Molecular beam epitaxy synthesis of Si1−yCy and Si1−x−yGexCy alloys and Ge islands using an electron cyclotron resonance argon/methane plasma

We report the growth of Si_1−yC_y and Si_1−x−yGe_xC_y alloys on Si(001) by electron cyclotron resonance plasma-assisted Si molecular beam epitaxy using an argon/methane gas mixture. Various Si/Si_1−yC_y and Si/Si_1−x−yGe_xC_y multilayers have been grown and characterized principally by X-ray diffraction and Raman spectroscopy. The influence of growth parameters and electron cyclotron resonance plasma source operating conditions on the C substitutional incorporation was studied. Under optimum growth conditions the structures show good structural properties and sharp interfaces with carbon being essentially substitutionally incorporated up to concentrations of 1%. No significant carbon incorporation was measured in films grown under a high methane partial pressure without plasma excitation. Si_1−x−yGe_xC_y layers grown with this technique exhibit the strain compensation and enhanced thermal stability expected for these ternary alloys. Carbon pre-deposition of Si through surface exposure to the argon/methane plasma is shown to act as an antisurfactant on the growth of Ge islands by suppressing the formation of a Ge wetting layer on the surface.     

Bulk Si1−xGex single- and poly-crystals: a new prospective material for electronics

Si_1−xGe_x is a prospective material for electronics. This is mostly because Si_1−xGe_x-based technology is close to silicon-based technology, which is advanced, widely applicable, and cheap. The majority of work on this material is devoted to Si_1−xGe_x-based heteroepitaxy, and in particular to the Si_1−xGe_x/Si system; few publications are devoted to bulk single-crystal. Here we focus on some interesting properties of bulk Si_1−xGe_x solid solutions. First, under heat treatment and alpha- and beta-irradiation the efficiency of defect introduction decreases with the increase of Ge composition of the Si_1−xGe_x single-crystal. This is because Ge atoms in a crystal lattice are annihilation centers for primary defects. Hence, this material is more resistant to temperature and radiation than silicon. Second, it is known that, since Z(Ge)Z(Si), the sensitivity of the material to irradiation should increase with the concentration of Ge. We show that Si_1−xGe_x nuclear detectors have efficiency three times higher than silicon detectors. Finally, we note that one of the major problems in materials based on solid solutions is the composition uniformity. Our investigations on the influence of composition fluctuations on material properties have shown that the material has a sufficient uniformity at x<0.1. Such an alloy is a prospective material for electronics.     

Epitaxial growth of strained Si1−yCy films by the hot-wire cell method and its application to metal oxide semiconductor devices

We succeeded in obtaining strained Si_1−yC_y films at a substrate temperature of 200 °C by the hot-wire cell method. The substitutional carbon concentration in films annealed at 700 °C was 0.9%, while it was limited to 0.13% for a sample grown by gas-source molecular beam epitaxy (MBE) at a substrate temperature of 700 °C. We investigated the thermal stability of strained Si_1−yC_y films for device application. Annealing at over 900 °C caused the formation of 3C-SiC and relaxation of the strain occurred. From this result, we found that the process temperature should be lower than 800 °C. A low-temperature MOSFET process, in which all process temperatures after deposition of Si_1−yC_y were lower than 800 °C, was developed and a strained Si_1−yC_y MOSFET was fabricated.     

Preparation of B-doped a-Si1−xCx:H films and heterojunction p–i–n solar cells by the Cat-CVD method

B-doped a-Si_1−xC_x:H films for a window layer of Si thin film solar cells have been prepared by the Cat-CVD method. It is found that C is effectively incorporated into the films by using C₂H₂ as a C source gas, where an only little C incorporation is observed from CH₄ and C₂H₆ under similar deposition conditions. Using a-Si_1−xC_x:H films grown from C₂H₂, heterojunction p–i–n solar cells have been prepared by the Cat-CVD method. The cell structure is (SnO₂ Asahi-U)/ZnO/a-Si_1−xC_x:H(p)/a-Si:H(i)/μc-Si:H(n)/Al. The obtained conversion efficiency was 5.4%.     

Growth of high-quality relaxed SiGe films with an intermediate Si1−yCy layer for strained Si n-MOSFETs

High quality and thin relaxed SiGe films were grown on Si (0 0 1) using ultra high vacuum chemical vapor deposition (UHV/CVD) by employing an intermediate Si_1−yC_y layer. The Si_1−yC_y/SiGe bilayer was found to change mechanism of relaxation in the SiGe overlayer. Compared with the samples with a Si layer, the equilibrium critical thickness of top SiGe films with rough surface by introducing an intermediate Si_0.986C_0.014 layer are drastically reduced; this result was attributed to larger tensile stress in the inserted Si_0.986C_0.014 layer. With a 210-nm-thick Si_0.8Ge_0.2 overlayer, this Si_0.8Ge_0.2/Si_0.986C_0.014/Si_0.8Ge_0.2 heterostructure has a threading dislocation density (TDs) less than 1 × 10⁵ cm⁻² and a residual strain of 30%. The root mean square (RMS) of surface roughness for this sample was measured to be about 1.8 nm. In this SiGe/Si_1−yC_y/SiGe structure, C atoms in the intermediate Si layer will improve the relaxation of thin SiGe overlayer, however, the relaxation for the 700-nm-thick SiGe overlayer is independent of the addition of C. The point defects rich Si_0.986C_0.014 layer plays the role to confine the misfit dislocations, which formed at the interface of the top Si_0.8Ge_0.2 and the Si_0.986C_0.014 layer, and blocked the propagation of TDs. Strained-Si n-channel metal-oxide-semiconductor transistors (n-MOSFETs) with a 210-nm-thick Si_0.8Ge_0.2 overlayers as buffer were fabricated and examined. Drain current and effective electron mobility for the strained-Si device with this novel substrate technology was found to be 100 and 63% higher than that of control Si device. Our results show that thin relaxed Si_0.8Ge_0.2 films with the intermediate Si_0.986C_0.014 layer serve as good candidates for high-speed strained-Si devices.     

Fabrication of a-Si1−xCx:H thin films for solar cells by the Cat-CVD method using a carbon catalyzer

We propose a new approach to fabrication of hydrogenated amorphous silicon carbide (a-Si_1−xC_x:H) thin films for solar cells by the catalytic chemical vapor deposition (Cat-CVD) method using a carbon catalyzer, which is more stable than tungsten or tantalum. It was found that by using the carbon catalyzer, undoped and boron-doped a-Si_1−xC_x:H films were easily obtained from a SiH₄, CH₄ and B₂H₆ mixture without any change in the catalyzer surface, even after deposition for longer than 30 h.     

Sb segregation in Si and SiGe: effect on the growth of self-organised Ge dots

The segregation and incorporation coefficients of antimony (Sb) in Si_1−xGe_x buried doped layers were investigated simultaneously using specific temperature sequences. We first showed an exponential kinetic evolution of Sb surface segregation in Si. In contrast such an evolution could not be observed in Si_1−xGe_x because of the Sb thermal desorption, at growth temperatures of 550°C. We also showed an increased surface segregation increasing with the partial Ge concentration in Si_1−xGe_x alloys, which was explained by a decrease of the kinetic barrier for Sb atoms mobility. It was, therefore, possible to determine the growth conditions to obtain a Si_1−xGe_x doped layer with a controlled incorporation level and a negligible surface segregation obtained by the thermal desorption of the Sb surface coverage. Finally, using Sb surfactant mediated growth, we found Ge dots with lateral sizes reduced by a factor of 2.8 and density multiplied by a factor of four as compared to dots directly deposited on Si(001).     

Optical transitions near the band edge in bulk CuInxGa1−xSe2 from ellipsometric measurements

From the analysis of the variation of optical absorption coefficient with incident photon energy between 0.8 and 2.6 eV, obtained from ellipsometric data, the energy E_G of the fundamental absorption edge and E_G′ of the forbidden direct transition for CuIn_xGa_1−xSe₂ alloys are estimated. The change in E_G and the spin-orbit splitting Δ_SO=E_G′−E_G with the composition x can be represented by parabolic expression of the form E_G(x)=E_G(0)+ax+bx² and Δ_SO(x)=Δ_SO(0)+a′x+b′x², respectively. b and b′ are called “bowing parameters”. Theoretical fit gives a=0.875 eV, b=0.198 eV, a′=0.341 eV and b′=−0.431 eV. The positive sign of b and negative sign of b′ are in agreement with the theoretical prediction of Wei and Zunger [Phys. Rev. B 39 (1989) 6279].     

Epitaxial grown K1−xRbxTiOPO4 films with extremely flat surfaces for waveguiding

We report on epitaxial {1 0 0} K_1−xRb_xTiOPO₄ waveguide films for the visible spectral range grown on KTiOPO₄ substrates by liquid phase epitaxy. Using the m-line technique a refractive index increase of Δn_x≈0.007 and Δn_z≈0.004 for TM and TE polarisation has been determined for a K_0.78Rb_0.22TiOPO₄ film. Optical transmission and nearfield distribution are comparable to conventional ion-exchanged waveguides. Typical attenuation of about 1 dB/cm for both TM and TE polarisation was obtained at λ=532 and 1064 nm. Energy-dispersive X-ray spectrometry reveals solid-solution films with graded rubidium composition profiles. X-ray rocking curve analyses confirm the epitaxial growth process and indicate perfect and relaxed K_1−xRb_xTiOPO₄ films. Atomic force microscopy investigations reveal regular step structures with step heights Δh<1.3 nm resulting in rms-roughness values of ≈0.4 nm.     

Sintering behavior and microwave dielectric properties of Bi3(Nb1−xTax)O7 solid solutions

Solid solutions of Bi₃(Nb_1−xTa_x)O₇ (x = 0.0, 0.3, 0.7, 1) were synthesized using solid state reaction method and their microwave dielectric properties were first reported. Pure phase of fluorite-type could be obtained after calcined at 700 °C (2 h)⁻¹ between 0 ≤ x ≤ 1 and Bi₃(Nb_1−xTa_x)O₇ ceramics could be well densified below 990 °C. As x increased from 0.0 to 1.0, saturated density of Bi₃(Nb_1−xTa_x)O₇ ceramics increased from 8.2 to 9.1 g cm⁻³, microwave permittivity decreased from 95 to 65 while Q_f values increasing from 230 to 560 GHz. Substitution of Ta for Nb modified temperature coefficient of resonant frequency τ_f from −113 ppm °C⁻¹ of Bi₃NbO₇ to −70 ppm °C⁻¹ of Bi₃TaO₇. Microwave permittivity, Q_f values and τ_f values were found to correlate strongly with the structure parameters of fluorite solid solutions and the correlation between them was discussed in detail. Considering the low densified temperature and good microwave dielectric proprieties, solid solutions of Bi₃(Nb_1−xTa_x)O₇ ceramics could be a good candidate for low temperature co-fired ceramics application.     

Structural characterization of ion-beam-induced epitaxially crystallized thin layers of III–V and IV–IV semiconductors

Structural properties of ion-beam-induced epitaxial crystallization (IBIEC) for amorphous layers of GaAs on GaAs(100), BP on BP(100) and Si_1−xGe_x and Si_1−x−yGe_xC_y on Si(100) have been investigated. Crystallization was induced by ion bombardment with 400 keV Ne, Ar or Kr at 150 °C for GaAs and at 350 °C for BP. Epitaxial crystallization up to the surface was observed both in GaAs and BP at temperatures much below those required for the solid phase epitaxial growth (SPEG). The growth rate per nuclear energy deposition density has shown a larger dependence on ion dose rate in cases of heavier ion bombardments both for GaAs and BP. Crystallization of a-GaAs with ions whose projected ranges are within the amorphous layer thickness was also observed at 150 °C. Epitaxial crystallization of Si_1−xGe_x and Si_1−x−yGe_xC_y layers (x = 0.13 and y = 0.014 at peak concentration) on Si(100) formed by high-dose implantation of 80 keV Ge and 17 keV C ions has been observed in the IBIEC process with 400 keV Ar ion bombardments at 300–400 °C. Crystalline growth by IBIEC has shown a larger growth rate in Si_1−x−yGe_xC_y/Si} than in Si_1−xGe_x/Si} with the same Ge concentration for all bombardments under investigation. X-ray rocking-curve measurements have shown a strain-compensated growth in Si_1−x−yGe_xC_y/Si}, whereas Si_1−xGe_x/Si} samples have shown a growth with strain accommodation.     

Highly conductive microcrystalline silicon carbide films deposited by the hot wire cell method and its application to amorphous silicon solar cells

Microcrystalline silicon carbide (μc-Si_1−xC_x) films were successfully deposited by the hot wire cell method using a gas mixture of SiH₄, H₂ and C₂H₂. It was confirmed by Fourier transform infrared and X-ray diffraction analyses that the films consisted of μc-Si grains embedded in a-Si_1−xC_x tissue. The p-type μc-Si_1−xC_x films were deposited using B₂H₆ as a doping gas. A dark conductivity of 0.2 S/cm and an activation energy of 0.067 eV were obtained. The p-type μc-Si_1−xC_x was used as a window layer of a-Si solar cells, in which the intrinsic layer was deposited by photo-chemical vapor deposition, and an initial conversion efficiency of 10.2% was obtained.     

Characterization of GaN epitaxial layers on SiC substrates with AlxGa1−xN buffer layers

High quality GaN epitaxial layers were obtained with Al_xGa_1−xN buffer layers on 6H–SiC substrates. The low-pressure metalorganic chemical vapor deposition (LP-MOCVD) method was used. The 500 Å thick buffer layers of Al_xGa_1−xN (0≤x≤1) were deposited on SiC substrates at 1025°C. The FWHM of GaN (0004) X-ray curves are 2–3 arcmin, which vary with the Al content in Al_xGa_1−xN buffer layers. An optimum Al content is found to be 0.18. The best GaN epitaxial film has the mobility and carrier concentration about 564 cm² V⁻¹ s⁻¹ and 1.6×10¹⁷ cm⁻³ at 300 K. The splitting diffraction angle between GaN and Al_xGa_1−xN were also analyzed from X-ray diffraction curves.     

Pyroelectric properties of BST/PLT composite thick films with addition of xPbO–(1 − x)B2O3 glass

The Ba_xSr_1−xTiO₃ (BST)/Pb_1−xLa_xTiO₃ (PLT) composite thick films (20 μm) with 12 mol% amount of xPbO–(1 − x)B₂O₃ glass additives (x = 0.2, 0.35, 0.5, 0.65 and 0.8) have been prepared by screen-printing the paste onto the alumina substrates with silver bottom electrode. X-ray diffraction (XRD), scanning electron microscope (SEM) and an impedance analyzer and an electrometer were used to analyze the phase structures, morphologies and dielectric and pyroelectric properties of the composite thick films, respectively. The wetting and infiltration of the liquid phase on the particles results in the densification of the composite thick films sintered at 750 °C. Nice porous structure formed in the composite thick films with xPbO–(1 − x)B₂O₃ glass as the PbO content (x) is 0.5 ≥ x ≥ 0.35, while dense structure formed in these thick films as the PbO content (x) is 0.8 ≥ x ≥ 0.65. The volatilization of the PbO in PLT and the interdiffusion between the PLT and the glass lead to the reduction of the c-axis of the PLT phase. The operating temperature range of our composite thick films is 0–200 °C. At room temperature (20 °C), the BST/PLT composite thick films with 0.35PbO–0.65B₂O₃ glass additives provided low heat capacity and good pyroelectric figure-of-merit because of their porous structure. The pyroelectric coefficient and figure-of-merit F_D are 364 μC/(m² K) and 14.3 μPa^−1/2, respectively. These good pyroelectric properties as well as being able to produce low-cost devices make this kind of thick films a promising candidate for high-performance pyroelectric applications.     

Bond-lengths of the atomic nearest-neighbor and next-nearest-neighbor in A1−xBxC1−yDy III–V solid solutions

On the basis of the FDUC model and the hypothesis of the constant covalent radii, the expressions of the atomic nearest-neighbor and the next-nearest-neighbor bond-lengths were derived for A_1−xB_xC_1−yD_y III–V quaternary solid solutions. This set of bond-length expressions predicts the averaged bond-lengths and bond angles at any concentration (x, y) for the III–V pseudobinary and quaternary solid solutions, which are only dependent on the lattice parameters and the concentrations of the pure end compounds. When x=0, 1 or y=0, 1, A_1−xB_xC_1−yD_y III–V quaternary solid solutions degenerate into the relative pseudobinary solid solutions, in which the nearest-neighbor and the next-nearest-neighbor bond-lengths agree well with the experimental results. Further discussion and comparison with other theoretical models are also given in this paper.     

Optical and electrical properties of p-type AgInSnxS2−x (x = 0–0.04) thin films prepared by spray pyrolysis

AgInSn_xS_2−x (x = 0–0.2) polycrystalline thin films were prepared by the spray pyrolysis technique. The samples were deposited on glass substrates at temperatures of 375 and 400 °C from alcoholic solutions comprising silver acetate, indium chloride, thiourea and tin chloride. All deposited films crystallized in the chalcopyrite structure of AgInS₂. A p-type conductivity was detected in the Sn-doped samples deposited at 375 °C, otherwise they are n-type. The optical properties of AgInSn_xS_2−x (x < 0.2) resemble those of chalcopyrite AgInS₂. Low-temperature PL measurements revealed that Sn occupying an S-site could be the responsible defect for the p-type conductivity observed in AgInSn_xS_2−x (x < 2) thin films.     

Catalytic CVD growth of Si–C and Si–C–O alloy films by using alkylsilane and related compounds

Cat-CVD method has been applied to the growth of Si–C and Si–C–O alloy thin films. Growth mechanism has been studied with emphasis on the effects of filament materials. Growth rates and alloy compositions were measured for W, Ta, Mo and Pt filaments at the filament temperatures ranging from 1300 to 2000 °C. Si_1−xC_x films with x ranging from 0.38 to 0.7 could be grown by using single molecule source Si(CH₃)₂H₂ (dimethylsilane). Si–C–O ternary alloy films was successfully prepared by using Si(OC₂H₅)₄ (tetraethoxysilane) and Si(CH₃)₂(OCH₃)₂ (dimethyldimethoxysilane) molecules.     

Self-assembled growth and magnetotransport investigations on strained Si/SiGe multilayers on vicinal (113)-Si surfaces

We have reported on the growth and magnetotransport properties of modulation p-doped Si_1−xGe_x quantum wells on strained multilayers of 2.5 nm Si_1−xGe_x/10 nm Si on vicinal (113) Si surfaces. Owing to the strong step-bunching properties of the (113) Si surface, both the Si_1−xGe_x and the Si layers exhibited a regular pattern of large steps. Low-temperature magnetotransport measurements revealed a hole density (6–9×10¹¹ cm⁻²) independent of direction, whereas a pronounced mobility anisotropy was found. The mobility (1000–2000 cm²/Vs) was approximately two times higher along the [33-2] direction compared to a perpendicular [−110] direction. This is attributed to anisotropic hole scattering caused by anisotropic shear strain which is always present in strained layers on (113) Si. No influence of the large regular steps, whose direction is given by the direction of the substrate miscut, on the mobility was found.     

Composition and substrate temperature dependence of structural and optical studies on ZnSexCdS1−x alloy films

Thin (t−0.60 μm) films of ZnSe_xCdS_1−x were formed by vacuum evaporation on glass substrates held at 350 and 470 K. XRD studies showed that all the films were polycrystalline in nature. Films with x0.70 were hexagonal whereas films with x0.80 were cubic in structure. The structural transition was in the range 0.70<x<0.80. The lattice parameter was higher in films formed at a higher temperature. The lattice parameter followed Vegard's law. Grain size increased with substrate temperature. From the optical transmission spectra recorded in the wavelength range 300–2500 nm, the extinction coefficient, refractive index and band gaps were obtained. Band gap values showed a downward bowing with ‘x' with a bowing parameter of 0.40 eV.     

Nucleation and evolution of Si1−xGex islands on Si(001)

In this study, we report a systematic investigation of the metastable morphologies of Si_1−xGe_x layers obtained by the interplay of kinetics and thermodynamics during growth on Si(001). We show that three main growth regimes can be distinguished as a function of the misfit and of the deposited thickness. They correspond to three equilibrium steady state morphologies that consist of (105)-facetted hut islands, huts and domes in co-existence, and a bimodal size distribution of domes, respectively. The shape transitions between these states are attributed to different levels of relaxation.