xPb(Y_(1/2)Nb_(1/2))O_3-(1-x)Pb(Zr_(1/2)Ti_(1/2))O_3铁电陶瓷性能研究

系统地研究了 x Pb(Y1 / 2 Nb1 / 2 ) O3- (1- x) Pb(Zr1 / 2 Ti1 / 2 ) O3三元系铁电陶瓷材料 ,测量并计算了不同组分时的压电常数 (d33 )、介电常数 (εT3 3/ ε0 )、机电耦合系数 (kp、k31 )、以及弹性柔顺系数 (s E1 1 、s E1 2 、s E3 3 ) ,对 0 .0 7Pb(Y1 / 2Nb1 / 2 ) O3- 0 .93Pb(Zr1 / 2 Ti1 / 2 ) O3材料 ,d33 为 32 7× 10 - 1 2 C/ N,介电常数 εT3 3/ ε0 为 135 0 ,机电耦合系数 kp 大于 0 .6 ,弹性常数 SE1 1 和 SE3 3 均大于 17× 10 - 1 2 m2 / N。实现发现 ,当 x大于 0 .5 5时 ,x Pb(Y1 / 2 Nb1 / 2 ) O3- (1- x) Pb(Zr1 / 2 Ti1 / 2 ) O3不再是铁电材料     

低损耗、高Qm值Pb（Nb2／3Mn1／3）O3—Pb（Sb2／3Mn1／3）O3—PZT材料

研究了组分变化及掺杂对四元系Pb(Nb2/3Mn1/3)O3-Pb(Sb2/3Mn1/3）O3－PZT压电材料性能的影响,发现Zr/Ti比值在准同型相界附近该材料有最大的压电常数d33,而机械品质因数Qm值较小;Zr/Ti比偏离该相界时则机械品质因数Qm升高,相应的压电常数d33减小。通过改变Pb(Nb2/3Mn1/3)O3、Pb(Sb2/3Mn1/3)O3两组分的含量及掺入Sr、Ce等杂质,获得的材料介电损耗为0.14%,机械品质因数为2341,压电常数为216pC/N。     

A位取代对PZN-PNN-PZT压电陶瓷性能的影响

以固态氧化物为原料,采用固态合成工艺制备Pb(Zn1/3Nb2/3)O3-Pb(Ni1/3Nb2/3)O3-Pb(ZrTi)O3(PZN-PNN-PZT)压电陶瓷,并研究了锆钛比(r(Zr)/r(Ti))、Ba2+的A位取代及Ba2+、La3+的A位复合取代对压电陶瓷电性能的影响。结果表明,PZN-PNN-PZT压电陶瓷在r(Zr)/r(Ti)=1.03下,进行Ba2+,La3+的A位复合取代后,即式子在Pb0.92Ba0.04La0.04(Ni1/3Nb2/3)y(Zn1/3Nb2/3)z Zrm Tin O3时压电性能最佳,其介电常数εT33/ε0=5 657,压电常数d33=709pC/N,机电耦合系数kp=0.69,品质因数Qm=45,居里温度TC=180.9℃。     

A位取代对PZN-PNN-PZT压电陶瓷性能的影响

以固态氧化物为原料,采用固态合成工艺制备Pb(Zn1/3Nb2/3)O3-Pb(Ni1/3Nb2/3)O3-Pb(ZrTi)O3(PZN-PNN-PZT)压电陶瓷,并研究了锆钛比(r(Zr)/r(Ti))、Ba2+的A位取代及Ba2+、La3+的A位复合取代对压电陶瓷电性能的影响。结果表明,PZN-PNN-PZT压电陶瓷在r(Zr)/r(Ti)=1.03下,进行Ba2+,La3+的A位复合取代后,即式子在Pb0.92Ba0.04La0.04(Ni1/3Nb2/3)y(Zn1/3Nb2/3)z Zrm Tin O3时压电性能最佳,其介电常数εT33/ε0=5 657,压电常数d33=709pC/N,机电耦合系数kp=0.69,品质因数Qm=45,居里温度TC=180.9℃。     

Mn1/3Sb2/3对压电陶瓷材料性能的影响

研究了Pb(Mn1/3Sb2/3)y(Zn1/3Nb2/3)0.16(Zr,Ti)0.84-yO3(系压电陶瓷的主要特性，讨论了（Mn1/3Sb2/3)现代量变化对材料性能的影响。通过测试材料的介电损耗tanδ介电常数ε、机电耦合系数kp和机械品质因数Qm，判断出Mn1/3Sb2/3在PMZN系材料中的最佳取代范围。     

应用于压电能量收集器的PZT PZN系陶瓷材料

压电材料作为环境振动能量收集器的核心功能材料,是制备高性能能量收集器的关键。该文从提高能量收集效率入手,研究适合于能量转换的高性能压电陶瓷材料。采用两步合成工艺制备出了0.7Pb(Zr0.51Ti0.49)0.99O3-0.3Pb(Zn1/3Nb2/3)O3(PZT-PZN)压电陶瓷,研究了La2O3掺杂对其微观结构和机电性能的影响。实验结果表明,掺杂少量的La2O3能显著提高PZT-PZN陶瓷的压电系数(d33)、机电耦合系数(k31、kp)、介电常数(εr)等。当掺杂量为4%(摩尔分数)时,在1 200℃烧结PZT-PZN,显示出良好的压电和介电性能:d33=560pC/N,k31=0.376,kp=0.642,s1E1=16.5×10-12 m2/N,εr=3 125。     

一种大功率压电陶瓷变压器材料研究

采用传统陶瓷工艺制备了Pb(Ni1/2W1/2)O3-Pb(Mn1/3Sb2/3)O3-Pb(Ti1/2Zr1/2)O3(PNW-PMS-PZT)四元系压电陶瓷。分析了粉体和陶瓷的相结构组成,结果表明烧结温度的提高和PZT含量的增加有助于钙钛矿相的生成,同时发现PZT的含量在0.91～0.93附近有准同型相界存在。研究了室温下烧结温度和PMS含量对相对介电常数εr,机电耦合系数kp,机械品质因数Qm和压电常数d33的影响,实验表明在室温下随着PMS含量的增加εr、kp、d33逐渐减小,Qm增加;随着烧结温度的提高,kp、d33增大。制得了室温下εr为1959,d33为390pC/N,kp为0.614,Qm为1349的大功率压电陶瓷变压器压电材料。     

低损耗、高Q_m值Pb(Nb_(2/3)Mn_(1/3))O_3-Pb(Sb_(2/3)Mn_(1/3))O_3-PZT材料

研究了组分变化及掺杂对四元系 Pb( Nb2 /3Mn1 /3) O3- Pb( Sb2 /3Mn1 /3) O3- PZT压电材料性能的影响 ,发现 Zr/Ti比值在准同型相界附近该材料有最大的压电常数 d33,而机械品质因数 Qm 值较小 ;Zr/Ti比偏离该相界时则机械品质因数 Qm 升高 ,相应的压电常数 d33减小。通过改变 Pb( Nb2 /3Mn1 /3) O3、Pb( Sb2 /3Mn1 /3) O3两组分的含量及掺入 Sr、Ce等杂质 ,获得的材料介电损耗为 0 .14 % ,机械品质因数为 2 3 4 1,压电常数为 2 16p C/N。     

SiO2对低温烧结PMSZT压电陶瓷性能的影响

探讨了低温烧结时SiO2掺杂对锑锰锆钛酸铅Pb(Mn1/3Sb2/3)0.05Zr0.47Ti0.48O3(PMSZT)压电陶瓷性能的影响,通过X-射线衍射及扫描电镜分析Pb(Mn1/3Sb2/3)0.05Zr0.47Ti0.48O3 w(SiO2)(w=0.05%~0.30%,质量分数)陶瓷的相组成和显微结构。结果表明,合成温度900℃时,可得到钙钛矿结构。w(SiO2)不同时PMSZT试样均为四方相和三方相共存,随着w(SiO2)的增加,三方相在准同型相界中的比例略有增加。当w(SiO2)=0.10%时,得到电性能优良的压电陶瓷,相对介电常数3Tε3/0ε=1 290,介质损耗tanδ=0.4%,压电常数d33=264 pC/N,机电耦合系数kp=0.59,机械品质因数Qm=3 113。SiO2的加入使PMSZT陶瓷的居里温度降低,谐振频率随温度的变化几乎都是正。     

锑锰锆钛酸铅压电陶瓷的MnO2改性研究

探讨了MnO2过量对锑锰锆钛酸铅(Pb(Mn1/3Sb2/3)0.05Zr0.47Ti0.48O3,简写为PMSZT5)压电陶瓷的性能影响。通过X线衍射(XRD)分析了PMSZT5+z%MnO2(z=0～0.7,质量分数)陶瓷的相组成。结果发现,合成温度900℃保温2h后可得到完全钙钛矿结构。随着锰含量的增大,体系从准同型相界向三方相转变。z>0.1、1 240℃烧结温度下,介电常数ε3T3/ε0、压电常数d33、机电耦合系数kp达到最佳值,即ε3T3/ε0=1 560、d33=350pC/N、kp=0.63。该组成的谐振频率fr、横向机电耦合系数k31和压电常数d31的温度稳定性与未掺杂相比有所改善。过量锰的加入使PMSZT5的居里温度降低。     

Beam-Mode Piezoelectric Properties of Ternary Pb(In1/2Nb1/2)O3-Pb(Mg1/3Nb2/3)O3-PbTiO3 Single Crystals for Medical Linear Array Applications

In this work, the dielectric and beam-mode piezoelectric properties of ternary 0.35Pb(In_1/2Nb_1/2)O₃-0.35Pb(Mg_1/3Nb_2/3)O₃-0.30PbTiO₃ (PIMNT35/35/30) piezoelectric single crystals were investigated. The Curie temperature (T _C) and rhombohedral-to-tetragonal phase-transition temperature (T _rt) are 187°C and 127°C, about 30°C higher than those of PMNT crystals. The beam-mode coupling coefficient k ₃₃ ^w was found to be 90.3%. Furthermore, 3.5-MHz linear arrays based on PIMNT35/35/30 crystals and Pb(Zr_1−x Ti _x )O₃ ceramic (PZT-5H) were simulated using PiezoCAD software. The results indicate that the sensitivity and −6 dB bandwidth of a PIMNT35/35/30 transducer would be approximately 4 dB and 20% higher, respectively, compared with a traditional PZT transducer.     

Ba(Zn_(1/3)Nb_(2/3))O_3微波介质陶瓷的研究进展

3G移动通信事业的迅速发展对应用于基站的微波介质谐振器陶瓷材料的Q值提出了更高的要求。Ba(Zn1/3Nb2/3)O3微波介质陶瓷材料因为具有很高的Q值、接近于零的τf和适宜的εr而备受关注。介绍了Ba(Zn1/3Nb2/3)O3系列微波介质陶瓷的结构和性能、改性研究、纳米化制备工艺及Ba(Zn1/3Nb2/3)O3-Ba(Co1/3Nb2/3)O3复合技术,以期对该领域其他研究者有所帮助。     

Piezoelectric Study of 0.65Pb(Mg1/3,Nb2/3)O3-0.35PTO3 Nanopoder Ceramics

The piezoelectric properties of relaxor ferroelectric 0.65Pb(Mg1/3Nb2/3)O3-0.35PbTiO3 ceramic prepared by a sol-gel combustion method have been investigated as function of sintering temperature. The results show that its phase structure is near the morphoteropic phase boundary (MPB), and outstanding electrical properties are obtained with this composition. The highest piezoelectric coefficients were observed for the samples sintered at temperature of 1200oC. In comparison with pure PMN ((1-x)Pb(Mg1/3Nb2/3)O3(x)PbTiO3), the substitution of 35% PT results in the decrease of sintered temperature and improved the relaxation behavior.     

Ba(Zn1/3Nb2/3)O3-BaZrO3系统结构和介电性能的研究

研究了BaZrO3、MnCO3对Ba(Zn1/3Nb2/3)O3(BZN)系统结构和介电性能的影响.表明BaZrO3及MnCO3均能有效降低系统的烧结温度.系统中加入过多的BaZrO3(BZ)会降低介电常数,增大介质损耗,并使容量温度系数负向发展;加入微量MnCO3对系统的介电性能影响不大.系统中加入的x(BaZrO3)?%会生成较多的第二相BaNb2O6、BaZrO3摩尔分数增加至8%时,第二相消失.这是由于过多BZ的加入会在烧结温度到达前生成较多液相,促进烧结的同时也阻碍了ZnO的挥发,从而抑制了第二相的生成.向96%BZN-4%BZ中加入r(MnCO3)＝0.5%,也会抑制第二相的生成,这可能是由于Mn2+占据了B′位Zn2+挥发后留下的空位,形成固溶体,没有形成富Nb液相区,从而抑制了第二相的生成.     

New dielectric material system of Nd(Mg1/2Ti1/2)O3–CaTiO3 at microwave frequency

The microwave dielectric properties of (1 − x)CaTiO₃–xNd(Mg_1/2Ti_1/2)O₃ (0.1  x  1.0) ceramics prepared by the conventional solid state method have been investigated. The system forms a solid solution throughout the entire compositional range. The dielectric constant decreases from 152 to 27 as x varies from 0.1 to 1.0. In the (1 − x)CaTiO₃–xNd(Mg_1/2Ti_1/2)O₃ system, the microwave dielectric properties can be effectively controlled by varying the x value. At 1400 °C, 0.1CaTiO₃–0.9Nd(Mg_1/2Ti_1/2)O₃ has a dielectric constant (ε_r) of 42, a Q × f value of 35 000 GHz and a temperature coefficient of resonant frequency (τ_f) of −10 ppm/°C. As the content of Nd(Mg_1/2Ti_1/2)O₃ increases, the highest Q × f value of 43 000 GHz for x = 0.9 is achieved at the sintering temperature 1500 °C.     

Metal base transistor ofIn/Bi(Ba,Rb)O3/SrTiO3 (Nb)

A metal-base transistor of the MOMOM type with large current gain is reported. It uses Bi(Ba,Rb)O₃ and oxide semiconductors. I-V curves for a Bi(Ba,Rb)O₃ base transistor in the common-base configuration were studied from room temperature to 30 K. Current gain α~1 was obtained at 50 K. Transport behavior is determined by analysis of threshold voltages and derivatives dI_c/dV_cb     

Effect of titanium dioxide (TiO2) seed layer on the phase composition of 0.7Pb (Mg1/3Nb2/3)O3-0.3PbTiO3 film prepared by pulsed laser deposition

Lead-magnesium niobate-lead titanate (PMN-PT) thin films with and without the TiO₂ seed layer were deposited on Pt/Ti/SiO₂/Si substrates through pulsed laser deposition. The study aimed to characterize the effect of the TiO₂ seed layer on the phase composition and properties of PMN-PT film. Without the TiO₂ seed layer, the pure perovskite phase could be obtained in the thinner PMN-PT film while with the TiO₂ seed layer, the pure perovskite phase was formed in the thicker PMN-PT film. The ferroelectric properties of PMN-PT films with the TiO₂ seed layer were exhibited. As a result, the maximum amount of remnant polarization reached the amount of 32 μC/cm² for the PMN-PT thin film with the TiO₂ seed layer.     

H2/O2 plasma on polysilicon thin-filmtransistor

It is reported for that H₂ plasma followed by O₂ plasma is more effective for passivating grain boundary states in polysilicon thin film. Polysilicon thin-film transistors (TFTs) made after H₂/O₂ plasma treatment can exhibit a turn-on threshold voltage of -0.1 V, a subthreshold swing of 0.154 V/decade, an ON/OFF current ratio I_on/I_off over 1×10⁸, and an electron mobility of 40.2 cm² /V-s     

PbO和Bi_2O_3-Li_2CO_3助烧剂对Pb(Zr_(0.9)Ti_(0.1))O_3厚膜热释电性能的影响

采用丝网印刷工艺制备了Pb(Zr0.9T0.1)O3(PZT)厚膜,研究了过量PbO和Bi2O3-Li2CO3共同助烧对PZT厚膜低温烧结特性、微观结构、相构成以及介电和热释电性能的影响。结果表明:随着过量PbO及Bi2O3-Li2CO3添加量的增加,PZT厚膜的烧结温度和晶粒尺寸均逐渐降低。当PbO过量6.4%(质量分数)、Bi2O3-Li2CO3添加量为5.4%(质量分数)时,PZT厚膜可在900℃低温下致密成瓷,且其热释电系数和探测率优值均得到大幅提高;所得样品在30℃时的热释电系数为10.6×10–8C.cm–2.K–1,探测率优值为8.2×10–5Pa–1/2。