Measurement of the increase in the SHG coefficient of proton-exchanged LiNbO/sub 3/ after annealing using a grating diffraction technique

The effect of limited levels of annealing on the second harmonic generation (SHG) coefficient (d/sub 33/) of proton-exchanged LiNbO/sub 3/ has been determined by measuring nonphasematched SHG in a diffraction grating structure. The effect of annealing is to partially restore the intrinsic nonlinearity of the proton-exchanged layer.<>     

LiNbO/sub 3/ waveguide SHG device with ferroelectric-domain-inverted grating formed by electron-beam scanning

A ferroelectric-domain-inverted grating was fabricated by electron beam scanning in LiNbO/sub 3/. A waveguide second harmonic generation (SHG) device with the grating was fabricated and demonstrated for the first time. The experiments were performed using a CW-Nd:YAG laser, and normalised SHG conversion efficiency of 50%/W was obtained.<>     

New method of domain inversion in LiNbO/sub 3/ using thermal oxidation of Ti film

A new technique for fabricating domain inversion regions in -c face LiNbO/sub 3/ by thermal oxidation of Ti is reported. This technique can minimise refractive index changes in such regions, thus it is suitable for quasiphase-matching (QPM) second harmonic generation (SHG). A prototype QPM waveguide SHG device is also demonstrated.<>     

Harmonic blue light generation in periodically poled bulk near-stoichiometric MgO:LiNbO/sub 3/

A periodically poled structure with 6.95 /spl mu/m period and 10 mm interaction length was fabricated in a 1 mm-thick 1.8 mol% MgO doped near-stoichiometric LiNbO/sub 3/ (MgSLN) by using a multi-pulse poling technique. Blue SHG characteristics of this periodically poled MgSLN were investigated, in comparison with a periodically poled 5 mol% MgO doped congruent LiNbO/sub 3/.     

Blue light generation in LiNbO/sub 3/ waveguide SHG device with first order domain-inverted grating formed by EB scanning

An LiNbO/sub 3/ waveguide SHG device for blue light generation by first order quasiphase-matching was fabricated using the electron-beam scanning domain inversion technique for the first time. The period of the domain-inverted grating was 3 mu m and blue light of wavelength 0.44 mu m was obtained. The normalised SHG efficiency was 70%/W.<>     

Second-harmonic generation in ion-implanted KTiOPO/sub 4/ planar waveguides

The first example of second harmonic generation (SHG) in an ion implanted KTiOPO/sub 4/ waveguide is reported. This was formed by helium implantation, and SHG was achieved using zero order mode phase matching at lambda approximately=1.07 mu m. The results indicate that the high nonlinearity remains in the guiding region after implantation. The conversion efficiency in the guide is estimated to be >10% for approximately 1 mu J 20 ns pulsed excitation.<>     

Fabrication of domain reversed gratings for SHG in LiNbO/sub 3/ by electron beam bombardment

A novel technique for the lithographic definition and the fabrication of domain reversed regions in LiNbO/sub 3/ is reported, with application to periodic structures for second harmonic generation (SHG). For the first time, to the authors' knowledge, domain reversal has been achieved on the negative c-face of the crystal. Such a structure should be useful for quasi-phase-matched SHG of infrared laser radiation.<>     

Preparation and growth of thin film Pb/sub 2/Sr/sub 2/Ca/sub 0.5/Y/sub 0.5/Cu/sub 3/O/sub 8+ delta / superconductors by laser ablation

For the first time, the preparation of thin films of superconducting Pb/sub 2/Sr/sub 2/Y/sub 0.5/Ca/sub 0.5/Cu/sub 3/O/sub 8+ delta / material using standard bulk target preparation conditions and the laser ablation technique is reported. In common with much of the bulk characteristics, it is found that the width of the superconducting transition is large, extending from T/sub c,onset/ between 70-83 K and T/sub c,zero/ between 16-20 K.<>     

Synthesis and Multiscale Evaluation of LiNbO3‐Containing Silicate Glass‐Ceramics with Efficient Isotropic SHG Response

A study of bulk second harmonic generation (SHG) response of lithium niobium silicate glass‐ceramics is presented. The observed macroscopic SHG signals have an isotropic 3D nature. To interpret this particular nonlinear optical response, a multiscale approach is used in which clear correlations between structure and optical response are characterized from the sub‐micrometer to the millimeter scale. In particular, it is inferred that the radial distribution of the LiNbO₃ crystallites in spherulite domains is at the origin of the isotropic bulk second order optical property. It is suggested that spherulitic crystallization in glass‐ceramic is a challenging method to elaborate isotropic nonlinear optical properties in inorganic materials.     

Evidence of enhanced hypersensitive transition in erbium-doped fibers with different Al/sub 2/O/sub 3/ content

Precise spectroscopic absorption measurements of erbium-doped aluminosilicate fibers with different Al/sub 2/O/sub 3/ content were performed with the Judd-Ofelt analysis. From the Judd-Ofelt analysis, the /spl Omega//sub 2/ parameters of Er/sup 3+/ ions in these fibers were found to be about three times as large as those in aluminosilicate bulk glasses. The enhancement of the /spl Omega//sub 2/ parameters led to much stronger line strength of hypersensitive transitions in a fiber form than in a bulk glass form. This indicates that the distortion of the ligand field around the Er/sup 3+/ ions are more enhanced in a fiber form than in a bulk glass form. Furthermore, the /spl Omega//sub 6/ and the /spl Omega//sub 2/ parameters increased with an increase of q content up to 20 000 ppm. This Al/sub 2/O/sub 3/-content dependence of the /spl Omega//sub 6/ parameter was consistent with that of the line strength and the spontaneous emission probabilities of the transition corresponding to the /sup 4/I/sub 13/2//spl rarr//sup 4/I/sub 15/2/.     

Charge trapping and dielectric reliability of SiO/sub 2/-Al/sub 2/O/sub 3/ gate stacks with TiN electrodes

A detailed study on charge trapping and dielectric reliability of SiO/sub 2/-Al/sub 2/O/sub 3/ gate stacks with TiN electrodes has been carried out. Due to the inherent asymmetry of the dual layer stack all electrical properties studied were found to be strongly polarity dependent. The gate current is strongly reduced for injection from the TiN (gate) electrode compared to injection from the n-type Si substrate. For substrate injection, electron trapping occurs in the bulk of the Al/sub 2/O/sub 3/ film, whereas for gate injection mainly hole trapping near the Si substrate is observed. Furthermore, no significant interface state generation is evident for substrate injection. In case of gate injection a rapid build up of interface states occurs already at small charge fluence (q/sub inj/ /spl sim/ 1 mC/cm/sup 2/). Dielectric reliability is consistent with polarity-dependent defect generation. For gate injection the interfacial layer limits the dielectric reliability and results in low Weibull slopes independent of the Al/sub 2/O/sub 3/ thickness. In the case of substrate injection, reliability is limited by the bulk of the Al/sub 2/O/sub 3/ layer leading to a strong thickness dependence of the Weibull slope as expected by the percolation model.     

Improved electrical and reliability Characteristics of HfN--HfO/sub 2/-gated nMOSFET with 0.95-nm EOT fabricated using a gate-first Process

By using a high-temperature gate-first process, HfN--HfO/sub 2/-gated nMOSFET with 0.95-nm equivalent oxide thickness (EOT) was fabricated. The excellent device characteristics such as the sub-1-nm EOT, high electron effective mobility (peak value /spl sim/232 cm/sup 2//V/spl middot/s) and robust electrical stability under a positive constant voltage stress were achieved. These improved device performances achieved in the sub-1-nm HfN--HfO/sub 2/-gated nMOSFETs could be attributed to the low interfacial and bulk traps charge density of HfO/sub 2/ layer due to the 950/spl deg/C high-temperature source/drain activation annealing process after deposition of the HfN--HfO/sub 2/ gate stack.     

SODEL FET: novel channel and source/drain profile engineering schemes by selective Si epitaxial growth technology

In this paper, novel channel and source/drain profile engineering schemes are proposed for sub-50-nm bulk CMOS applications. This device, referred to as the silicon-on-depletion layer FET (SODEL FET), has the depletion layer beneath the channel region, which works as an insulator like a buried oxide in a silicon-on-insulator MOSFET. Thanks to this channel structure, junction capacitance (C/sub j/) has been reduced in SODEL FET, i.e., C/sub j/ (area) was /spl sim/0.73 fF//spl mu/m/sup 2/ both in SODEL nFET and pFET at Vbias =0.0 V. The body effect coefficient /spl gamma/ is also reduced to less than 0.02 V/sup 1/2/. Nevertheless, current drives of 886 /spl mu/A//spl mu/m (I/sub off/=15 nA//spl mu/m) in nFET and -320 /spl mu/A//spl mu/m (I/sub off/=10 nA//spl mu/m) in pFET have been achieved in 70-nm gate length SODEL CMOS with |V/sub dd/|=1.2 V. New circuit design schemes are also proposed for high-performance and low-power CMOS applications using the combination of SODEL FETs and bulk FETs on the same chip for 90-nm-node generation and beyond.     

Electrooptic ferroelectric Na/sub 0.5/K/sub 0.5/NbO/sub 3/ films

We report on waveguiding and electrooptic properties of epitaxial Na/sub 0.5/K/sub 0.5/NbO/sub 3/ films grown by radio-frequency magnetron sputtering on Al/sub 2/O/sub 3/(11_02) single crystal substrates. High optical waveguiding performance has been demonstrated in infrared and visible light. The in-plane electrooptic effect has been recorded in transmission using a transverse geometry. At dc fields, the effective linear electrooptic coefficient was determined to 28 pm/V, which is promising for modulator applications.     

Diffusion coefficient of B in HfO/sub 2/

We implanted B ions in a 110-nm-thick HfO/sub 2/ layer, subjected the substrates to various thermal processes, and evaluated the diffusion coefficient by comparing experimental and numerical data. We found that the diffusion coefficient of B in HfO/sub 2/ is higher than that in SiO/sub 2/ by about four orders and almost the same as that in Si. Therefore, the penetration of B through this layer can be expected to be significant, making the use of a cover layer indispensable for p/sup +/ polycrystalline silicon gate devices.     

BV/sub CEO/--BV/sub CBO/ separation and sharpness of breakdown in high-speed bipolar transistors

The effect of secondary impact ionization by the noninitiating carrier on the near avalanche behavior of high-speed n-p-n bipolar transistors is studied. We show that secondary collector ionization by generated holes traveling back toward the base layer significantly reduces BV/sub CBO/ if the hole ionization coefficient is higher than that of electrons [/spl beta//sub p/(E)>/spl alpha//sub n/(E)]: positive feedback associated with a strong secondary ionization sharpens the breakdown characteristic by speeding up carrier multiplication and decreases separation between the open-base collector-emitter (BV/sub CEO/) and the open-emitter base-collector (BV/sub CBO/) breakdown voltages. The effect of secondary ionization on the BV/sub CEO/-BV/sub CBO/ separation has not previously been described. Multiplication coefficient comparisons for representative InP, GaAs, and Si collectors indicate all structures can sustain low-current above BV/sub CEO/ operation from a transport (nonthermal) point of view, although the different degrees of secondary ionization in various semiconductors lead to fundamental differences when InP is compared to GaAs and Si since for the latter materials /spl beta//sub p/(E)相似文献   

Bias-temperature instabilities of polysilicon gate HfO/sub 2/ MOSFETs

Bias-temperature instabilities (BTI) of HfO/sub 2/ metal oxide semiconductor field effect transistors (MOSFETs) have been systematically studied for the first time. NMOS positive BTI (PBTI) exhibited a more significant V/sub t/ instability than that of PMOS negative BTI (NBTI), and limited the lifetime of HfO/sub 2/ MOSFETs. Although high-temperature forming gas annealing (HT-FGA) improved the interface quality by passivating the interfacial states with hydrogen, BTI behaviors were not strongly affected by the technique. Charge pumping measurements were extensively used to investigate the nature of the BTI degradation, and it was found that V/sub t/ degradation of NMOS PBTI was primarily caused by charge trapping in bulk HfO/sub 2/ rather than interfacial degradation. Deuterium (D/sub 2/) annealing was found to be an excellent technique to improve BTI immunity as well as to enhance the mobility of HfO/sub 2/ MOSFETs.     

Reduction of 1/f noise in multiplexed linear In/sub 0.53/Ga/sub 0.47/As detector arrays via epitaxial doping

A significant (2-5*) reduction in 1/f noise was observed in In/sub 0.53/Ga/sub 0.47/As photodetector arrays read out by a PMOS multiplexer, when the epitaxial InP cap layer doping was changed from undoped to sulfur-doped n type of about 3*10/sup 16/ cm/sup -3/. A further decrease was observed when the InP buffer layer was also changed from undoped to sulfur-doped n type of about 5*10/sup 17/ cm/sup -3/. Data was presented for the variation of 1/f noise, within a temperature range of 18 degrees C to -40 degrees C. Surface states at the InP cap/SiN interface appears to be the primary source of 1/f noise, with the bulk states at the n/sup -/In/sub 0.53/Ga/sub 0.47/As buffer hetero-interface as a secondary source. Increased n-type doping in the high-bandgap InP cap and buffer layers may reduce electron trapping, and thus 1/f noise. The measured noise spectrum of InGaAs photodetectors varies as f/sup y/ with y being approximately -0.45 for device structures with doped and undoped InP can layers. For a doped InP buffer layer, this value of y is -0.3.<>     

High-temperature 4.5-/spl mu/m type-II quantum-well laser with Auger suppression

Laser emission at 4.2-4.5 /spl mu/m has been observed at temperatures up to 310 K in pulsed optical pumping experiments on type-II quantum-well (QW) lasers with four constituents in each period (InAs-Ga/sub 1-x/In/sub x/Sb-InAs-AlSb). The characteristic temperature, T/sub 0/, is 41 K, and a peak output power exceeding 2 W/facet is observed at 200 K. The power conversion efficiency per facet of /spl ap/0.2% up to 200 K is within a factor of 2 of the theoretical value. The 300 K Auger coefficient of 4/spl times/10/sup -27/ cm/sup 6//s extracted from the threshold pump intensity demonstrates that Auger losses have been suppressed by a factor of four.     

Improved device performance and reliability in high /spl kappa/ HfTaTiO gate dielectric with TaN gate electrode

The device performance and reliability of higher-/spl kappa/ HfTaTiO gate dielectrics have been investigated in this letter. HfTaTiO dielectrics have been reported to have a high-/spl kappa/ value of 56 and acceptable barrier height relative to Si (1.0 eV). Through process optimization, an ultrathin equivalent oxide thickness (EOT) (/spl sim/9 /spl Aring/) has been achieved. HfTaTiO nMOSFET characteristics have been studied as well. The peak mobility of HfTaTiO is 50% higher than that of HfO/sub 2/ and its high field mobility is comparable to that of HfSiON with an intentionally grown SiO/sub 2/ interface, indicative of superior quality of the interface and bulk dielectric. In addition, HfTaTiO dielectric has a reduced stress-induced leakage current (SILC) and improved breakdown voltage compared to HfO/sub 2/ dielectric.