Molecular beam epitaxy synthesis of Si1−yCy and Si1−x−yGexCy alloys and Ge islands using an electron cyclotron resonance argon/methane plasma

We report the growth of Si_1−yC_y and Si_1−x−yGe_xC_y alloys on Si(001) by electron cyclotron resonance plasma-assisted Si molecular beam epitaxy using an argon/methane gas mixture. Various Si/Si_1−yC_y and Si/Si_1−x−yGe_xC_y multilayers have been grown and characterized principally by X-ray diffraction and Raman spectroscopy. The influence of growth parameters and electron cyclotron resonance plasma source operating conditions on the C substitutional incorporation was studied. Under optimum growth conditions the structures show good structural properties and sharp interfaces with carbon being essentially substitutionally incorporated up to concentrations of 1%. No significant carbon incorporation was measured in films grown under a high methane partial pressure without plasma excitation. Si_1−x−yGe_xC_y layers grown with this technique exhibit the strain compensation and enhanced thermal stability expected for these ternary alloys. Carbon pre-deposition of Si through surface exposure to the argon/methane plasma is shown to act as an antisurfactant on the growth of Ge islands by suppressing the formation of a Ge wetting layer on the surface.     

Epitaxial growth of strained Si1−yCy films by the hot-wire cell method and its application to metal oxide semiconductor devices

We succeeded in obtaining strained Si_1−yC_y films at a substrate temperature of 200 °C by the hot-wire cell method. The substitutional carbon concentration in films annealed at 700 °C was 0.9%, while it was limited to 0.13% for a sample grown by gas-source molecular beam epitaxy (MBE) at a substrate temperature of 700 °C. We investigated the thermal stability of strained Si_1−yC_y films for device application. Annealing at over 900 °C caused the formation of 3C-SiC and relaxation of the strain occurred. From this result, we found that the process temperature should be lower than 800 °C. A low-temperature MOSFET process, in which all process temperatures after deposition of Si_1−yC_y were lower than 800 °C, was developed and a strained Si_1−yC_y MOSFET was fabricated.     

Nucleation and evolution of Si1−xGex islands on Si(001)

In this study, we report a systematic investigation of the metastable morphologies of Si_1−xGe_x layers obtained by the interplay of kinetics and thermodynamics during growth on Si(001). We show that three main growth regimes can be distinguished as a function of the misfit and of the deposited thickness. They correspond to three equilibrium steady state morphologies that consist of (105)-facetted hut islands, huts and domes in co-existence, and a bimodal size distribution of domes, respectively. The shape transitions between these states are attributed to different levels of relaxation.     

Growth of high-quality relaxed SiGe films with an intermediate Si1−yCy layer for strained Si n-MOSFETs

High quality and thin relaxed SiGe films were grown on Si (0 0 1) using ultra high vacuum chemical vapor deposition (UHV/CVD) by employing an intermediate Si_1−yC_y layer. The Si_1−yC_y/SiGe bilayer was found to change mechanism of relaxation in the SiGe overlayer. Compared with the samples with a Si layer, the equilibrium critical thickness of top SiGe films with rough surface by introducing an intermediate Si_0.986C_0.014 layer are drastically reduced; this result was attributed to larger tensile stress in the inserted Si_0.986C_0.014 layer. With a 210-nm-thick Si_0.8Ge_0.2 overlayer, this Si_0.8Ge_0.2/Si_0.986C_0.014/Si_0.8Ge_0.2 heterostructure has a threading dislocation density (TDs) less than 1 × 10⁵ cm⁻² and a residual strain of 30%. The root mean square (RMS) of surface roughness for this sample was measured to be about 1.8 nm. In this SiGe/Si_1−yC_y/SiGe structure, C atoms in the intermediate Si layer will improve the relaxation of thin SiGe overlayer, however, the relaxation for the 700-nm-thick SiGe overlayer is independent of the addition of C. The point defects rich Si_0.986C_0.014 layer plays the role to confine the misfit dislocations, which formed at the interface of the top Si_0.8Ge_0.2 and the Si_0.986C_0.014 layer, and blocked the propagation of TDs. Strained-Si n-channel metal-oxide-semiconductor transistors (n-MOSFETs) with a 210-nm-thick Si_0.8Ge_0.2 overlayers as buffer were fabricated and examined. Drain current and effective electron mobility for the strained-Si device with this novel substrate technology was found to be 100 and 63% higher than that of control Si device. Our results show that thin relaxed Si_0.8Ge_0.2 films with the intermediate Si_0.986C_0.014 layer serve as good candidates for high-speed strained-Si devices.     

Composition and substrate temperature dependence of structural and optical studies on ZnSexCdS1−x alloy films

Thin (t−0.60 μm) films of ZnSe_xCdS_1−x were formed by vacuum evaporation on glass substrates held at 350 and 470 K. XRD studies showed that all the films were polycrystalline in nature. Films with x0.70 were hexagonal whereas films with x0.80 were cubic in structure. The structural transition was in the range 0.70<x<0.80. The lattice parameter was higher in films formed at a higher temperature. The lattice parameter followed Vegard's law. Grain size increased with substrate temperature. From the optical transmission spectra recorded in the wavelength range 300–2500 nm, the extinction coefficient, refractive index and band gaps were obtained. Band gap values showed a downward bowing with ‘x' with a bowing parameter of 0.40 eV.     

Fabrication of a-Si1−xCx:H thin films for solar cells by the Cat-CVD method using a carbon catalyzer

We propose a new approach to fabrication of hydrogenated amorphous silicon carbide (a-Si_1−xC_x:H) thin films for solar cells by the catalytic chemical vapor deposition (Cat-CVD) method using a carbon catalyzer, which is more stable than tungsten or tantalum. It was found that by using the carbon catalyzer, undoped and boron-doped a-Si_1−xC_x:H films were easily obtained from a SiH₄, CH₄ and B₂H₆ mixture without any change in the catalyzer surface, even after deposition for longer than 30 h.     

Sintering behavior and microwave dielectric properties of Bi3(Nb1−xTax)O7 solid solutions

Solid solutions of Bi₃(Nb_1−xTa_x)O₇ (x = 0.0, 0.3, 0.7, 1) were synthesized using solid state reaction method and their microwave dielectric properties were first reported. Pure phase of fluorite-type could be obtained after calcined at 700 °C (2 h)⁻¹ between 0 ≤ x ≤ 1 and Bi₃(Nb_1−xTa_x)O₇ ceramics could be well densified below 990 °C. As x increased from 0.0 to 1.0, saturated density of Bi₃(Nb_1−xTa_x)O₇ ceramics increased from 8.2 to 9.1 g cm⁻³, microwave permittivity decreased from 95 to 65 while Q_f values increasing from 230 to 560 GHz. Substitution of Ta for Nb modified temperature coefficient of resonant frequency τ_f from −113 ppm °C⁻¹ of Bi₃NbO₇ to −70 ppm °C⁻¹ of Bi₃TaO₇. Microwave permittivity, Q_f values and τ_f values were found to correlate strongly with the structure parameters of fluorite solid solutions and the correlation between them was discussed in detail. Considering the low densified temperature and good microwave dielectric proprieties, solid solutions of Bi₃(Nb_1−xTa_x)O₇ ceramics could be a good candidate for low temperature co-fired ceramics application.     

Characterization of CuIn1 − xAlxS2 thin films prepared by thermal evaporation

Ingots containing single crystals of the quaternary alloys CuIn_1 − xAl_xS₂ (CIAS) were grown by a horizontal Bridgman method for compositions with x = 0, 0.2 and x = 0.4. (CIAS) thin films were prepared by thermal evaporation technique on to glass substrates. Structural and optical properties of the films were studied in function of the Al content. Band gap, and absorption coefficients were determined from the analysis of the optical spectra (transmittance and reflectance as a function of wavelength) recorded by a spectrophotometer. The samples have direct bandgap energies of 1.95 eV (x = 0), 2.06 eV (x = 0,2) and 2.1 eV (x = 0,4). These optical results were correlated with the structural analysis by X-Ray diffraction.     

Physical and electrical properties of thin films produced by Low Energy Cluster Beam Deposition of mixed InxSb1−x clusters

We present a new gas-aggregation cluster source with two independent crucibles, one for indium and another one for antimony. This source was used to produce mixed In_xSb_1−x clusters in the nanometer range size (typically 4 nm), which were deposited at room temperature on amorphous carbon or glass substrates by low energy cluster beam deposition technique (LECBD). The film composition was analysed by energy dispersive X-ray (EDX) spectroscopy. The morphology and structure of the films were studied by transmission electron microscopy (conventional and high resolution) and selected area electron diffraction (SAED) at different compositions. Semiconducting InSb clusters could be produced by controlling the temperature of the two crucibles. The electrical properties of the films were studied at a film thickness of 20 nm. The conductivity versus temperature appeared to be thermally activated for all compositions.     

Pyroelectric properties of BST/PLT composite thick films with addition of xPbO–(1 − x)B2O3 glass

The Ba_xSr_1−xTiO₃ (BST)/Pb_1−xLa_xTiO₃ (PLT) composite thick films (20 μm) with 12 mol% amount of xPbO–(1 − x)B₂O₃ glass additives (x = 0.2, 0.35, 0.5, 0.65 and 0.8) have been prepared by screen-printing the paste onto the alumina substrates with silver bottom electrode. X-ray diffraction (XRD), scanning electron microscope (SEM) and an impedance analyzer and an electrometer were used to analyze the phase structures, morphologies and dielectric and pyroelectric properties of the composite thick films, respectively. The wetting and infiltration of the liquid phase on the particles results in the densification of the composite thick films sintered at 750 °C. Nice porous structure formed in the composite thick films with xPbO–(1 − x)B₂O₃ glass as the PbO content (x) is 0.5 ≥ x ≥ 0.35, while dense structure formed in these thick films as the PbO content (x) is 0.8 ≥ x ≥ 0.65. The volatilization of the PbO in PLT and the interdiffusion between the PLT and the glass lead to the reduction of the c-axis of the PLT phase. The operating temperature range of our composite thick films is 0–200 °C. At room temperature (20 °C), the BST/PLT composite thick films with 0.35PbO–0.65B₂O₃ glass additives provided low heat capacity and good pyroelectric figure-of-merit because of their porous structure. The pyroelectric coefficient and figure-of-merit F_D are 364 μC/(m² K) and 14.3 μPa^−1/2, respectively. These good pyroelectric properties as well as being able to produce low-cost devices make this kind of thick films a promising candidate for high-performance pyroelectric applications.