共查询到16条相似文献,搜索用时 703 毫秒
1.
概述了化学镀镍/化学镀钯/浸金涂(镀)覆层的优点,它比起化学镀镍/浸金,不仅更适用于IC封装,而且提高了可靠性,降低了成本。 相似文献
2.
IC封装载板的新型表面涂饰层——ENEPIG 总被引:1,自引:0,他引:1
文章介绍一种新型的化学镀镍化学镀钯与浸金表面涂饰层,克服了化学镀镍浸金涂层的缺点,更加适合于IC封装载板上应用。 相似文献
3.
有机基板被广泛应用于电子封装领域,常见的表面处理工艺包括电镀镍金、化学镍金、浸锡、浸银等工艺。在众多表面处理工艺中,化学镍钯浸金工艺因其具有较好的综合性能展现出显著优势。化学镍钯浸金工艺是在化学镍金工艺的基础上增加化镀钯处理,采用该工艺先对基板表面进行化镀镍处理,再进行化镀钯处理,最后完成化学浸金处理。钯镀层可以防止金在沉积过程中腐蚀镍镀层以及阻挡镍向金属间化合物(IMC)层扩散。利用X-Ray、电子扫描显微镜(SEM)、聚焦离子束(FIB)等图像分析方法,对比了不同厂商的化学镍钯浸金镀层的厚度、微观形貌及质量,结果表明,平整且致密的钯镀层可以有效避免镍腐蚀现象。 相似文献
4.
PCB技术的革新与进步 总被引:2,自引:0,他引:2
文章概述了近几年来在PCB工业中生产技术的革新与进步情况,特别是直流电镀(镀层均匀性、填孔镀等)、表面涂(镀)覆(化学镀镍/钯浸金和直接浸金等)技术的革新与进步,推动了PCB工艺技术的发展。 相似文献
5.
概述了化学镍/化学钯/浸金(ENEPIG)表面涂(镀)覆层的优点。它比化学镍/浸金(ENIG)有更好的可焊接性和焊接可靠性。化学镍/化学钯/浸金表面涂(镀)覆层应该是有发展前景的。 相似文献
6.
本文针对ENEPIG(化镍钯浸金)技术应用于封装基板表面处理,在化镍钯浸金工艺过程中,通过对镍层上化学镀钯控制、浸金控制,获得精确的沉积厚度和金层均匀性,达到良好的接触面。并就浸金过程中的渗金问题进行优化控制,达到焊区小间距的需求。通过对ENEPIG表面处理焊区和电镀镍金表面处理焊区的Wire Bonding(引线键合)能力、可焊性、抗老化能力进行试验比较,验证了本ENEPIG控制技术同时具有优于电镀镍金的引线键合可靠性和锡焊可靠性。本ENEPIG控制技术所获得优异可靠性的表面处理,并且满足无铅组装工艺所有需求,非常适用于封装基板的表面处理制造。 相似文献
7.
挠性ENEPIG镀层化学镀镍镀钯浸金(ENEPIG)镀层是目前高端PCB表面处理的最佳选择,适合于焊锡连接和打线连接,并有防止铜镍金属氧化物产生的高可靠性。但普通ENEPIG用于挠性印制板存在不耐弯曲的问题。Atotech 相似文献
8.
9.
10.
化学镀镍镀钯浸金表面处理工艺概述及发展前景分析 总被引:1,自引:0,他引:1
随着电子封装系统集成度逐渐升高及组装工艺多样化的发展趋势,适应无铅焊料的化学镀镍镀钯浸金(ENEPIG)表面处理工艺恰好能够满足封装基板上不同类型的元件和不同组装工艺的要求,因此ENEPIG正成为一种适用于IC封装基板和精细线路PCB的表面处理工艺。ENEPIG工艺具有增加布线密度、减小元件尺寸、装配及封装的可靠性高、成本较低等优点,近年来受到广泛关注。文章基于对化学镍钯金反应机理的简介,结合对镀层基本性能及可靠性方面的分析,综述了ENEPIG表面处理工艺的优势并探讨了其发展前景。 相似文献
11.
Menahem Ratzker Adam Pearl Michael Osterman Michael Pecht George Milad 《Journal of Electronic Materials》2014,43(11):3885-3897
Surface finishes are used to protect exposed copper metallization in printed circuit boards from oxidation and to provide a solderable surface on which to mount electronic components. While it is true that some people have called electroless nickel electroless palladium immersion gold (ENEPIG) a “universal finish” for a wide range of applications from wire bonding to solder interconnects, this paper provides a review of the current literature on ENEPIG and assesses its overall capabilities compared to other surface finishes. Gaps in understanding the performance of ENEPIG as a printed wiring board surface finish are identified and further testing is recommended. 相似文献
12.
《Microelectronics Reliability》2015,55(1):231-237
The criteria of mechanical reliability in solder joints can be identified and described by comparative evaluation via drop test and high speed pendulum impact test. Systematic samples of assembly and attachment joints with various Pd additions were employed and investigated in this study. The statistical values of mechanical performances were calculated and compared. Better high speed impact performance of SAC305/ENEPIG attachment joints with 0.06 μm Pd layers was confirmed owing to the single Cu6Sn5 phase growth. However, the comparative measurement of the better performance on drop testing exhibited in ENEPIG/SAC305/immersion Sn assembly joints with 0.1 μm Pd layers deposit resulted from the thinner and layer-type IMC growth. The correlation between the cracks propagation and Pd addition was established on the basis of the elemental X-ray color mapping via Field-Emission Electron Probe Microanalyzer (FE-EPMA). It is expected that through comparison between impact and drop test in mechanical reliability, a criterion of joints reliability can be established. Besides, the optimal Pd layer deposit for the ENEPIG surface finish in the attachment and assembly solder joints was demonstrated and confirmed. 相似文献
13.
MAU外气空调箱是洁净室HVAC空调系统的核心设备,通过对MAU空调箱的研究,结合薄膜太阳能电池板生产厂房洁净室的要求和特点,设计了MAU空调箱控制系统方案,并根据实际应用调整了控制方案,优化了PID控制器参数,实现了MAU空调箱稳定、精确的运行效果,为太阳能电池板的生产提供了保障。 相似文献
14.
15.
16.
Interfacial reactions and joint reliability of Sn-3.0Ag-0.5Cu solder with two different surface finishes, electroless nickel-immersion
gold (ENIG) and electroless nickel-electroless palladium-immersion gold (ENEPIG), were evaluated during a reflow process.
We first compared the interfacial reactions of the two solder joints and also successfully revealed a connection between the
interfacial reaction behavior and mechanical reliability. The Sn-Ag-Cu/ENIG joint exhibited a higher intermetallic compound
(IMC) growth rate and a higher consumption rate of the Ni(P) layer than the Sn-Ag-Cu/ENEPIG joint. The presence of the Pd
layer in the ENEPIG suppressed the growth of the interfacial IMC layer and the consumption of the Ni(P) layer, resulting in
the superior interfacial stability of the solder joint. The shear test results show that the ENIG joint fractured along the
interface, exhibiting indications of brittle failure possibly due to the brittle IMC layer. In contrast, the failure of the
ENEPIG joint only went through the bulk solder, supporting the idea that the interface is mechanically reliable. The results
from this study confirm that the Sn-Ag-Cu/ENEPIG solder joint is mechanically robust and, thus, the combination is a viable
option for a Pb-free package system. 相似文献