Double heterojunction bipolar transistor in Al/sub x/Ga/sub 1-x/As/GaAs/sub 1-y/Sb/sub y/ system

Double heterojunction bipolar transistors based on the Al/sub x/Ga/sub 1-x/As/GaAs/sub 1-y/Sb/sub y/ system are examined. The base layer consists of narrow band gap GaAs/sub 1-y/Sb/sub y/ and the emitter and collector consist of wider band gap Al/sub x/Ga/sub 1-x/As. Preliminary experimental results show that AlGaAs/GaAsSb/GaAs DHBTs exhibit a current gain of five and a maximum collector current density of 5*10/sup 4/ A/cm/sup 2/.<>     

GaAs/Al/sub x/Ga/sub 1-x/As quantum well infra-red photodetectors with cutoff wavelength lambda /sub c/=14.9 mu m

The longest wavelength quantum well infra-red photo-detector (QWIP) ever measured with a cutoff wavelength of lambda /sub c/=14.9 mu m is demonstrated when cooled to 10 K. Prospects for even longer wavelength detectors are promising.<>     

Fabrication of InGaP/Al/sub 0.98/Ga/sub 0.02/As/GaAs oxide-confined collector-up heterojunction bipolar transistors

A partially oxidized Al/sub 0.98/Ga/sub 0.02/As layer was introduced between the emitter and base of collector-up heterojunction bipolar transistors (C-up HBTs) to suppress the leakage current and improve the current gain. Dependence of device current gain and leakage current on oxidation temperature was investigated. At lower oxidation temperature, the current gain can be effectively improved. Current gain and base sheet resistance were 79 and 203 ohm/sq. for the C-up HBT oxidized at 400/spl deg/C.     

GaAs／AlxGa1—xAs和AlxGa1—xAs／AlAs超晶格的喇曼散射对比研究

报道不同层厚的ＡｌＡｓ／ＡｌｘＧａ１－ｘＡｓ及ＧａＡｓ／ＡｌｘＧａ１－ｘＡｓ短周期超晶格的纵光学声子模的室温喇曼散射测量结果．在非共振条件下,观察到ＡｌＡｓ／ＡｌｘＧａ１－ｘＡｓ中限制在ＡｌｘＧａ１－ｘＡｓ混晶层中的类ＧａＡｓＬＯ限制模和限制在ＡｌＡｓ层中的ＡｌＡｓＬＯ限制模,还观察到ＧａＡｓ／ＡｌｘＧａ１－ｘＡｓ中限制在ＡｌｘＧａ１－ｘＡｓ混晶层中的类ＡｌＡｓＬＯ限制模和限制在ＧａＡｓ层中的ＧａＡｓＬＯ限制模．在近共振条件下,还观察到了ＡｌＡｓ／ＡｌｘＧａ１－ｘＡｓ中ＡｌＡｓ的界面模．根据线性链模型,把测量的ＬＯ限制模的频率按照ｑ＝ｍｎ＋１２πα０展开,给出了ＡｌｘＧａ１－ｘＡｓ混晶的类ＡｌＡｓ支和类ＧａＡｓ支光学声子色散曲线．     

Performance improvement in tensile-strained In/sub 0.5/Al/sub 0.5/As/In/sub x/Ga/sub 1-x/As/In/sub 0.5/Al/sub 0.5/As metamorphic HEMT

This paper proposes a In/sub 0.5/Al/sub 0.5/As/In/sub x/Ga/sub 1-x/As/In/sub 0.5/Al/sub 0.5/As (x=0.3-0.5-0.3) metamorphic high-electron mobility transistor with tensile-strained channel. The tensile-strained channel structure exhibits significant improvements in dc and RF characteristics, including extrinsic transconductance, current driving capability, thermal stability, unity-gain cutoff frequency, maximum oscillation frequency, output power, power gain, and power added efficiency.     

Al/sub 0.3/Ga/sub 0.7/As/In/sub x/Ga/sub 1-x/As (0/spl les/x/spl les/0.25) doped-channel field-effect transistors (DCFET's)

The properties of both lattice-matched and strained doped-channel field-effect transistors (DCFET's) have been investigated in AlGaAs/In/sub x/Ga/sub 1-x/As (0/spl les/x/spl les/0.25) heterostructures with various indium mole fractions. Through electrical characterization of grown layers in conjunction with the dc and microwave device characteristics, we observed that the introduction of a 150-/spl Aring/ thick strained In/sub 0.15/Ga/sub 0.85/As channel can enhance device performance, compared to the lattice-matched one. However, a degradation of device performance was observed for larger indium mole fractions, up to x=0.25, which is associated with strain relaxation in this highly strained channel. DCFET's also preserved a more reliable performance after biased-stress testings.<>     

The microwave power performance comparisons of Al/sub x/Ga/sub 1-x/As/In/sub 0.15/Ga/sub 0.85/As (x=0.3, 0.5, 0.7, 1.0) doped-channel HFETs

The properties of doped-channel field-effect transistors (DCFET) have been thoroughly investigated on Al/sub x/Ga/sub 1-x/As/InGaAs (x= 0.3, 0.5, 0.7, 1) heterostructures with various Al mole fractions. In this study, we observed that by introducing a 200-/spl Aring/-thick Al/sub 0.5/Ga/sub 0.5/As (x=0.5) Schottky layer can enhance the device power performance, as compared with the conventional x=0.3 AlGaAs composition system. However, a degradation of the device power performance was observed for further increasing the Al mole fractions owing to their high sheet resistance and surface states. Therefore, Al/sub 0.5/Ga/sub 0.5/As Schottky layer design provides a good opportunity to develop a high power device for power amplifier applications.     

Ultralow leakage In/sub 0.53/Ga/sub 0.47/As p-i-n photodetector grown on linearly graded metamorphic In/sub x/Ga/sub 1-x/P buffered GaAs substrate

A novel top-illuminated In/sub 0.53/Ga/sub 0.47/As p-i-n photodiodes (MM-PINPD) grown on GaAs substrate by using linearly graded metamorphic In/sub x/Ga/sub 1-x/P (x graded from 0.49 to 1) buffer layer is reported. The dark current, optical responsivities, noise equivalent power, and operational bandwidth of the MM-PINPD with aperture diameter of 60 /spl mu/m are 13 pA, 0.6 A/W, 3.4/spl times/10/sup -15/ W/Hz/sup 1/2/, and 7.5 GHz, respectively, at 1550 nm. The performances of the MM-PINPD on GaAs are demonstrated to be comparable to those of a similar device made on InGaAs-InP substrate.     

Negative differential resistance of GaAs/Al/sub x/Ga/sub 1-x/As multiquantum well structures under high power photoexcitation: structure optimisation for an oscillator

A study is presented of the photocurrent behaviour of p-i-n diodes having GaAs/Al/sub x/Ga/sub 1-x/As MQW absorption regions for varying incident power, incident wavelength and barrier height, given by the Al fraction x. Optimum results for applications in high power oscillators are expected to be obtained for 0.1>     

Avalanche noise characteristics of single Al/sub x/Ga/sub 1-x/As(0.3

Groves  C. Chia  C.K. Tozer  R.C. David  J.P.R. Rees  G.J. 《Quantum Electronics, IEEE Journal of》2005,41(1):70-75

Electrical behavior of modulation-and delta-doped Al x Ga1 − x As/In y Ga1 − y As/GaAs PHEMT structures

Modulation-and delta-doped Al_xGa_{1 ? x} As/In_yGa_{1 ? y} As/GaAs PHEMT structures are grown by MBE. The effect is examined of changes in the technique and level of doping on the electrical behavior of the structures. Photoluminescence spectroscopy combined with Hall-effect measurements is shown to be an effective strategy for the purpose. The experimental results are interpreted on the basis of calculated conductionband diagrams.     

Very low-noise Al/sub 0.3/Ga/sub 0.7/As/Ga/sub 0.65/In/sub 0.35/As/GaAs single quantum-well pseudomorphic HEMTs

AlGaAs/GaInAs/GaAs pseudomorphic HEMTs with an InAs mole fraction as high as 35% in the channel has been successfully fabricated. The device exhibits a maximum extrinsic transconductance of 700 mS/mm. At 18 GHz, a minimum noise figure of 0.55 dB with 15.0 dB associated gain was measured. At 60 GHz, a minimum noise figure as low as 1.6 dB with 7.6 dB associated gain was also obtained. This is the best noise performance yet reported for GaAs-based HEMTs.<>     

High-performance, metamorphic In/sub x/Ga/sub 1-x/As tunnel diodes grown by molecular beam epitaxy

Thin In/sub x/Ga/sub 1-x/As tunnel junction diodes having compositions from x=0.53 to 0.75 that span a range of bandgap energies from 0.74 to 0.55 eV, were grown on InP and metamorphic, step-graded In/sub x/Al/sub 1-x/As/InP substrates using molecular beam epitaxy and evaluated in the context of thermophotovoltaic (TPV) applications. Both carbon and beryllium were investigated as acceptor dopants. Metamorphic tunnel diodes with a bandgap of 0.60 eV (x=0.69) using carbon acceptor doping displayed highest peak current densities, in excess of 5900 A/cm/sup 2/ at a peak voltage of 0.31 V, within a 200 /spl Aring/ total thickness tunnel junction. Identically doped lattice-matched tunnel diodes with a bandgap of 0.74 eV exhibited lower peak current densities of approximately 2200 A/cm/sup 2/ at a higher peak voltage of 0.36 V, consistent with the theoretical bandgap dependence expected for ideal tunnel diodes. Specific resistivities of the 0.60 eV bandgap devices were in the mid-10/sup -5/ /spl Omega/-cm/sup 2/ range. Together with their 200 /spl Aring/ total thickness, the electrical results make these tunnel junctions promising for TPV applications where low-resistance, thin metamorphic tunnel junctions are desired.     

Al x Ga1 – x As/GaAs/Al x Ga1 – x As Double Quantum Well with a Thin AlAs Interwell Barrier: Structural Characterization by SIMS and XRD

An Al _x Ga_{1 – x} As/GaAs/Al _x Ga_{1 – x} As double quantum well with a thin AlAs interwell barrier is examined by SIMS and double-crystal XRD for an AlAs thickness of about 10 or 18 Å. Thickness and other structural parameters are determined for each layer. The rocking curves are found to indicate a fairly abrupt interwell barrier.     

Effect of strain on microwave noise characteristics in In/sub 0.52/Al/sub 0.48/As/In/sub x/Ga/sub 1-x/As (0.53

Chough  K.B. Hong  W.-P. Florez  L. Song  J.I. 《Electronics letters》1993,29(15):1338-1340

Turn-on voltage investigation of GaAs-based bipolar transistors with Ga/sub 1-x/In/sub x/As/sub 1-y/N/sub y/ base layers

The fundamental lower limit on the turn on voltage of GaAs-based bipolar transistors is first established, then reduced with the use of a novel low energy-gap base material, Ga/sub 1-x/In/sub x/As/sub 1-y/N/sub y/. InGaP/GaInAsN DHBTs (x/spl sim/3y/spl sim/0.01) with high p-type doping levels (/spl sim/3/spl times/10/sup 19/ cm/sup -3/) and dc current gain (/spl beta//sub max//spl sim/68 at 234 /spl Omega///spl square/) are demonstrated. A reduction in the turn-on voltage over a wide range of practical base sheet resistance values (100 to 400 /spl Omega///spl square/) is established relative to both GaAs BJTs and conventional InGaP/GaAs HBTs with optimized base-emitter interfaces-over 25 mV in heavily doped, high dc current gain samples. The potential to engineer turn-on voltages comparable to Si- or InP-based bipolar devices on a GaAs platform is enabled by the use of lattice matched Ga/sub 1-x/In/sub x/As/sub 1-y/N/sub y/ alloys, which can simultaneously reduce the energy-gap and balance the lattice constant of the base layer when x/spl sim/3y.     

多片LPE生长AlxGa1—xAs／GaAs单晶薄膜

介绍了一种新的“分离三室水平推挤式多片外延舟”，可在国产水平外延炉中实现多片单晶薄膜外延。同时，研究了适合于多片外延的各种工艺条件。用于研制的ｐ－ＡｌｘＧａ１－ｘＡｓ／ｐ－ｎ－ｎ＾＋－ＧａＡｓ太阳通电池，ＡＭ０．２５℃，１２０ｍＷ．ｃｍ＾－２的转换室１９．８％。     

用于HB-LED的Al_xGa_(1-x)As材料DBR的设计

给出了一种计算光学薄膜反射率的一般方法，并主要应用这种计算方法进行高亮度发光二极管中分布式布拉格反射器（ＤＢＲ）的设计工作。     

Investigation of the impact of Al mole-fraction on the consequences of RF stress on Al/sub x/Ga/sub 1-x/N/GaN MODFETs

Variations of the low-frequency noise (LFN), power, and dc characteristics of a variety of SiN/sub x/ passivated AlGaN/GaN MODFETs with different values of Al mole-fraction, gate length, and gate drain spacing upon RF stress are investigated. It is experimentally evidenced that the variation of Al mole-fraction (x) of the barrier Al/sub x/Ga/sub 1-x/N layer from 0.2 to 0.4, has no considerable impact on the drain and gate low-frequency noise current characteristics. The most noticeable variation on the device characteristics upon long-term RF stressing has been on the pinch-off voltage. Although no material degradation by increasing the Al mole-fraction has been evidenced through the low-frequency noise data, it is observed that the variation of pinch-off voltage upon RF stressing becomes more important as the Al mole-fraction increases.     

Characteristics of In/sub x/Al/sub 1-x/N-GaN high-electron mobility field-effect transistor

GaN-based field effect transistors commonly include an Al/sub x/Ga/sub 1-x/N barrier layer for confinement of a two-dimensional electron gas (2DEG) in the barrier/GaN interface. Some of the limitations of the Al/sub x/Ga/sub 1-x/N-GaN heterostructure can be, in principle, avoided by the use of In/sub x/Al/sub 1-x/N as an alternative barrier, which adds flexibility to the engineering of the polarization-induced charges by using tensile or compressive strain through varying the value of x. Here, the implementation and electrical characterization of an In/sub x/Al/sub 1-x/-GaN high electron mobility transistor with Indium content ranging from x=0.04 to x=0.15 is described. The measured 2DEG carrier concentration in the In/sub 0.04/Al/sub 0.96/N-GaN heterostructure reach 4/spl times/10/sup 13/ cm/sup -2/ at room temperature, and Hall mobility is 480 and 750 cm/sup 2//V /spl middot/ s at 300 and 10 K, respectively. The increase of Indium content in the barrier results in a shift of the transistor threshold voltage and of the peak transconductance toward positive gate values, as well as a decrease in the drain current. This is consistent with the reduction in polarization difference between GaN and In/sub x/Al/sub 1-x/N. Devices with a gate length of 0.7 /spl mu/m exhibit f/sub t/ and f/sub max/ values of 13 and 11 GHz, respectively.