A 19.8% efficient honeycomb multicrystalline silicon solar cellwith improved light trapping

This paper reports a substantially improved efficiency for a multicrystalline silicon solar cell of 19.8%. This is the highest ever reported efficiency for a multicrystalline silicon cell. The improved multicrystalline cell performance results from enshrouding cell surfaces in thermally grown oxide to reduce their detrimental electronic activity and from isotropic etching to form a hexagonally-symmetric “honeycomb” surface texture. This texture, largely of inverted hemispheres, reduces reflection loss and improves absorption of infrared light by effectively acting as a randomizer. Results of a ray tracing model are presented, with the notable finding that up to 90% of infrared light is trapped in the substrate after the first two passes, compared with only 65% for the well known inverted pyramid structure. These optical features are considered to contribute to an exceptionally high short-circuit current density of 38.1 mA/cm². A further improvement is expected by using under-etched wells for these honeycomb cells     

Accelerated publication 23.5% efficient silicon solar cell

The passivated emitter and rear locally diffused cell structure has been redesigned and has yielded independently confirmed one-sun eficiencies of up to 23.5%, the highest ever for a silicon cell. A dotted front emitter contact design, PBr₃ liquid-source phosphorus diffusions and 400-μm thick 10-cm diameter wafers have contributed to this improvement. Some of the new cells have demonstrated open-circuit voltages of 709 mV with an ‘inverted’ pyramid surface structure, the highest ever for a 23%-efficiency silicon cell. Further improvement is expected in the near future.     

Fabrication and characterization of 18.6% efficientmulticrystalline silicon solar cells

Solar cell efficiencies as high as 18.6%(1 cm² area) have been achieved by a process which involves impurity gettering and effective back surface recombination velocity reduction of 0.65 Ω-cm multicrystalline silicon (mc-Si) grown by the heat exchanger method (HEM). Contactless photoconductance decay (PCD) analysis revealed that the bulk lifetime (τ_b) in HEM samples after phosphorus gettering can exceed 100 μs. At these τ_b levels, the back surface recombination velocity (S_b) resulting from unoptimized back surface field (BSF) design becomes a major limitation to solar cell performance. By implementing an improved aluminum back surface field (Al-BSF), S_b values in this study were lowered from 8000-10000 cm/s range to 2000 cm/s for HEM mc-Si devices. This combination of high τ_b and moderately low S _b resulted in the 18.6% device efficiency. Detailed model calculations indicate that lowering S_b further can raise the efficiency of similar HEM mc-Si devices above 19.0%, thus closing the efficiency gap between good quality, untextured single crystal and mc-Si solar cells. For less efficient devices formed on the same material, the presence of electrically active extended defects have been found to be the main cause for the performance degradation. A combination of light beam induced current (LBIC) scans as well as forward-biased current measurements have been used to analyze the effects of these extended defects on cell performance     

Prediction of diffusion length in multicrystalline silicon solar cells from trapping images on starting material

Areas with high crystal defect density are known to have a strong impact on the performance of silicon solar cells. Trapping has been reported to be correlated with crystal defects. We compare spatially resolved measurements of the trapping effect on unprocessed wafers with diffusion length measurements on solar cells. An excellent correlation is found between these two measurements. This allows a prediction of diffusion length for the processed solar cell directly from the trap image, for a given cell process and comparable material. This technique has thus a great potential for inline process control of starting material in solar cell production. Copyright © 2006 John Wiley & Sons, Ltd.     

17.6% efficient tricrystalline silicon solar cells with spatially uniform texture

Up to now solar cells fabricated on tricrystalline Czochralski‐grown silicon (tri‐Si) have shown relatively low short‐circuit current densities of about 31–33 mA/cm² because the three {110}‐oriented grains cannot effectively be textured by commonly used anisotropic etching solutions. In this work, we have optimised a novel chemical texturing step for tri‐Si and integrated it successfully into our solar cell process. Metal/insulator/semiconductor‐contacted phosphorus‐diffused n⁺p junction silicon solar cells with a silicon‐dioxide‐passivated rear surface and evaporated aluminium contacts were manufactured, featuring a spatially uniform surface texture over all three grains on both cell sides. Despite the simple processing sequence and cell structure, an independently confirmed record efficiency of 17.6% has been achieved. This excellent efficiency is mainly due to an increased short‐circuit current density of 37 mA/cm² obtained by substantially reduced reflection and enhanced light trapping. Copyright © 2003 John Wiley & Sons, Ltd.     

17.6% efficient multilayer thin-film silicon solar cells deposited on heavily doped silicon substrates

We report new results for multilayer thin-film silicon solar cells deposited onto electronically inert, heavily doped crystalline silicon substrates. The n-p-n-p-n active layers of a total thickness of 17 μm combined with a 15-μm thick p⁺-type buffer layer were deposited by chemical vapour deposition epitaxially onto a 10¹⁹ cm⁻³ doped Czochralski-grown silicon substrate. The cells fabricated using these layers exhibit an energy conversion efficiency of up to 17.6%, as measured by Sandia National Laboratories, which is the highest efficiency ever achieved for a thin-film silicon cell deposited onto such an electronically inert crystallographic template. An open-circuit voltage of 664.2 mV is also reported, the highest ever for a cell on such substrates.     

Front and rear silicon‐nitride‐passivated multicrystalline silicon solar cells with an efficiency of 18.1%

A solar cell process designed to utilise low‐temperature plasma‐enhanced chemical vapour deposited (PECVD) silicon nitride (SiN_x) films as front and rear surface passivation was applied to fabricate multicrystalline silicon (mc‐Si) solar cells. Despite the simple photolithography‐free processing sequence, an independently confirmed efficiency of 18.1% (cell area 2 × 2 cm²) was achieved. This excellent efficiency can be predominantly attributed to the superior quality of the rear surface passivation scheme consisting of an SiN_x film in combination with a local aluminium back‐surface field (LBSF). Thus, it is demonstrated that low‐temperature PECVD SiN_x films are well suited to achieve excellent rear surface passivation on mc‐Si. Copyright © 2002 John Wiley & Sons, Ltd.     

Influence of defect type on hydrogen passivation efficacy in multicrystalline silicon solar cells

We examine the effectiveness of hydrogen passivation as a function of defect type and microstructure at grain boundaries (GBs) in multicrystalline silicon. We analyze a solar cell with alternating mm‐wide bare and SiN_x‐coated stripes using laser‐beam‐induced current, electron backscatter diffraction, X‐ray fluorescence microscopy, and defect etching to correlate pre‐ and post‐hydrogenation recombination activity with GB character, density of iron‐silicide nanoprecipitates, and dislocations. A strong correlation was found between GB recombination activity and the nature/density of etch pits along the boundaries, while iron silicide precipitates above detection limits were found to play a less significant role. Copyright © 2010 John Wiley & Sons, Ltd.     

Effect of crystal defects on mechanical properties relevant to cutting of multicrystalline solar silicon

The effect of crystalline defects such as dislocations and grain boundary on the cutting behavior of multicrystalline solar silicon is investigated. Diamond scribing experiments reveal significant intra-granular variations in the critical depth of cut for ductile-to-brittle transition in the material. This is explained by characterizing the local dislocation density variations in (100) and (311) grains of a cast multicrystalline silicon wafer and measuring the corresponding elastic modulus, nanoindentation hardness, and fracture toughness. Measured elastic moduli are shown to be higher than theoretical values for defect-free single crystal silicon of the same crystallographic plane. For a given grain orientation, a higher dislocation density is shown to be correlated with higher fracture toughness and a larger critical depth of cut.     

Improvement of multicrystalline silicon solar cells by a low temperature anneal after emitter diffusion

The influence of an annealing step at about 500 °C after emitter diffusion of multicrystalline solar cells is investigated. Neighboring wafers from a silicon ingot were processed using different annealing durations and temperatures. The efficiency of the cells was measured and detailed light beam induced current measurements were performed. These show that mainly areas with high contents of precipitates near the crucible walls are affected by the anneal. An efficiency increase from 14.5 to 15.4% by a 2 h anneal at 500 °C was observed. The effect seems to be more likely external than internal gettering. Copyright © 2010 John Wiley & Sons, Ltd.     

100%填充因子的硅微透镜阵列的制作

本文成功制作出了表面光滑且具有100%填充因子的硅微阵列阵列结构。制作流程包括：旋涂光刻胶,热熔融和反应离子可是转移。首先,在硅衬底上旋涂SU-8光刻胶,并光刻显影;其次,热熔融和热处理光刻胶阵列得到光刻胶微透镜阵列;最后,反应离子刻蚀转移形成硅微透镜阵列。实验表明,通过调节反应离子刻蚀气体SF6和O2的量分别到60sccm和50sccm,就可以得到无间距的硅微透镜阵列。在此种情况下,光刻胶和硅衬底的刻蚀速率比值为1:1.44。单个微透镜底端尺寸为30.1微米,高度为3微米,焦距在15.4微米到16.6微米之间。     

Characterization of 23-percent efficient silicon solar cells

A silicon solar cell structure, PERC (passivated emitter and rear cell), has very recently demonstrated energy conversion efficiency above 23%. A number of interesting features of the PERC cell design are discussed. Rear contact design is based on a balance between the beneficial effects of small sparsely spaced contact points upon the open circuit voltage and short-circuit current of the cell and the corresponding negative effects upon cell fill factor. The noncontacted regions of the rear surface are held in weak depletion by an optically isolated but electrically connected rear Al reflector. Once bulk injection levels become appreciable, the disadvantage of this surface condition disappears. The structure incorporates a reasonably effective light-trapping scheme, although there remains scope for improvements in this area. Along with other improvements, efficiency approaching 24% seems feasible with the present cell structure. If a processing regime can be found which allows boron passivation of the contact holes or the entire rear surface without loss of the present exceptionally high bulk lifetimes, efficiencies above 24% are likely     

Effect of low segregation coefficient on Ga‐doped multicrystalline silicon solar cell performance

High‐quality Ga‐doped ingots are grown in different casting furnaces at optimized growth parameters; 3·5 kg ingots exhibit normal distribution of diffusion lengths along their height with very high diffusion lengths at the center of the ingot. Effective lifetimes as high as 1·1 ms are realized in 10 Ω cm Ga‐doped wafers after proper P‐diffusion and hydrogen passivation. Average effective lifetimes above 400 µs are also realized after P‐diffusion and hydrogen passivation for Ga‐doped wafers cut from 75 kg ingot where the response to P‐diffusion and hydrogen passivation is pronounced. High effective lifetimes are realized over the whole ingot with minimum values of 20 µs at the top of the ingot, indicating the possible use of about 85% of the ingot for solar cell production. Conversion efficiencies above 15·5% were realized in utilizing more than 80% of the ingot. High efficiencies of about 16% were realized in wafers with resistivities higher than 5 Ω cm p ‐type multicrystalline silicon wafers. Copyright © 2005 John Wiley & Sons, Ltd.     

晶体硅表面纳米孔减反光结构的制备及其性能表征

利用金属辅助硅化学刻蚀法在晶体硅表面制备 了 大面积有序硅纳米结构,并基于金属辅助硅化学刻蚀的机理,实现了硅纳米结构从线阵列到 孔阵列转变。漫反射光谱的测试结果表 明,相对于平面、金字塔结构,硅纳米孔织构的晶体硅具有卓越的减反光性能,在300100nm 光谱范围内的AM1.5G太阳光子的光反射损失比低于3.6%。硅纳米孔阵列减反光性能优异, 制备方法简单、快速,且其孔壁互连,有益于晶体硅太阳电池的后续制备工艺及其表面结构 机械稳定,可作为减反光结构应用于晶体硅太阳电池。     

Fabrication and characterization of thin-film silicon solar cells on alumina ceramic

Dendritic silicon layers are prepared on alumina ceramic by melting and regrowing a CVD Si layer with a BSG encapsulation. Thin-film solar cells fabricated by successive deposition of p- and n⁺-Si layers on this dendritic silicon exhibit a conversion efficiency of 2.6 percent under AM1 illumination.     

Improved efficiency of multicrystalline silicon solar cells by TiO2 antireflection coatings derived by APCVD process

This paper reports about the adaptation of the chemical vapor deposition (CVD) thin films technology to the fabrication process of multicrystalline silicon solar cells as a simple, low cost and very effective technology for efficiency device improvement by reducing reflection and improving the light-generated current. In this contribution, the higher reflection of a mc-Si solar cell surface is strongly reduced by the deposition of TiO₂ antireflection coating (ARC) on the front using the atmospheric pressure chemical vapor deposition method (APCVD). The surface morphology and elemental composition of the TiO₂ antireflective layers were revealed using scanning electron microscopy in conjunction with energy dispersive X-ray spectroscopy . The reflectivity was then reduced from 35% to 8.6% leading to the increase of the short circuit current J_sc which was 33.86 mA/cm² with a benefit of 5.23 mA/cm² (surface area=25 cm²) compared to the reference cell (without ARC). This simple and low cost technology induces a 14.26% conversion efficiency which is a gain of +3% absolute in comparison to the reference cell. The LBIC measurements of a typical multicrystalline cell confirmed the uniformity of the photocurrent distribution throughout the device. These results are encouraging and prove the effectiveness of the APCVD method for efficiency enhancement in silicon solar cells.     

Influence of surface texture on the defect‐induced breakdown behavior of multicrystalline silicon solar cells

The defect‐induced diode breakdown behavior in multicrystalline silicon solar cells, which is located at recombination active crystal defects, is influenced by the surface texturization because the wet chemical treatment selectively etches grain boundaries and dislocations, resulting in etch pits. On textured surfaces, the defect‐induced breakdown voltage is decreased, and the slope of the local reverse I–V characteristics in breakdown is steeper. We find that the local defect‐induced breakdown voltage correlates with the depth of the etch pits. It is suggested that the enhanced electric field in the space charge region at the tip could be superimposed by an electric field around metallic precipitates because of the internal Schottky contact formation with the surrounding silicon. The combined electric field could be responsible for the dependence of the defect‐induced breakdown behavior on the surface texture. Copyright © 2012 John Wiley & Sons, Ltd.     

Very high efficiency silicon solar cells-science and technology

Although it has been close to 60 years since the first operational silicon solar cell was demonstrated, the last 15 years have seen large improvements in the technology, with the best confirmed cell efficiency improved by over 50 %. The main drivers have been improved electrical and optical design of the cells. Improvements in the former area include improved passivation of contact and surface regions of the cells and a reduction in the volume of heavily doped material within the cell. Optically, reduced reflection and improved trapping of light within the cell have had a large impact. Such features have increased silicon cell efficiency to a recently confirmed value of 24.7%. Over recent years, good progress has been made in transferring some of the corresponding design improvements into commercial product with commercial cells of 17-18% efficiency now commercially available, record values of a mere 15 years ago. The theory supporting these improvements in bulk cell efficiency shows that thin layers of silicon, only a micron or so in thickness, should be capable of comparably high efficiency     

Laminated grid solar cells (LGCells) on multicrystalline silicon. Application of atomic hydrogen treatment

For the first time, solar cells of laminated grid cell (LGCell) design are fabricated on multicrystalline nontextured silicon (mc-Si). An efficiency of 15.9% is achieved. The effect of (n ⁺ pp ⁺)-mc-Si structure treatment by atomic hydrogen generated by a hot filament and microwave plasma is studied. Hydrogenation improves the parameters describing the dependence of the open-circuit voltage on the radiation intensity and the long-wavelength (λ = 1000 nm) sensitivity of the solar cell by 10–20%, which indicates that defects in mc-Si are passivated. Hydrogenation of the emitter side results in an increase in the series resistance of the solar cell, a decrease in the short-wavelength (λ = 400 nm) sensitivity by 30–35%, and the appearance of an oxygen peak in the energy-dispersive spectra (EDS). These effects are eliminated by fine etching of the emitter.     

18% efficient silicon photovoltaic devices by rapid thermaldiffusion and oxidation

For the first time, cells formed by rapid thermal processing (RTP) have resulted in 18%-efficient 1 and 4 cm² single-crystal silicon solar cells. Front surface passivation by rapid thermal oxidation (RTO) significantly enhanced the short wavelength response and decreased the effective front surface recombination velocity (including contact effects) from 7.5×10⁵ to about 2×10⁴ ×10⁴ cm/s. This improvement resulted in an increase of about 1% (absolute) in energy conversion efficiency, up to 20 mV in V_ot, and about 1 mA/cm² in J_sc. These RTO-induced enhancements are shown to be consistent with model calculations. Since only 3 to 4 min are required to simultaneously form the phosphorus emitter and aluminum back-surface-field (BSF) and 5 to 6 min are required for growing the RTO, this RTP/RTO process represents the fastest technology for diffusing and oxidizing ⩾18%-efficient solar cells. Both cycles incorporate an in situ anneal lasting about 1.5 min to preserve the minority carrier lifetime of lower quality materials such as dendritic-web and multicrystalline silicon. These high-efficiency cells confirmed that RTP results in equivalent performance to cells fabricated by conventional furnace processing (CFP). Detailed characterization and modeling reveals that because of RTO passivation of the front surface (which reduced J_0c by nearly a factor of ten), these RTP/RTO cells have become base dominated (J_0b≫J_0c), and further improvement in cell efficiency is possible by a reduction in back surface recombination velocity (BSRV). Based upon model calculations, decreasing the BSRV to 200 cm/s is expected to give 20%-efficient RTP/RTO cells