Al2O3P/6061Al复合材料瞬间液相扩散连接

用纯金属作中间层TLP连接颗粒增强铝基复合材料,接头存在增强相偏聚区,是接头力学性能的薄弱区域.控制增强相偏聚区是改善接头力学性能的一种有效途径.文中尝试用Cu,Al金属复合中间层TLP连接Al2O3P/6061Al复合材料,探讨了其接头的显微结构和力学性能特点.结果表明,用Cu,Al金属复合中间层能够控制接头增强相偏聚,改善接头抗剪强度.在连接温度600℃,保温时间60min的工艺条件下,10 μm Al/10 μm Cu/10 μm Al复合中间层接头增强相偏聚明显下降,接头抗剪强度110 MPa;1.5 μm Cu/10 μm Al/1.5 μm Cu复合中间层接头无明显的增强相偏聚,接头抗剪强度123 MPa.     

铝基复合材料的Al-Cu合金中间层瞬间液相扩散连接

采用Al—Cu合金作为中间层研究了铝基复合材料(Al2O3p／6061Al)瞬间液相扩散连接接头的组织与力学性能。研究结果表明，在Al—Cu／A12O3p／6061Al接头中无明显的增强相偏聚区和增强相贫化区，且接头成分分布较为均匀；在Al—C。合金中间层厚度30μm、连接温度600℃、连接时间30min条件下，接头抗剪强度为130～140MPa,较Cu／A12O3p／6061Al接头抗剪强度提高45％。因此，采用Al—Cu中间层是改善铝基复合材料接头力学性能的有效途径。     

采用AgCuTi活性钎料真空钎焊MgAl_2O_4透明陶瓷

采用Ag Cu Ti活性钎料箔带分别在880℃/10 min和880℃/60 min两种工艺下对Mg Al2O4陶瓷进行了真空钎焊连接,接头冶金质量良好,两种工艺下接头抗剪强度分别为52.4 MPa和61.3 MPa.微观分析结果表明,靠近陶瓷母材附近生成了连续的扩散反应层结构,结合XRD结果,该层主要由Cu Al2O4和Ti O两种化合物组成;钎缝基体区由Cu(s,s),Ag(s,s)和Ti O相组成.     

AgCu+nano-Al_2O_3复合钎料钎焊TC4合金与Al_2O_3陶瓷:界面结构及接头性能

通过向Ag Cu共晶钎料中添加nano-Al2O3增强相(2%,质量分数)并采用高能球磨的方法获得了Ag Cu+nano-Al2O3复合钎料(Ag Cu C钎料)。采用Ag Cu C钎料实现了TC4合金与Al2O3陶瓷的高质量钎焊连接,确定了TC4/Ag Cu C/Al2O3钎焊接头的典型界面组织结构为:TC4/α-Ti+Ti2Cu扩散层/Ti3Cu4层/Ag(s,s)+Ti3Cu4+Ti Cu/Ti3Cu4层/Ti3(Cu,Al)3O层/Al2O3。Nano-Al2O3的添加抑制了钎缝中连续的Ti-Cu化合物层的生长,同时在钎缝中形成了颗粒状Ti-Cu化合物相增强的Ag基复合材料,改善了钎焊接头的界面组织。随着钎焊温度的升高,各反应层厚度逐渐增加,颗粒状Ti-Cu化合物不断长大,Ag基复合材料组织逐渐细小。当钎焊温度T=920℃,保温时间t=10 min时接头抗剪强度达到最大为67.8 MPa,典型断口分析表明:压剪过程中,裂纹起源于钎角处并沿钎缝扩展后转入Al2O3陶瓷,最终在Al2O3陶瓷母材侧发生断裂。     

Ti2AlNb合金瞬时液相扩散连接接头界面组织及性能分析

采用Ti/Ni作为中间层实现了Ti2AlNb合金的连接(transient liquid phase, TLP),研究了TLP连接接头的界面组织及其形成机制,并且分析了不同保温时间对接头界面组织和力学性能的影响规律. 结果表明,Ti2AlNb合金TLP连接接头主要表现为等温凝固区和冷却凝固区两个明显的特征区域. 接头的典型界面组织为Ti2AlNb/B2/Nb3Al+B2+τ3+Ti2Ni/ Ti2AlNb. 随着保温时间的延长,接头中Nb3Al和Ti2Ni相消失,τ3相不断减少,B2相不断增多. 当连接温度为1 180 ℃,保温时间为20 min时,接头的室温抗剪强度最大,达到428 MPa,高温(650 ℃)抗剪强度达到407 MPa. 接头的断裂主要发生在冷却凝固区的τ3相上.     

Al_2O_3-TiC复合陶瓷与Q235钢扩散连接界面组织结构

采用Ti/Cu/Ti复合中间层通过液相扩散连接技术实现了Al2O3-TiC复合陶瓷与Q235低碳钢的扩散连接.采用扫描电镜、电子探针及X射线衍射等测试手段对Al2O3-TiC/Q235扩散连接接头的显微组织、断口形貌及相组成进行了分析.结果表明,Al2O3-TiC/Q235界面结合紧密,没有显微孔洞、裂纹及未连接区域;Al2O3-TiC/Q235界面附近有各种各样的新相生成,如TiO,Ti3Al,Cu2Ti4O及Cu3Ti3O,所生成的TiO相及复杂结构氧化物Cu3Ti3O和Cu2Ti4O都具有金属特性,对于促进Al2O3-TiC/Q235的可靠连接起到重要作用;接头抗剪强度达143MPa,断口表现为脆性断裂特征,Al2O3-TiC/Q235接头断在界面附近的Al2O3-TiC内.     

高纯氧化铝陶瓷与无氧铜的钎焊

电真空应用中,要求高纯氧化铝与无氧铜的连接接头具有较高的强度和气密性.采用Ag-Cu-Ti活性钎料直接钎焊高纯氧化铝陶瓷与无氧铜,研究了钎焊温度和保温时间对接头组成、界面反应以及接头抗剪强度的影响,研究了铜基体材料对钎焊接头组织和界面反应的影响.钎焊温度850～900℃,保温时间20～60 min时,接头抗剪强度接近或达到90 MPa.钎焊工艺参数偏离上述范围时,接头抗剪强度较低.接头由Cu/Ag(Cu),Cu(Ag,Ti)/Cu3Ti3O(TiO2)/Al2O3组成,反应层以Cu3Ti3O为主,个别工艺条件下有一定量的TiO2生成,铜基体视工艺条件的不同对钎焊接头组织有一定影响.     

Al_2O_3陶瓷与紫铜的间接钎焊

利用Sn0.3Ag0.7Cu-4%Ti金属化涂料,在金属化温度900℃、保温时间30 min条件下,对Al2O3陶瓷表面进行金属化处理,然后在钎焊温度600℃、保温时间5 min条件下,利用Sn0.3Ag0.7Cu钎料实现Al2O3陶瓷与紫铜的间接钎焊,通过SEM,EDS和XRD等分析测试手段对金属化层显微组织、Al2O3陶瓷/铜接头结合强度和接头断口形貌等进行了分析.结果表明,利用金属化方法得到了均匀且与Al2O3陶瓷结合良好的金属化层,并实现了Al2O3陶瓷与铜的间接连接,接头界面结构为Cu/Cu3Sn/Cu6Sn5/Sn(s,s)+Ti6Sn5/Al2O3陶瓷.钎焊接头抗剪强度为13.6 MPa,接头断裂发生于金属间化合物层.     

母材微量元素对6063铝合金接触反应钎焊的影响

采用铜中间层对6063铝合金进行了接触反应钎焊连接,分析了接头的典型界面结构,着重研究了铝合金母材中微量元素对界面及接头力学性能的影响行为.结果表明,接头界面相主要有Al2Cu,α-Al,Mg2Si,ω-FeCu2Al7.Fe元素导致较高连接温度下ω-FeCu2Al7板条相的生成,影响接头强度.Mg,Si元素以Mg2Si形式富集在钎缝中心,并随保温时间的延长而加剧富集.接头抗剪强度受控于界面产物的种类及形貌、等温凝固的程度.在570℃/60min时接头平均抗剪切强度最高,可达105.3MPa.     

钎焊及其设备

20093152镀锌钢板脉冲电弧钎焊接头界面组织及性能分析/李瑞峰…//焊接学报.-2008,29(11):93~96采用脉冲钨极氩弧钎焊使用CuSi3钎料对镀锌钢板进行了连接。主要研究脉冲频率变化对接头界面组织和力学性能的影响。结果表明,当电弧脉冲频率由100Hz增加到2000Hz时,电弧钎焊熔池的搅拌和冲刷作用效果逐渐增强,促进了界面须状金属间化合物的破碎行为和熔池成分过冷区域的增加,使得钎料区域内部Fe5Si3(Cu)强化相数量不断增多,弥散宽度变宽,由40μm增加到120μm,接头显微硬度最大值也相应增加,由175MPa增加到204MPa。图3参920093153Al2O3-TiC/Q235真空扩散钎焊界面组织及抗剪强度/王娟…//焊接学报.-2008,29(12):25~28为了获得Al2O3-TiC陶瓷基复合材料与Q235钢的接头,采用Ti/Cu/Ti复合中间层对Al2O3-TiC复合材料与Q235低碳钢进行了真空扩散钎焊。通过扫描电镜、能谱分析和电子探针、抗剪试验等测试方法对Al2O3-TiC/Q235扩散钎焊界面的组织、成分及结合强度进行分析。结果表明,控制加热温度为1110℃,可获得界面抗剪...     

Features of microstructure and fracture in the transient liquid phase bonded aluminium-based metal matrix composite joints

Transient liquid phase (TLP) bonded aluminium-based metal matrix composite (MMC) joints can be classified into three distinct regions, i.e. the particulate segregation region, the denuded particulate region and the base material region. The microstracture of the particulate segregation region consists of alumina particulate and Al alloy matrix with the Al2 Cu and MgA12 04. It contains more and smaller alumina particalates compared with the base material region. The TLP bonded joints have the tensile strength of lSO MPa -200 MPa and the shear strength of 70 MPa ~ 100 MPa. With increasing tensile stress, cracks initiate in the particulate segregation region, especially in the particulate/particulate inter.face and the particulate/matrix integCace, and propagate along particulate/matrix integCace, througth thin matrix metal and by linking up the close cracks. The particulate segregation region is the weakest during tensile testing and shear testing due to obviously increased proportion of weak bonds (particulate-particulate bond and particulate-matrix bond).     

C_f/SiC复合材料与钛合金Ag-Cu-Ti-C_f复合钎焊

采用Ag-Cu-Ti-Cf(Cf:碳纤维)复合钎料作中间层,在适当的工艺参数下真空钎焊Cf/SiC复合材料与钛合金,利用SEM,EDS和XRD分析接头微观组织结构,利用剪切试验检测接头力学性能.结果表明,钎焊时复合钎料中的钛与Cf/SiC复合材料反应,在Cf/SiC复合材料与连接层界面形成Ti3SiC2,Ti5Si3和少量TiC化合物的混合反应层.复合钎料中的铜与钛合金中的钛发生互扩散,在连接层与钛合金界面形成不同成分的Cu-Ti化合物过渡层.钎焊后,形成碳纤维强化的致密复合连接层.碳纤维的加入缓解了接头的残余热应力,Cf/SiC/Ag-Cu-Ti-Cf/TC4接头抗剪强度明显高于Cf/SiC/Ag-Cu-Ti/TC4接头.     

Effect of immersion Ni plating on interface microstructure and mechanical properties of Al/Cu bimetal

A nickel-based coating was deposited on the pure Al substrate by immersion plating, and the Al/Cu bimetals were prepared by diffusion bonding in the temperature range of 450–550 °C. The interface microstructure and fracture surface of Al/Cu joints were studied by scanning electron microscopy (SEM) and X-ray diffraction (XRD). The mechanical properties of the Al/Cu bimetals were measured by tensile shear and microhardness tests. The results show that the Ni interlayer can effectively eliminate the formation of Al-Cu intermetallic compounds. The Al/Ni interface consists of the Al₃Ni and Al₃Ni₂ phases, while it is Ni-Cu solid solution at the Ni/Cu interface. The tensile shear strength of the joints is improved by the addition of Ni interlayer. The joint with Ni interlayer annealed at 500 °C exhibits a maximum value of tensile shear strength of 34.7 MPa.     

Characterization of diffusion-bonded joint between Al and Mg using a Ni interlayer

Aluminum and magnesium were joined through diffusion bonding using Ni interlayer. The microstructure and mechanical performance of the Al/Ni/Mg joints at different temperatures was investigated by means of scanning electron microscope(SEM), electro-probe microanalyzer(EPMA), X-ray diffraction(XRD), Vickers hardness testing, and shear testing. The results show that the addition of Ni interlayer eliminates the formation of Mg–Al intermetallic compounds and improves the bonding strength of the Al/Mg joints. The Al/Ni/Mg joints are formed by the diffusion of Al, Ni and Mg, Ni. The microstructure at the joint interface from Al side to Mg side is Al substrate/Al–Ni reaction layer/Ni interlayer/Mg–Ni reaction layer/Mg substrate multilayer structure. The microhardness of the Mg–Ni reaction layer has the largest value of HV 255.0 owing to the existence of Mg_2Ni phase.With the increase of bonding temperature, the shear strength of the joints increases firstly and then decreases.The Al/Ni/Mg joint bonds at 713 K for 90 min, exhibiting the maximum shear strength of 20.5 MPa, which is greater than that of bonding joint bonded directly or with Ag interlayer. The fracture of the joints takes place at the Mg–Ni interface rather than the Al–Ni interface, and the fracture way of the joints is brittle fracture.     

Formation process, microstructure and mechanical property of transient liquid phase bonded aluminium-based metal matrix composite joint

1　INTRODUCTIONThealuminium basedmetalmatrixcomposites(MMCs)areadvancedmaterialsthathavesuperiorproperties ,especiallyincreasedstiffness ,highstrength ,goodwearresistanceandsuperiorelevatedtemperatureproperties .Theyhavereceivedconsider ableattentionascandidatesforadvancedindustrialapplications[1,2 ] .But ,theirapplicationshavebeenseverelyrestrictedbythelackofasuitablejoiningmethod[3] .AlthougthfusionweldingmethodscanbeusedtojointheMMCs ,themethodsnormallytendtoresultinunfavourablejoint…     

Investigation of small Sn–3.5Ag–0.5Cu additions on the microstructure and properties of Sn–8Zn–3Bi solder on Au/Ni/Cu pads

The formation of intermetallic compounds and the shear strength of Sn–Zn–Bi solder alloys with various (0, 1, 3, 5 and 7 wt%) weight percentages of Sn–Ag–Cu were investigated on Au/Ni metallized Cu pads depending on the number of reflow cycles. In Sn–Zn–Bi solder joints, scallop-shaped AuZn₃ intermetallic compound (IMC) particles were found at the interfaces and in the solder ball regions, fine Bi- and needle-shaped Zn-rich phase were observed in the Sn matrix. After Sn–Ag–Cu additions, an additional Ag–Zn intermetallic compound layer was adhered to the top surface of the AuZn₃ layer at the interface and fine spherical-shaped AgZn₃ intermetallic compound particles were detected in the solder ball regions together with Bi- and Zn-rich phase volumes. After the addition of Sn–Ag–Cu, the shear strength of Sn–Zn–Bi solder joints increased due to the formation of the fine AgZn₃ intermetallic compound particles. The shear strengths of Sn–Zn–Bi and Sn–Zn–Bi/7 wt% Sn–Ag–Cu solder joints after one reflow cycle were about 44.5 and 53.1 MPa, respectively and their shear strengths after eight reflow cycles were about 43.4 and 51.6 MPa, respectively.     

采用Al及Al-12Si中间层的AZ31B镁合金TLP接头的组织和性能

采用Al及Al-12Si为中间层对AZ31B镁合金进行过渡液相扩散焊,用环境扫描电镜及万能试验机测试并分析了接头组织与强度之间的关系。研究结果表明：采用Al作为中间层时,随着保温时间的增加,Al12Mg17金属间化合物含量降低,接头强度升高;采用Al-12Si作为中间层时,含硅相Mg2Si对焊缝的强化提高了接头强度,但保温时间过长时,Mg2Si偏聚于焊缝中心会降低接头性能。     

AgCu钎料钎焊TC4钛合金与QCr0.8铬青铜接头界面结构及性能

采用AgCu28钎料实现了TC4钛合金与QCr0.8铬青铜的真空钎焊,利用SEM, EDS以及XRD等分析方法确定TC4/AgCu/QCr0.8接头的典型界面结构为TC4钛合金/CuTi +Cu3Ti2 +CuTi2/Ag(s,s) +Cu4Ti/Ag(s,s)+Cu(s,s)/QCr0.8铬青铜. 研究了工艺参数对接头组织和性能的影响. 结果表明,随着钎焊温度和保温时间的增加,钎缝中银铜共晶组织减少,钛铜化合物增多. 接头抗剪强度随钎焊温度的升高先增加后降低,在钎焊工艺参数为890 ℃/0 min时,获得最大抗剪强度449 MPa.保温时间的延长使得接头脆性钛铜化合物增多,接头性能下降,因此随保温时间延长接头抗剪强度显著降低.     

AgCuTi-Al钎焊C_f/SiC与TC4接头分析

采用AgCuTi-Al混合粉末作为中间层,在适当的工艺参数下真空钎焊Cf/SiC复合材料和钛合金,利用扫描电镜,能谱仪和X射线衍射对接头的微观组织结构进行分析,利用剪切试验测定接头的力学性能.结果表明,在钎焊过程中,钎料中的钛与Cf/SiC复合材料中的基体SiC,碳纤维发生反应,在Cf/SiC复合材料侧形成了TiC,T...