钟馈通误差,从而极大的减小了非线性误差,保证了较高的精度.     

基于峰值保持器PKD01的采样保持电路

介绍了一种用高响应速度和高精度峰值保持器PKD01来设计采样保持电路的设计方法。该方法采用跨导型运算放大器,同时具有通频带宽、线性好、峰值保持精度高等优点,可快速、准确地检测并保持峰值脉冲信号。     

一种用于流水线ADC采样保持电路的设计

介绍一种用于流水线ADC的采样保持电路。该电路选取电容翻转式电路结构,不仅提高整体的转换速度,而且减少因电容匹配引起的失真误差;同时使用栅压自举采样开关,有效地减少了时钟馈通和电荷注入效应;采用全差分运算放大器能有效的抑制噪声并提高整体的线性度。该采样保持电路的设计是在0.5μm CMOS工艺下实现,电源电压为5 V,采样频率为10 MHz,输入信号频率为1 MHz时,输出信号无杂散动态范围(SFDR)为73.4 dB,功耗约为20 mW。     

一种100 MHz采样频率CMOS采样/保持电路

设计了一种高速采样保持电路。该电路采用套筒级联增益自举运算放大器,可在达到高增益高带宽的同时最大程度地减小功耗;优化了采样开关,获得了良好的线性度,减少了输出误差;电路的采样频率达到100 MHz。采用Charter半导体公司的0.35μm标准CMOS工艺库,对整体电路和分块电路进行了性能分析和仿真。     

一种用于12位250MSPS流水线ADC的中频采样前端

设计了一种具有中频采样功能的流水线ADC采样保持前端电路.采样保持前端电路采用基于开关电容的底板采样翻转式结构,运算放大器采用了米勒补偿型两级结构以提高信号摆幅,采样开关采用了消除衬底偏置效应的自举开关以提高中频采样特性.该采样保持前端电路被运用于一种12位250 MSPS流水线ADC,电路采用0.18μm lP5M 1.8 V CMOS工艺实现,测试结果表明该ADC电路在全速采样条件下对于20 MHz的输入信号得到的SNR为69.92 dB,SFDR为81.17 dB,-3 dB带宽达700 MHz以上,整个前端电路的功耗为58 mW.     

一种采用低阈值技术实现的高速采样保持电路

提出了一种采用低阈值技术实现的高速采样保持电路.采样保持电路采用电容翻转式架构,利用栅压自举开关技术提高了采样开关的线性度,通过下极板采样技术减小了电荷注入效应.提出的放大器与传统的套筒式共源共栅极放大器在电路结构上相同.不同点在于,该放大器采用了低阈值设计技术.优势在于,在特定工艺下通过低阈值器件补偿可实现高增益带宽...     

适用于12 bit流水线ADC采样保持电路的设计

介绍了一种用于12 bit,20 MS/s流水线模数转换器前端的高性能采样/保持电路。该电路采用全差分结构、底极板采样来消除电荷注入和时钟馈通误差。采用栅压自举开关,并通过对电路中的开关进行组合优化,极大地提高了电路的线性性能。同时,运算放大器采用折叠式增益增强结构,以获得较高的增益和带宽。采用CSMC公司的0.5μm CMOS工艺库,对电路进行了仿真和流片。结果表明,在5 V电源电压下,采样频率为20 MHz,采样精度可达到0.012%,在输入信号为奈奎斯特频率时,无杂散动态范围(SFDR)为76 dB。     

12位50 MHz流水线ADC采样保持电路实现

对采样保持电路进行研究,对增益提高的运算放大器进行2阶系统模拟,得到最佳设计参数;提出一种栅压自举开关电路结构;设计了一个用于12位50 MHz流水线A/D转换器的采样保持电路.采用SMIC 0.35 μm混合CMOS工艺,对整个A/D转换器进行实现.测试结果表明,采样保持电路完全满足设计要求.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.