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室温快速固化环氧树脂胶粘剂 总被引:2,自引:0,他引:2
<正>华北工学院研发出室温快速固化环氧树脂胶粘剂。该胶选用双酚A环氧树脂为主料,以低分子聚酰胺650为固化剂,配以复合促进剂AD、稀释剂丙酮或环氧稀释剂,制出低成本室温快速固化环氧 相似文献
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室温固化耐热150度环氧树脂结构胶粘剂 总被引:2,自引:1,他引:2
介绍了一种以液体端羧基丁腈橡胶(CTBN)改性环氧树脂为主体,改性聚硫橡胶为固化剂的结构胶粘剂,该胶强度高,韧性好,室温固化10d,室温剪切强度23.6MPa,150℃剪切强度为13.3MPa,200摄氏度剪切强度为5.6MPa,室温剥离强度6.0kN.m^-1,综合性能优异,用于,航天工业耐热结构部件的粘接。 相似文献
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介绍了室温固化高温使用环氧树脂(EP)胶粘剂的特点,简述了EP胶粘剂的研究现状、存在的难点和发展趋势。 相似文献
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以腰果酚、甲醛和三乙烯四胺为原料,采用一步法制备了环氧树脂(EP)用腰果酚醛三乙烯四胺新型固化剂;然后以双酚A型EP为基体树脂、腰果酚醛三乙烯四胺为固化剂和聚乙烯醇缩丁醛(PVB)为增韧改性剂,制备了室温固化EP胶粘剂。研究结果表明:当w(PVB)=10%(相对于EP质量而言)时,胶粘剂的拉伸强度(30.58 MPa)、冲击强度(6.30 kJ/m2)和剪切强度(17.71 MPa)相对最大;此时改性EP胶粘剂的热稳定性相对最好,并且其断裂方式由脆性断裂变为韧性断裂。 相似文献
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以高活性EP(环氧树脂)[即AFG-90(缩水甘油胺型EP)]为基体树脂、耐热的多官能度BTDA(3,3′,4,4′-二苯甲酮四酸二酐)为固化剂和ME-1为叔胺类促进剂,制备了一种室温固化型耐高温EP胶粘剂。采用差示扫描量热(DSC)法、凝胶试验和热失重分析(TGA)法研究了该胶粘剂的固化反应特性和热性能,并探讨了a∶e[即n(酸酐基团)∶n(环氧基团)]比值、促进剂含量等对该胶粘剂性能的影响。研究结果表明:该胶粘剂具有良好的耐高温性能,并且可室温固化,其25℃时的凝胶时间为80 min,失重5%时的温度为311℃;当a∶e=0.80∶1、w(ME-1)=1.0%(相对于EP质量而言)时,该胶粘剂的综合性能相对最好,其室温、200℃时的拉伸剪切强度(钢-钢)分别为21.86、18.55 MPa。 相似文献
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室温固化环氧结构胶粘剂的现状及发展 总被引:6,自引:0,他引:6
本文描述了室温固化环氧树脂结构胶粘剂的历史和四个发展阶段。通过近年来国外一些公司生产的一些室温固化环氧树脂结构胶粘剂性能的分析指出今后室温固化型环氧树脂结构胶粘剂的发展方向是耐高温、高强度和缩短固化时间。 相似文献
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聚氨酯改性环氧胶粘剂的研究 总被引:9,自引:0,他引:9
聚氨酯预聚体通过催化剂与环氧树脂接枝反应合成了蒙氨酯改性环氧树脂。该树脂在改性胺和催化剂作用下,具有良好的施工性能和较高的强度,对极性基材和非极性PE材料具有良好的粘接性能。 相似文献
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以自制改性环氧树脂和改性胺类固化剂制备了双组份的室温固化柔性环氧胶黏剂。研究了固化剂种类、用量以及促进剂对胶黏剂粘接和力学性能的影响。还对该胶的固化行为进行了DSC分析,并采用FT-IR对固化过程中体系的官能团变化做了监测。结果表明:胶黏剂起始固化温度在70℃左右,体系中的氨基和环氧基对应的特征峰随着固化反应的进行有明显的减少,并最终消失;在室温下固化7d可获得优异的粘接和力学性能,常温剪切强度为30.5MPa,剥离强度为9.2k N/m,断裂伸长率为97%。 相似文献
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低成本室温快速固化环氧树脂胶粘剂的研制 总被引:4,自引:0,他引:4
以双酚A环氧树脂为基料,低分子聚酰胺650为固化剂,添加复合固化促进剂,制得低成本室温快速固化胶粘剂。所用原材料均为易购市售工业品,配制简单,使用方便。 相似文献
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采用直接水解法合成了氨丙基笼型倍半硅氧烷(OapPOSS)。为了改善POSS与环氧树脂的相容性和分散性,在OapPOSS基础上制备了仲氨基笼型倍半硅氧烷(SaPOSS),并将其用于E-51/脂肪胺室温固化环氧树脂改性,研究了SaPOSS对环氧树脂力学性能、玻璃化转变温度、介电性能的影响。结果表明:SaPOSS能显著提高树脂的冲击性能和耐热性,降低介电常数和介电损耗。当SaPOSS加入量为3%时,环氧树脂的冲击强度从原来的20.5kJ/m2,提高到了29.7kJ/m2,玻璃化转变温度从113℃提高到117℃,扫描电镜的观测结果与力学性能的变化趋势相一致。当SaPOSS加入量为5%时,介电损耗从原来的0.035降到了0.024,介电常数也有大幅下降。 相似文献
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Room Temperature curing compositions of epoxy resins with high temperature service capability (95-120°C) were formulated and evaluated. The compositions were based on selected high functionality atomatic epoxy polymers and multicomponent poly amine curing agent systems. Toughening was achieved by addition of a rubbery phase either by prereaction of the epoxy resin with carboxyl terminated (CTBN) or by amine terminated (ATBN) poly butadiene acrylonitrile. The latter elastomeric component served as a part of the poly amine curing agent.
Best results were achieved with an adhesive formulation comprising tetra glycidyl-4-4'-diaminodiphenylmethane (TGDDM) and triglycidyl ether of p-aminophenol with triethylenetetramine and addition of ATBN with a felt carrier.
Lap shear strengths of aluminum/aluminum specimens primed by silane coupling agent in the order of 22 MPa at 25°C and 11 MPa at 120°C with T-Peel strengths of 1.6N/mm at 25°C and 0.52 N/mm at 120°C, were obtained.
The thermal behaviour and transitions, the chemical and mechanical properties, the microstructure and morphology of the selected adhesive formulation were studied, using DSC, Gehman, FTIR, mechanical testing and SEM analysis, respectively.
Experimental results showed that the selected compositions could develop good high temperature (120°C) properties while cured at room temperature. Furthermore, their high temperature performance compares favorably or even exceeds that of commercially available room-temperature-curing adhesive compounds, and are competitive with elevated temperature cured film adhesives. 相似文献
Best results were achieved with an adhesive formulation comprising tetra glycidyl-4-4'-diaminodiphenylmethane (TGDDM) and triglycidyl ether of p-aminophenol with triethylenetetramine and addition of ATBN with a felt carrier.
Lap shear strengths of aluminum/aluminum specimens primed by silane coupling agent in the order of 22 MPa at 25°C and 11 MPa at 120°C with T-Peel strengths of 1.6N/mm at 25°C and 0.52 N/mm at 120°C, were obtained.
The thermal behaviour and transitions, the chemical and mechanical properties, the microstructure and morphology of the selected adhesive formulation were studied, using DSC, Gehman, FTIR, mechanical testing and SEM analysis, respectively.
Experimental results showed that the selected compositions could develop good high temperature (120°C) properties while cured at room temperature. Furthermore, their high temperature performance compares favorably or even exceeds that of commercially available room-temperature-curing adhesive compounds, and are competitive with elevated temperature cured film adhesives. 相似文献
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耐高温环氧树脂胶黏剂具有胶结强度高、综合性能好、使用工艺简便等特点,广泛应用于工业和生活的各个领域。环氧胶黏剂的耐高温性取决于固化物的热变形温度和热氧化稳定性,固化物中交联点间的距离越短,交联密度越大,分子链上的芳环、脂环、杂环等耐热刚性基团越多则热变形温度越高,高温力学性能越大,耐热性越好。可以通过改性环氧树脂,使用多官能度固化剂来提高环氧树脂胶黏剂的耐温性。主要从组成方面介绍影响环氧树脂胶黏剂耐高温性的影响因素,并就目前在制备耐高温环氧树脂方面的研究成果进行了综述。 相似文献