应对“后摩尔定律”的封装设备

介绍了在传统的摩尔定律发展速度受阻的形势下以及在封装技术的驱动下,特别是先进的TSV互连和3D堆叠三维封装技术创新的应用,"后摩尔定律"对半导体技术产业的发展产生了强大推动力。为了适应中段制程的来临,应对新兴封装技术的挑战,满足不同工艺阶段的封装需求,各封装工艺设备的性能也在不断地创新和提高,工艺被更多地物化在设备之中,涌现出了许多提供"总体解决方案"的封装工艺设备。最后对封装设备行业加强技术创新,实现跨越式发展提出了几点看法。     

5 Commandments [technology laws and rules of thumb]

There are sublime, silly, real and true laws, and folksy rules of thumb laws that have come up from mathematical observations, pithy pronouncements, and even a few enduring self-fulfilling prophecies about technology. The article discusses how some laws have fared in time. These laws include: Moore's Law - the number of transistors on a chip doubles annually; Rock's Law - the cost of semiconductor tools doubles every four years; Machrone's Law the PC you want to buy will always be $5000; Metcalfe's Law - a network's value grows proportionately to the number of its users squared; and Wirth's Law - software is slowing faster than hardware is accelerating.     

The Evolution of Wafer Bonding--Moving from the back-end further to the front-end

1 Introduction
As the nanoscale era progresses, innovative new materials and processes continue to be developed and implemented as a means of keeping the industry on the path of Moore＇ s Law. Wafer bonding - literally, the temporary or permanent joining of two wafers or substrates using a suitable combination of process technologies, chemicals and adhesives - is one such innovation. Originally developed primarily as a back-end process for use in the manufacture of fragile microelectromechanical system （MEMS） devices and structures, wafer-bonding technology has proved invaluable for engineered substrates, such as silicon on insulator （SOI）, and is now moving further into the front end.     

An Industry Perspective on Current and Future State of the Art in System-on-Chip (SoC) Technology

In fast-moving consumer electronics markets where product lifetimes may be measured in months rather than years, fast time-to-market development of the system-on-chip solutions that lie at the heart of these products has become critical to commercial success. New semiconductor process technologies have the potential to integrate ever greater functional complexity onto realistically priced silicon chips. Yet there still remains a significant design gap between what can theoretically be integrated onto silicon and what can be efficiently designed onto it. In addition, the advent of sub-100-nm process technologies has seen an end to the speed and power consumption scaling that the industry has been used to. This paper examines the current state of the art in SoC technology and identifies some of the challenges that lie ahead if the relentless progress of Moore's Law is to continue fuelling ever more advanced and affordable consumer electronics products. It also looks at the system-in-package solutions that are increasingly being used to achieve levels of functional integration that Moore's Law on its own cannot provide.     

摩尔定律的数学模型与应用

介绍摩尔定律的内容,论述其数学模型,详解了摩尔定律的两个典型应用,一是硅极限预测,二是计算复杂度极限预测。最后对摩尔定律的一般适用性作了讨论。     

摩尔定律与半导体设备

介绍了摩尔定律及其寿命和争议。同时介绍了ITRS2 0 0 1及其对缩小芯片特征尺寸的争议。讨论了影响摩尔定律寿命的半导体工艺及设备 ,如光刻工艺及设备、互连工艺及设备和纳米半导体工艺及设备。并对发展我国半导体设备提出了建议     

Thoughts on using scientific system engineering method todevelop quantum computer

As the traditional semiconductor complementary metal oxide semiconductor(CMOS) integrated circuit technology gradually approaches the limit of Moore’s Law, quantum computing, as a new system computing technology, with the potential for higher computing speed and lower power consumption, is getting more and more attention from governments and research institutions around the world. For instance, the United States(US) government is adopting a bunch of bills to deploy new quantum information proces...     

关于摩尔定律的争论

本文介绍目前对摩尔定律的两种看法，一种认为该定律至少在10年内仍有效；另一种则认为该定律业已过时。     

Design technology co-optimization towards sub-3 nm technology nodes

Over the past half century,Moore’s Law has played a crucial role in the development of the semiconductor field,which depends on straightforwardly dimensional scaling with approximately a two-year cadence.Significant benefits of performance,power,area,and cost(PPAC)in microchips are expected at each technology node.However,aggressive pitchbased scaling by resolution enhancement techniques becomes increasingly challenging to sustain.     

纳米技术将推动IC产业继续前进

在未来10～15年内有两条主流将引导IC产业的发展:一条是延续摩尔定律、纳米SiCMOS技术,以提高芯片的速度和频率;另一条是超越摩尔定律。后者分成三个支流:双核和多核处理器、纳米SiCMOS技术,以提高芯片性能;在单个封装内集成整个系统,纳米SiCMOS技术,以提高芯片容量和功能;采用纳米技术研发纳米CMOS器件以外的纳米器件,如碳纳米管、共振隧穿器件等,以突破SiCMOS技术为主。     

3D-TSV技术——延续摩尔定律的有效通途

对于堆叠器件的3-D封装领域而言,硅通孔技术(TSV)是一种新兴的技术解决方案.将器件3D层叠和互连可以进一步加快产品的时钟频率、降低能耗和提高集成度.为了在容许的成本范围内跟上摩尔定律的步伐,在主流器件设计和生产过程中采用三维互联技术将会成为必然.介绍了TSV技术的潜在优势,和制约该技术发展的一些不利因素及业界新的举...     

Photoic crystal nanobeam cavity devices for on-chip integrated silicon photonics

Integrated circuit(IC)industry has fully considered the fact that the Moore’s Law is slowing down or ending.Alternative solutions are highly and urgently desired to break the physical size limits in the More-than-Moore era.Integrated silicon photonics technology exhibits distinguished potential to achieve faster operation speed,less power dissipation,and lower cost in IC industry,because their COMS compatibility,fast response,and high monolithic integration capability.Particularly,compared with other on-chip resonators(e.g.microrings,2D photonic crystal cavities)silicon-on-insulator(SOI)-based photonic crystal nanobeam cavity(PCNC)has emerged as a promising platform for on-chip integration,due to their attractive properties of ultra-high Q/V,ultra-compact footprints and convenient integration with silicon bus-waveguides.In this paper,we present a comprehensive review on recent progress of on-chip PCNC devices for lasing,modulation,switching/filting and label-free sensing,etc.     

SOC CMOS technology for personal Internet products

Worldwide demand for Personal Internet Products is increasing rapidly, and will shape the directions of CMOS technology in the years ahead. Personal Internet Products are loosely defined in this paper as communication, computing and consumer products, which are enabled by the Internet: cell phones, PDAs, WLANs, Internet audio/video, ADSL, cable modems etc. Personal Internet Products are based on Digital Signal Processing (DSP) and analog functionality. They are made accessible to billions of people around the globe by intense focus on cost through SOC integration. In the Internet Age, Moore's Law will continue to be a technology imperative for the semiconductor industry. But SOC integration will be an additional technology imperative that drives down the cost of Personal Internet Product to mass market levels. SOC integration for Personal Internet Products requires the integration of analog, power analog, RF and memory onto the digital baseband processor, which is fabricated in high density, high performance, low cost digital CMOS technology. This paper describes the challenges and some of the solutions to achieve this vision.     

Ambient Technology — Now You See It, Now You Don't

The continuing progression of Moore's Law has enabled the miniaturisation and dramatic cost reduction in electronics over the last ten years. For a truly pervasive communications environment the challenges of hiding key hardware technologies from the user are rapidly being overcome. This paper reviews the status of these hardware technology developments in the pervasive space and briefly discusses other contributing factors that will enable the pervasive vision to be realised.     

Moore's law: past, present and future

A simple observation, made over 30 years ago, on the growth in the number of devices per silicon die has become the central driving force of one of the most dynamic of the world's industries. Because of the accuracy with which Moore's Law has predicted past growth in IC complexity, it is viewed as a reliable method of calculating future trends as well, setting the pace of innovation, and defining the rules and the very nature of competition. And since the semiconductor portion of electronic consumer products keeps growing by leaps and bounds, the Law has aroused in users and consumers an expectation of a continuous stream of faster, better, and cheaper high-technology products. Even the policy implications of Moore's Law are significant: it is used as the baseline assumption in the industry's strategic road map for the next decade and a half     

Preface to the Special Issue on Beyond Moore:Three-Dimensional(3D)Heterogeneous Integration

In the past few decades,the Moore’s Law has been the revolutionary force for our integrated circuit(IC)industry.However,the tremendous challenges faced in continuous transistor physical down-scaling and the unprecedented demands for computing and storage capabilities require our urgent search for strategies and solutions to integrate diverse materials,devices,circuits,and architectures in a 3D vertically stacked manner so that they can orchestrate in the most effective way to provide significantly enhanced functionalities as well as superior speed,energy,bandwidth,form fact,and cost.     

A perspective from the 2003 ITRS: MOSFET scaling trends, challenges, and potential solutions

The IC industry has been rapidly and consistently scaling the design rules, increasing the chip and wafer size, and cleverly improving the design of devices and circuits for over 35 years. As a result, the industry has enjoyed exponential increases in chip speed and functional density versus time combined with exponential decreases in power dissipation and cost per function versus time, as projected by Moore's Law by G.E. Moore (1995). As metal-oxide semiconductor field-effect transistors (MOSFETs) are scaled to deep submicron dimensions, the integrated circuit (IC) industry is running into increasing difficulties in continuing to scale at the accustomed rate, owing to the small dimensions and certain key device, material, and process limits that are being approached.     

Moore's Law and energy and operations savings in the evolution of optical transport platforms

As a telecommunications equipment vendor, we have witnessed a tremendous increase in the capacity of transport equipment over the past 16 years. Platforms have evolved from the firstgeneration add/drop multiplexer to the next generation multiservice provisioning platform and today's packet optical transport platform. This article discusses our findings in the application of Moore's Law to these optical transport platforms in capacity, power, space, and capital cost. It also discusses our findings in using Moore's Law as a presumption to explore the operations cost savings in power consumption, office floor space, and maintenance. Payback periods for the capital cost of new technology from energy and operations savings are investigated. The conclusions justify the replacement of the network technology for every other generation.     

Capacity Demand and Technology Challenges for Lightwave Systems in the Next Two Decades

Ten to 20 years from now, optical networks will have to carry vastly increased amounts of Internet traffic. Today's knowledge (2006) already points to ultimate technology limits in the physical layer, foretelling the end of the so-called "Optical Moore's Law." Such an observation is discordant with the generic and optimistic view of a "virtually infinite" optical bandwidth combined with unlimited Internet-traffic growth. In order to meet long-term needs and challenges, therefore, basic research in wideband optical components and subsystems must be urgently revived today     

How We Found The Missing Memristor

It's time to stop shrinking. Moore's Law, the semiconductor industry's obsession with the shrinking of transistors and their commensurate steady doubling on a chip about every two years, has been the source of a 50-year technical and economic revolution. Whether this scaling paradigm lasts for five more years or 15, it will eventually come to an end. The emphasis in electronics design will have to shift to devices that are not just increasingly infinitesimal but increasingly capable.