聚合物基纳米复合材料热导率计算

讨论了聚合物基高导热高绝缘纳米复合材料的导热机理与常用的导热理论模型。考虑到填充率、温度等的影响，用不同的理论模型计算了氧化铝纳米颗粒填充环氧树脂的热导率，并结合相关研究实验对不同的导热理论模型进行分析比较。通过添加高导热填料可显著提高聚合物材料的热导率，且热导率随填料填充率的增大而显著增大。热导率随在300 K到373 K的范围内，复合材料的热导率随着温度的升高而增大；而当温度超过373 K，复合材料的热导率则随着温度的升高缓慢下降。     

The multiscale modeling and data mining of high-temperature dielectrics of SiO2/SiO2 composites

Quartz fibre-reinforced silicon dioxide ceramic(SiO2/ SiO2) composites have long been the primaryceramic material used for hypersonic missile radomes,owing to its outstanding thermal shock resistance, lowand stable dielectric properties and its ease of fa…     

Electrochemical behaviors of novel composite polymer electrolytes for lithium batteries

A novel composite polymer electrolyte was prepared by blending an appropriate amount of LiC104 and 10% (mass fraction) fumed SiO2 with the block copolymer of poly (ethylene oxide) (PEO) synthesized by poly (ethylene glycol) (PEG) 400 and CH2CI2.The ionic conductivity, electrochemical stability, interfacial characteristic and thermal behavior of the composite polymer electrolyte were studied by the measurements of AC impedance spectroscopy, linear sweep voltammetry and differential scanning calorimetry (DSC), respectively. The glass transition temperature acts as a function of salt concentration, which increases with the LiC104 content.Lewis acid-base model interaction mechanism was introduced to interpret the interactive relation between the filled fumed SiO2 and the lithium salt in the composite polymer electrolyte. Over the salt concentration range and the measured temperature, the maximum ionic conductivity of the composite polymer electrolyte (10^4.41 S/cm) appeared at EO/Li=25 (mole ratio) and 30~C, and the beginning oxidative degradation potential versus Li beyond 5 V.     

多孔微晶玻璃导热理论模型的验证

为了研究多孔微晶玻璃的孔隙率与导热系数之间的关系,以伟晶岩为原料,采用粉末烧结法和添加造孔剂方法,烧制出乳白色多孔微晶玻璃.根据多孔微晶玻璃的内部结构和孔隙率情况提出3种热传导的理想等效物理模型,推导出数学公式,验证了多孔微晶玻璃的导热系数.实验结果表明,实验测得的多孔微晶玻璃导热系数值与理论导热系数之间具有较好的一致性.如果已知多孔微晶玻璃的孔隙率,那么可以利用理想等效物理模型来推算多孔微晶玻璃的导热系数.     

双马型聚酰亚胺／SiO_2杂化材料的合成

本文主要应用Ｓｏｌ－Ｇｅｌ法合成了双马型聚酰亚胺／ＳｉＯ２的分子杂化材料。应用ＦＴＩＲ、ＳＥＭ及热分析对杂化材料的机理、结构及热性能进行了表征，这为新材料的研究奠定了一定的理论基础。     

EVA插层复合材料的取向结构对阻燃性能的影响

利用蒙脱土(MMT)特殊的片层结构,采用挤出工艺、熔融插层法制备了乙烯醋酸乙烯脂/蒙脱土(EVA/MMT)和乙烯醋酸乙烯脂/有机蒙脱土(EVA/OMMT)纳米复合材料,用锥形量热仪测试并分析了材料的燃烧性能。结果表明,添加OMMT的复合材料具有阻燃作用;复合材料中蒙脱土片层的(横、纵)取向影响材料的阻燃性;横向取向的EVA/OMMT复合材料有更低的热释放速率和质量损失速率,具有较好的阻燃性。通过扫描电镜(SEM)表征不同取向材料燃烧后炭渣的形貌,表明形成的炭层也为横、纵取向,解释了插层复合材料的横、纵取向对材料阻燃性的影响。     

Preparation and properties of PEO/LiClO4/KH560-SiO2 composite polymer electrolyte by sol-gel composite-in-situ method

Composite polymer electrolytes based on polyethylene oxide（PEO） were prepared by using LiClO4 as doping salt and silane-modified SiO2 as filler. SiO2 was formed in-situ in （PEO）8LiClO4 matrix by the hydrolysis and condensation reaction of Si（OC4H9）4. The crystallinity,morphology and ionic conductivity of composite polymer electrolyte films were examined by differential scanning calorimetry,scanning electron microscopy,atom force microscopy and alternating current impedance spectroscopy,respectively. Compared with the crystallinity of the unmodified SiO2 as inert filler,that of composite polymer electrolytes is decreased. The results show that silane-modified SiO2 particles are uniformly dispersed in （PEO）8LiClO4 composite polymer electrolyte film and the addition of silane-modified SiO2 increases the ionic conductivity of the （PEO）8LiClO4 more noticeably. When the mass fraction of SiO2 is about 10%,the conductivity of （PEO）8LiClO4-modified SiO2 attains a maximum value of 4.8×10^-5 S·cm^-1.     

金刚石粉/环氧树脂胶粘剂的导热性能

以金刚石粉、环氧树脂E-20、甲醚化氨基树脂、助剂制备成导热绝缘胶粘剂,在130℃保温30 min,210℃保温10 min固化.胶粘剂固化后导热系数随金刚石粉体积含量增加先增大后减少,存在一个极大值.相同金刚石粉体积含量下,较大粒径的金刚石粉之间能形成更好的物理接触,有利于导热性能的提高.用常用经验导热模型拟合胶粘剂固化后的导热系数结果表明:在金刚石粉体积分数小于16.6%时,Maxwell方程能较好拟合胶粘剂的导热系数;体积分数为16.6%～44.7%时,Bruggeman和Agari模型能较好地描述胶粘剂的导热系数.     

原位自生成陶瓷相增强铝基复合材料的研究

采用粉末冶金法成功制备了原位生成陶瓷相增强AI基复合材料。应用X射线衍射仪进行了物相组成测试,发现含10％－20％（重量百分比） SiO2复合材料的最终物相均为MgAI2O4、MgO、Mg2Si、Si和AI。研究了SiO2含量对复合材料硬度、密度、电导率、抗压强度、磨擦磨损等性能的影响表明,随SiO2含量的增加,复合材料的硬度和密度增加,电导率、抗压强度和体积磨损量减小,而磨擦系数却增加。     

Effect of sintering temperature on the microstructure and thermal conductivity of Al/diamond composites prepared by spark plasma sintering

Spark plasma sintering was used to fabricate Al/diamond composites.The effect of sintering temperature on the microstructure and thermal conductivity(TC) of the composites was investigated with the combination of experimental results and theoretical analysis.The composite sintered at 550℃shows high relative density and strong interfacial bonding,whereas the composites sintered at lower(520CC) and higher(580-600℃) temperatures indicate no interfacial bonding and poor interfacial bonding,respectively.High ...     

Property of three-dimensional silica composites

Silica fibers-reinforced, fused silica composites were fabricated with repeated vacuum-assisted liquid-phase infiltration. The mechanical properties, thermal properties, and ablative properties of the samples were evaluated. The effect of the silica fiber content and treatment temperature on the flexural strength of the three-dimensional SiO2 （3-D SiO2） composites also was investigated. The SiO2 composites show good mechanical properties and excellent ablative performance. The flexural strength increases with an increase in silica fiber content, and decreases with an increase in treatment temperature. When the volume fraction of the silica fiber is 50vo1% and the treatment temperature is 700℃ the flexural strength of the composites reaches a maximum value of 78 MPa. By adding cyclohexanone surfactant, the infiltration property can be largely improved, resulting in the density of SiO2 composites increasing up to 1.65 g/cm^3. The fracture surfaces of the flexural specimens observed using SEM, show that the pseudoplasticity and the toughening mechanisms of the composites are caused by absorption of a lot of energy by interface debonding and fiber pulling out.     

四针状氧化锌晶须／EVA复合胶膜导热性能研究

采用溶液混合以及流延成膜工艺制备四针状氧化锌晶须（T-ZnOw）／EVA导热型复合胶膜。分析T-ZnOw含量对胶膜热导率的影响。结果表明：T-znow能够有效地提高复合胶膜的热导率;采用质量分数为1．5％的KH570对T-ZnOw进行表面处理,红外光谱显示KH570接枝T-Znow表面成功,经过处理之后复合胶膜热导率进一步提高;最后将复合胶膜进行交联处理,交联后的胶膜热导率表现出小幅上升趋势。     

Effects of Microstructure Modification on Properties of AIN/BN Composites

It is very difficult to prepare full-densified aluminum nitride-boron nitride(AIN/BN)composite ceramics with homogeneous microstructure and high thermal conductivity.Spark plasma sintering(SPS)was used to fully densify the AIN/BN composites in this work.Microstructure,mechanical properties and thermal conductivity of the SPS sintered AIN/BN composites with 5-30 vol% BN were investigated.The results show that the microstructure of composites is fine and homogenous,and the AIN/BN composites exhibit high mechanical properties.To promote the growth of AIN grains and modify the distribution of grain boundary in AIN/BN composites,a heat treating methodology was introduced through gas pressure sintering(GPS).This processing was significantly beneficial to enhancing the thermal conductivity of the specimen.The thermal conductivity of AIN/BN composites with 5-30 vol% BN reached 60 W/m K after the samples were treated by GPS.     

Effects of Mierostructure Modification on Properties of MN/BN Composites

It is very difficult to prepare full-densified aluminum nitride-boron nitride(AIN/BN) composite ceramics with homogeneous microstructure and high thermal conductivity.Spark plasma sintering (SPS)was used to fully densify the AlN/BN composites in this work.Microstructure,mechanical properties and thermal conductivity of the SPS sintered AIN/BN composites with 5-30 vol% BN were investigated.The results show that the microstructure of composites is fine and homogenous,and the AIN/BN composites exhibit high mechanical properties.To promote the growth of AlN grains and modify the distribution of grain boundary in AIN/BN composites,a heat treating methodology was introduced through gas pressure sintering(GPS).This processing was significantly beneficial to enhancing the thermal conductivity of the specimen.The thermal conductivity of AIN/BN composites with 5-30 vol% BN reached 60 W/m K after the samples were treated by GPS.     

Electric heating property from butyl rubber-loaded boron carbide composites

We researched the electric heating property from butyl rubber-loaded boron carbide composite. The effects of boron carbide content on bulk resistivity, voltage-current characteristic, thermal conductivity and thermal stability of boron carbide / butyl rubber （IIR） polymer composite were introduced. The analysis results indicated that the bulk resistivity decreased greatly with increasing boron carbide content, and when boron carbide content reached to 60%, the bulk resistivity achieved the minimum. Accordingly, electric heating behavior of the composite is strongly dependent on boron carbide content as well as applied voltage. The content of boron carbide was found to be effective in achieving high thermal conductivity in composite systems. The thermal conductivity of the composite material with added boron carbide was improved nearly 20 times than that of the pure IIR. The thermal stability test showed that, compared with pure IIR, the thermal stable time of composites was markedly extended, which indicated that the boron carbide can significantly improve the thermal stability of boron carbide / IIR composite.     

用于降低接触热阻的复合黏结材料的制备优化

基于提高吸附床的导热性能,研制一种可涂于吸附床与吸附剂之间降低接触热阻的耐高温耐腐蚀的高导热复合黏结材料。通过稳态试验研究导热填料、稀释剂与偶联剂等因素对复合黏结材料热导率的影响,采用正交试验方法优化复合黏结材料的配制方案。研究结果表明:复合黏结材料的导热性能随着Al₂O₃导热填料的质量分数的增加而提高,采用10 μm Al₂O₃导热填料粒子的导热性能略高于采用35 μm Al₂O₃导热填料粒子的复合黏结材料,10 μm Al₂O₃导热填料粒子用质量分数8%的偶联剂处理,复合黏结材料的热导率最高。采用适当配比的导热填料、稀释剂与偶联剂能显著提高复合黏结材料的热导率。     

离子喷涂W-Cu电子封装材料的组织与性能

采用等离子喷涂工艺制备了W Cu电子封装材料，并对该电子封装材料的微观组织和热物理性能进行了研究. 结果表明，在内部送粉条件下，复合材料中钨的收得率要高于外部送粉条件下复合材料中钨的收得率；在内部送粉条件下，功率对铜氧化的影响并不明显；而在外部送粉条件下，随着功率的提高，铜的氧化明显增多；由于氧化物和孔隙等的存在，利用大气等离子喷涂工艺制备的复合材料的导热率远远低于根据混合法则计算的理论值. 这为后续实验研究提供了重要的参考依据.     

Effects of EVA Latex on the Properties of Glass-fiber/Magnesium-oxychloride Cement Composites

1 IntroductionMagnesiumOxychloride Cement (MOC) or Sorel Ce-ment ,discovered by Sorel in1867 ,is a kind of air-curi-ng colloid material and has many advantages over othercements,including excellent fire retardance ,a lowheatconductivity coefficient , good abradability and corrosionresistance against organic solvents and sulphides . Fur-thermore ,it requires no maintenance under wet condi-tions . For many years , GF/MOC composites have beensuccessfully applied in many fields . However , G…     

Effects of microstructure modification on properties of AlN/BN composites

It is very difficult to prepare full-densified aluminum nitride-boron nitride （AIN/BN） composite ceramics with homogeneous microstructure and high thermal conductivity. Spark plasma sintering （SPS） was used to fully densify the AIN/BN composites in this work. Microstructure, mechanical properties and thermal conductivity of the SPS sintered AIN/BN composites with 5-30 vol% BN were investigated. The results show that the microstructure of composites is fine and homogenous, and the AIN/BN composites exhibit high mechanical properties. To promote the growth of AIN grains and modify the distribution of grain boundary in AIN/BN composites, a heat treating methodology was introduced through gas pressure sintering （GPS）. This processing was significantly beneficial to enhancing the thermal conductivity of the specimen. The thermal conductivity of AIN/BN composites with 5-30 vol% BN reached 60 W/m K after the samples were treated by GPS.     

倒相法制备PVDF-HFP基复合微孔聚合物电解质

为改善纳米粒子在聚合物电解质中的分散效果,采用倒相制膜法,以纳米SiO₂为填料,以OP-10为分散剂,制备复合微孔聚偏氟乙烯-六氟丙烯基电解质PVDF-HFP-SiO₂(OP-10)．用SEM、XRD、交流阻抗法等测试手段对电解质的微观形貌、内部结构和电化学相关性能等进行表征,结果表明:SiO₂的加入降低了聚合物电解质膜的结晶度,增强了电解质的拉伸强度,提高了PVDF-HFP-SiO₂(OP-10)聚合物电解质的电导率,在20 ℃时,可达到490×10-3 S·cm-1,电化学稳定窗口为53 V,电解质的离子迁移数为083．分散剂OP-10的加入改善了纳米SiO₂与基质的界面相容性,改善了SiO₂在基质中的分散度．