An integrated poly‐Si TFT current data driver with a data‐line pre‐charge function

Abstract— We have developed an integrated poly‐Si TFT current data driver with a data‐line pre‐charge function for active‐matrix organic light‐emitting diode (AMOLED) displays. The current data driver is capable of outputting highly accurate (±0.8%) current determined by 6‐bit digital input data. A novel current‐programming approach employing a data‐line pre‐charge function helps achieve accurate current programming at low brightness. A 1.9‐in. 120 × 136‐pixel AMOLED display using these circuits was demonstrated.     

A new a‐Si:H TFT pixel circuit employing data‐reflected negative‐bias annealing for a stable and uniform AMOLED

Abstract— A new a‐Si:H pixel circuit to reduce the VTH degradation of driving a‐Si:H thin‐film transistors (TFTs) by data‐reflected negative‐bias annealing (DRNBA) is presented. The new pixel circuit compensates VTH variation induced by non‐uniform degradation of each a‐Si:H pixel due to various electrical stress. The proposed pixel circuit was verified by SPICE simulations. Although the VTH of the driving a‐Si:H TFT varies from 2.5 to 3.0 and 3.5 V, the organic light‐emitting diode (OLED) current changes by only 1.5 and 2.8% in the emission period, respectively. During the negative‐bias annealing period, the negative VGS is applied to the driving TFT by using its own data signal. It is expected that the VTH shift of the driving TFT can be effectively reduced and the VTH shift can be compensated for in our new pixel circuit, which can contribute to a stable and uniform image from an a‐Si:H TFT active‐matrix OLED.     

Vt Compensated voltage‐data a‐Si TFT AMOLED pixel circuits

Abstract— Active‐matrix organic light‐emitting‐diode (AMOLED) displays are now entering the marketplace. The use of a thin‐film‐transistor (TFT) active matrix allows OLED displays to be larger in size, higher in resolutions and lower in power dissipation than is possible using a conventional passive matrix. A number of TFT active‐matrix pixel circuits have been developed for luminance control, while correcting for initial and electrically stressed TFT parameter variations. Previous circuits and driving methods are reviewed. A new driving method is presented in which the threshold‐voltage (V_t) compensation performance, along with various circuit improvements for amorphous‐silicon (a‐Si) TFT pixel circuits using voltage data, are discussed. This new driving method along with various circuit improvements is demonstrated in a state‐of‐the‐art 20‐in. a‐Si TFT AMOLED HDTV.     

Investigation of the hysteresis phenomenon of an a‐Si:H TFT at an elevated temperature for AMOLED displays

Abstract— The temperature dependence of the hysteresis of an a‐Si:H TFT has been investigated. An a‐Si:H TFT pixel driving scheme has been proposed and investigated. This scheme can eliminate changes in the organic light‐emitting diode (OLED) current caused by hysteresis of an a‐Si:H TFT. The VTH of the a‐Si:H TFT was changed according to the gate‐voltage sweep direction because of the hysteresis of the a‐Si:H TFT. The variation of VTH for a a‐Si:H TFT decreased from 0.41 to 0.17 V at an elevated temperature of 60°C because the sub‐threshold slope (s‐slope) of the a‐Si:H TFT, in the reverse voltage sweep direction, increased more than in the forward voltage sweep direction due to a greater increase in the initial electron trapped charges than the hole charges. Although the OLED current variation caused by hysteresis decreased (～14%) as the temperature increased, the error in the OLED current needed to be improved in order to drive the pixel circuit of AMOLED displays. The proposed pixel circuit can apply the reset voltage (?10 V) before the data voltage for the present frame that was written to fix the sweep direction of the data voltage. The variation in the OLED current caused by hysteresis of the a‐Si:H TFT was eliminated by the fixed voltage sweep direction in the proposed pixel circuit regardless of operating temperature.     

Active‐matrix organic light‐emitting diode using inverse‐staggered poly‐Si TFTs with a center‐offset gated structure

Abstract— A low‐cost active‐matrix backplane using non‐laser polycrystalline silicon (poly‐Si) having inverse‐staggered TFTs with amorphous‐silicon (a‐Si) n⁺ contacts has been developed. The thin‐film transistors (TFTs) have a center‐offset gated structure to reduce the leakage current without scarifying the ON‐currents. The leakage current of the center‐offset TFTs at Vg = ?10 V is two orders of magnitude lower than those of the non‐offset TFTs. The center‐offset length of the TFTs was 3 μm for both the switching and driving TFTs. A 2.2‐in. QQVGA (1 60 × 1 20) active‐matrix organic light‐emitting‐diode (AMOLED) display was demonstrated using conventional 2T + 1C pixel circuits.     

Novel a‐Si:H TFT pixel circuit for electrically stable top‐anode light‐emitting AMOLEDs

Abstract— A novel pixel circuit for electrically stable AMOLEDs with an a‐Si:H TFT backplane and top‐anode organic light‐emitting diode is reported. The proposed pixel circuit is composed of five a‐Si:H TFTs, and it does not require any complicated drive ICs. The OLED current compensation for drive TFT threshold voltage variation has been verified using SPICE simulations.     

Amorphous‐oxide TFT backplane for large‐sized AMOLED TVs

Abstract— Amorphous‐oxide thin‐film‐transistor (TFT) arrays have been developed as TFT backplanes for large‐sized active‐matrix organic light‐emitting‐diode (AMOLED) displays. An amorphous‐IGZO (indium gallium zinc oxide) bottom‐gate TFT with an etch‐stop layer (ESL) delivered excel lent electrical performance with a field‐effect mobility of 21 cm²/V‐sec, an on/off ratio of >10⁸, and a subthreshold slope (SS) of 0.29 V/dec. Also, a new pixel circuit for AMOLED displays based on amorphous‐oxide semiconductor TFTs is proposed. The circuit consists of four switching TFTs and one driving TFT. The circuit simulation results showed that the new pixel circuit has better performance than conventional threshold‐voltage (VTH) compensation pixel circuits, especially in the negative state. A full‐color 19‐in. AMOLED display with the new pixel circuit was fabricated, and the pixel circuit operation was verified in a 19‐in. AMOLED display. The AMOLED display with a‐IGZO TFT array is promising for large‐sized TV because a‐IGZO TFTs can provide a large‐sized backplane with excellent uniformity and device reliability.     

An averaging pixel structure using microcrystalline‐silicon films prepared at high temperature for AMOLED displays

Abstract— A new voltage‐addressed pixel using a multiple drive distribution has been developed to improve, in a simple way, the brightness uniformity of active‐matrix organic light‐emitting‐diode (AMOLED) displays. Moreover, circuits were realized using microcrystalline‐silicon (μc‐Si) films prepared at 600°C using a standard low‐pressure CVD system. The developed p‐channel TFTs exhibit a field‐effect mobility close to 6 cm²/V‐sec. The experimental results show that the proposed spatial distribution of driving TFTs improves the uniformity of current levels, in contrast to the conventional two‐TFT pixel structure. Backplane performances have been compared using circuits based on μc‐Si and furnace‐annealed polysilicon materials. Finally, this technology has been used to make an AMOLED demonstration unit using a top‐emission OLED structure. Thus, by combining both an μc‐Si active‐layer and a current‐averaging driver, an unsophisticated solution is provided to solve the inter‐pixel non‐uniformity issue.     

Low‐temperature amorphous‐silicon backplane technology development for flexible displays in a manufacturing pilot‐line environment

Abstract— A low‐temperature amorphous‐silicon (a‐Si:H) thin‐film‐transistor (TFT) backplane technology for high‐information‐content flexible displays has been developed. Backplanes were integrated with frontplane technologies to produce high‐performance active‐matrix reflective electrophoretic ink, reflective cholesteric liquid crystal and emissive OLED flexible‐display technology demonstrators (TDs). Backplanes up to 4 in. on the diagonal have been fabricated on a 6‐in. wafer‐scale pilot line. The critical steps in the evolution of backplane technology, from qualification of baseline low‐temperature (180°C) a‐Si:H process on the 6‐in. line with rigid substrates, to transferring the process to flexible plastic and flexible stainless‐steel substrates, to form factor scale‐up of the TFT arrays, and finally manufacturing scale‐up to a Gen 2 (370 × 470 mm) display‐scale pilot line, will be reviewed.     

Fabrication of a 7.6‐in.‐diagonal prototype ballistic electron surface‐emitting display on a glass substrate

Abstract— A prototype ballistic electron surface‐emitting display (BSD) was fabricated on a TFT or PDP glass substrate by using a low‐temperature process. A 84 × 63‐pixel, 7.6‐in.‐diagonal full‐color BSD shows excellent performance, comparable to the previously reported 2.6‐in. model. This result demonstrates the strong possibility of large‐panel BSDs.     

Solution‐processed oxide semiconductors for low‐cost and high‐performance thin‐film transistors and fabrication of organic light‐emitting‐diode displays

Abstract— High‐performance solution‐processed oxide‐semiconductor (OS) thin‐film transistors (TFTs) and their application to a TFT backplane for active‐matrix organic light‐emitting‐diode (AMOLED) displays are reported. For this work, bottom‐gated TFTs having spin‐coated amorphous In‐Zn‐O (IZO) active layers formed at 450°C have been fabricated. A mobility (μ) as high as 5.0 cm²/V‐sec, ?0.5 V of threshold voltage (VT), 0.7 V/dec of subthreshold swing (SS), and 6.9 × 10⁸ of on‐off current ratio were obtained by using an etch‐stopper (ES) structure TFT. TFTs exhibited uniform characteristics within 150 × 150‐mm² substrates. Based on these results, a 2.2‐in. AMOLED display driven by spin‐coated IZO TFTs have also been fabricated. In order to investigate operation instability, a negative‐bias‐temperature‐stress (NBTS) test was carried out at 60°C in ambient air. The IZO‐TFT showed ?2.5 V of threshold‐voltage shift (ΔVT) after 10,800 sec of stress time, comparable with the level (ΔVT = ?1.96 V) of conventional vacuum‐deposited a‐Si TFTs. Also, other issues regarding solution‐processed OS technology, including the instability, lowering process temperature, and printable devices are discussed.     

A new current‐mirror pixel circuit employing poly‐Si TFTs for active‐matrix organic light‐emitting‐diode displays

Abstract— A novel active‐matrix organic light‐emitting‐diode (AMOLED) display employing a new current‐mirror pixel circuit, which requires four‐poly‐Si TFTs and one‐capacitor and no additional signal lines, has been proposed and sucessfully fabricated. The experimental results show that a new current mirror can considerably compensate luminance non‐uniformity and scale down a data current more than a conventional current‐mirror circuit in order to reduce the pixel charging time and increase the minimum data current. Compared with a conventional two‐TFT pixel, the luminance non‐uniformity induced by the grain boundaries of poly‐Si TFTs can be decreased considerably from 41% to 9.1%.     

PECVD films for low‐temperature poly‐Si TFT‐LCD applications

Low‐temperature polycrystalline‐silicon (poly‐Si) thin‐film‐transistor (TFT) processes, based on PECVD amorphous‐silicon (a‐Si:H) precursor films and excimer‐laser crystallization, have been developed for application in the fabrication of active‐matrix liquid‐crystal‐displays (AMLCDs). The optimum process for depositing the precursor films has been identified. The relationship between excimer‐laser crystallization and poly‐Si film morphology has also been studied. Using these techniques, poly‐Si TFTs with a mobility of 275 cm²/V‐sec and on/off ratios of 1 × 10⁷ have been fabricated.     

Static active‐matrix OLED display without pixel refresh enabled by amorphous‐silicon non‐volatile memory

Abstract— An active‐matrix organic light‐emitting‐diode (AMOLED) display which does not require pixel refresh is demonstrated. This was achieved by replacing the thin‐film transistor (TFT) that drives the OLED with a non‐volatile memory TFT, in a 2‐transistor pixel circuit. The threshold voltage of the non‐volatile‐memory TFT can be changed by applying programming voltage pulses to the gate electrode. This approach eliminates the need for storage capacitors, increases the pixel fill factor, and potentially reduces power consumption. Each pixel can be individually programmed or erased using a standard active‐matrix addressing scheme. The programmed image is stored in the display even if power is turned off.     

Development of a 10.4‐in. UXGA display using low‐temperature poly‐Si technology

A new 10.4‐in.‐diagonal display with UXGA resolution (1600 H × 1200 V pixels) using low‐temperature polysilicon (poly‐Si) TFTs has been developed for notebook‐PC applications. The source drive technique uses integrated selector switches, which decreases the number of tape carrier packages (TCPs) for a poly‐Si TFT‐LCD and increases the connection pitch of the TCPs to the glass substrate. In this paper, we present a new display configuration and fabrication process.     

A novel TFT‐OLED integration for OLED‐independent pixel programming in amorphous‐Si AMOLED pixels

Abstract— The direct voltage programming of active‐matrix organic light‐emitting‐diode (AMOLED) pixels with n‐channel amorphous‐Si (a‐Si) TFTs requires a contact between the driving TFT and the OLED cathode. Current processing constraints only permit connecting the driving TFT to the OLED anode. Here, a new “inverted” integration technique which makes the direct programming possible by connecting the driver n‐channel a‐Si TFT to the OLED cathode is demonstrated. As a result, the pixel drive current increases by an order of magnitude for the same data voltages and the pixel data voltage for turn‐on drops by several volts. In addition, the pixel drive current becomes independent of the OLED characteristics so that OLED aging does not affect the pixel current. Furthermore, the new integration technique is modified to allow substrate rotation during OLED evaporation to improve the pixel yield and uniformity. The new integration technique is important for realizing active‐matrix OLED displays with a‐Si technology and conventional bottom‐anode OLEDs.     

A low‐cost low‐temperature thin‐film‐transistor backplane based on oxide semiconductor

Abstract— An indium‐gallium‐zinc‐oxide (IGZO) thin‐film transistor (TFT) based on an anodized aluminum‐oxide gate dielectric and photoresist passivation has been fabricated. The TFT showed a field‐effect mobility of as high as 18 cm²/V‐sec and a threshold voltage of only 0.5 V. A 50 × 50 AMOLED display based on this type of TFT was designed and fabricated. The average luminance of the panel was 150 cd/m², and the maximum pixel luminance was 900 cd/m².     

Amorphous‐silicon thin‐film transistor on soda‐lime glass

Abstract— Amorphous‐silicon (a‐Si:H) thin‐film transistors (TFTs) on soda‐lime glass were fabricated by using a diffusion barrier and a low‐temperature process at 200°C. The silicon nitride barrier was optimized in terms of diffusion blocking effectiveness, film adhesion, and surface finish. TFTs on soda‐lime glass achieved a saturation mobility 0.47 cm²/V‐sec, threshold voltage of 0 V, an off‐current of 7.7×10^?11 A, and a sub‐threshold swing of 1.0 V/dec. From diffusion experiments, a 30,000‐hour lifetime for the TFT device at 80°C was estimated, and the robustness of the silicon nitride barrier against long‐term migration of sodium was demonstrated.     

Flexible AMOLED displays on stainless‐steel foil

Abstract— The world's thinnest flexible full‐color 5.6‐in. active‐matrix organic‐light‐emitting‐diode (AMOLED) display with a top‐emission mode on stainless‐steel foil was demonstrated. The stress in the stainless‐steel foil during the thermal process was investigated to minimize substrate bending. The p‐channel poly‐Si TFTs on stainless‐steel foil exhibited a field‐effectmobility of 71.2 cm²/N‐sec, threshold voltage of ?2.7 V, off current of 6.7 × 10¹³ A/μm, and a subthreshold slope of 0.63 V/dec. These TFT performances made it possible to integrate a scan driver circuit on the panel. A top‐emission EL structure was used as the display element, and thin‐film encapsulation was performed to realize a thin and flexible display. The full‐color flexible AMOLED display on stainless‐steel foil is promising for mobile applications because of its thin, light, rugged, and flexible properties.     

Simple pixel circuits for high resolution and high image quality organic light emitting diode‐on‐silicon microdisplays with wide data voltage range

Two simple pixel circuits are proposed for high resolution and high image quality organic light‐emitting diode‐on‐silicon microdisplays. The proposed pixel circuits achieve high resolution due to simple pixel structure comprising three n‐type MOSFETs and one storage capacitor, which are integrated into a unit subpixel area of 3 × 9 µm² using a 90 nm CMOS process. The proposed pixel circuits improve image quality by compensating for the threshold voltage variation of the driving transistors and extending the data voltage range. To verify the performance of the proposed pixel circuits, the emission currents of 24 pixel circuits are measured. The measured emission current deviation error of the proposed pixel circuits A and B ranges from ?2.59% to +2.78%, and from ?1.86% to +1.84%, respectively, which are improved from the emission current deviation error of the conventional current‐source type pixel circuit when the threshold voltage variation is not compensated for, which ranges from ?14.87% to +14.67%. In addition, the data voltage ranges of the proposed pixel circuits A and B are 1.193 V and 1.792 V, respectively, which are 2.38 and 3.57 times wider than the data voltage range of the conventional current‐source type pixel circuit of 0.501 V.