65 nm体硅工艺NMOS中单粒子多瞬态效应的研究

针对NMOS场效应晶体管由重离子辐射诱导发生的单粒子多瞬态现象,参考65 nm体硅CMOS的单粒子瞬态效应的试验数据,采用TCAD仿真手段,搭建了65 nm体硅NMOS晶体管的TCAD模型,并进一步对无加固结构、保护环结构、保护漏结构以及保护环加保护漏结构的抗单粒子瞬态效应的机理和能力进行仿真分析。结果表明,NMOS器件的源结和保护环结构的抗单粒子多瞬态效应的效果更加明显。     

Research on the effect of single-event transient of an on-chip linear voltage regulator fabricated on 130 nm commercial CMOS technology

We report single-event transient (SET) responses of an on-chip linear voltage regulator in 130 nm commercial standard CMOS technology by heavy ion experiments at first. Responses can be distinguished by the load current. When the light load current was applied, the negative SET on the output of the regulator larger than 200 mV was not observed, while the positive SETs that are larger than 400 mV and last for about 200 ns were observed. By comparison, when the heavy load current was applied, both positive and negative SETs that are larger than 400 mV and last for several hundred ns were observed. Next, the mechanism behind the phenomenon is analysed and then verified by the post-layout SPICE circuit simulation. It is demonstrated that the input voltage, load current and the load capacitance are key elements in determining the severity of SET. Finally, the most sensitive node is located by analysis and SPICE circuit simulation, which lies in the output of the amplifier inside of the bandgap reference (BGR). This result is a primary consideration in the development of the hardening technique.     

Negative bias temperature instability induced single event transient pulse narrowing and broadening

The effect of negative bias temperature instability(NBTI) on a single event transient(SET) has been studied in a 130 nm bulk silicon CMOS process based on 3D TCAD device simulations.The investigation shows that NBTI can result in the pulse width and amplitude of SET narrowing when the heavy ion hits the PMOS in the high-input inverter;but NBTI can result in the pulse width and amplitude of SET broadening when the heavy ion hits the NMOS in the low-input inverter.Based on this study,for the first time we ...     

纳米CMOS电路的单粒子瞬态影响因素研究

进入纳米尺度后,单粒子瞬态(SET)成为高能粒子入射VLSI产生的重要效应,准确、可靠的SET模拟对评估VLSI的可靠性有着重要的影响。以反相器为例,针对脉冲峰值和半高全宽两个指标,研究了电路模拟中影响SET的因素,主要有电流脉冲幅值、脉冲宽度、负载电容、环境温度及器件尺寸。通过对45和65 nm两种技术节点下的电路的仿真,研究了这些因素对SET的影响,并探讨了可能的原因。结果显示,这些因素对SET的影响趋势和程度有很大的差异,且器件尺寸越小,这些因素对SET的影响越显著。通过设置合适的参数,可以实现电路的抗辐射加固。     

PDSOIBTSNMOS器件的三维SEU仿真

采用silvaco软件对抗辐射PDSOIBTSNMOS器件进行了三维SEU仿真。器件建模采用devedit软件,工艺参考标准0．8μmPDSOI工艺平台。器件基于SIMOXS01材料,其埋氧层厚度为375nm,顶层硅膜厚度为205nm。三维SEU仿真的入射粒子轨迹垂直于器件表面,主要选取了垂直于沟道方向（DS）和平行于...     

InP/In_xGa_(1-x)As异质结构中Zn元素的扩散机制

采用闭管扩散方式实现了Zn元素在晶格匹配InP/In_(0.53)Ga_(0.47)As及晶格失配InP/In_(0.82)Ga_(0.18)AS两种异质结构材料中的P型掺杂,利用二次离子质谱(SIMS)以及扫描电容显微技术(SCM)对Zn在两种材料中的扩散机制进行了研究.SIMS测试表明:Zn元素在晶格失配材料中的扩散速度远大于在晶格匹配材料中的扩散速度,而SCM测试表明:两种材料中的实际PN结深度与SIMS测得的Zn扩散深度之间存在一定的差值,这是由于扩散进入材料中的Zn元素并没有被完全激活,而晶格失配材料中Zn的激活效率相对更低,使得晶格失配材料中Zn元素扩散深度与PN结深度的差值更大.SCM法是一种新颖快捷的半导体结深测试法,对于半导体器件工艺研究具有重要的指导意义.     

负偏置温度不稳定性导致单粒子瞬态脉冲的压缩与展宽

摘要：本文基于3D TCAD 器件模拟,研究了130nm体硅工艺下,负偏置温度不稳定性（NBTI）对单粒子瞬态（SET）脉冲的影响。研究结果表明：当粒子轰击高输入反相器的PMOS管时,NBTI能够导致所产生的SET脉冲的宽度和幅度随时间不断压缩,当粒子轰击低输入反相器的NMOS管时,NBTI能够导致所产生的SET脉冲的宽度和幅度随时间不断展宽。基于研究结果,本文首次提出：NBTI对粒子轰击NMOS管所产生的SET脉冲的影响已经十分严重,在进行抗辐照加固设计时必须考虑NBTI所造成的影响。     

Layout-based Single Event Mitigation Techniques for Dynamic Logic Circuits

Due to the intrinsic lack of restoring paths, dynamic logic circuits have significant single-event susceptibility, and thus, they are not preferred in applications requiring high reliability when compared to static logic. However, in high speed applications, this circuit family is still very attractive. This papers presents two layout-based single-event resilient dynamic logic designs. The resultant SET pulse is suppressed because of charge-sharing in the layout-level. Simulation results verify that they enjoy higher single event tolerance. Experimental results validate the fact that approximately 20?~?30 % of magnitude reduction in cross-section is achieved in both designs. On the other hand, the increase in single-event performance is achieved at the expense of power and area overheads of 10 and 15 %, respectively, using our layout style in 130 nm CMOS bulk technology.     

A 10-Transistor 65 nm SRAM Cell Tolerant to Single-Event Upsets

A novel SRAM cell tolerant to single-event upsets (SEUs) is presented in this paper. By adding four more transistors inside, the proposed circuit can obtain higher critical charge at each internal node compared to the conventional 6-transistor (6T) cell. Arrays of 2k-bit capacitance of these two designs were implemented in a 65 nm CMOS bulk technology for comparison purpose. Radiation experiments showed that, at the nominal 1.0 V supply voltage, the proposed cell achieves 47.1 % and 49.3 % reduction in alpha and proton soft error rates (SER) with an area overhead of 37 %.     

纵向NPN管ESD保护结构的设计与分析

针对一种5V0.6μm BiCMOS工艺的纵向NPN管,设计了ESD保护结构。为了克服传统纵向NPN管ESD自触发结构触发电压较高的缺陷,提出一种带P+/N阱二极管的改进型自触发ESD结构,利用NPN管集电极与基极之间的寄生电容和二极管作为电容耦合元件。流片及测试结果表明,该保护结构的触发电压得到有效降低,且抗ESD能力超过4kV的人体模型。     

Simulating single-event burnout of n-channel power MOSFET's

Single-event burnout of power MOSFETs is a sudden catastrophic failure mechanism that is initiated by the passage of a heavy ion through the device structure. The passage of the heavy ion generates a current filament that locally turns on a parasitic n-p-n transistor inherent to the power MOSFET. Subsequent high currents and high voltage in the device induce second breakdown of the parasitic bipolar transistor and hence meltdown of the device. This paper presents a model that can be used for simulating the burnout mechanism in order to gain insight into the significant device parameters that most influence the single-event burnout susceptibility of n-channel power MOSFETs     

一维均匀掺杂突变PN结伽马剂量率辐射解析模型

研究硅基半导体集成电路最基本结构之一PN结的伽马剂量率辐射模型,阐明PN剂量率辐射模型的重要意义。根据半导体物理基本方程,推导计算出在剂量率辐射下一维均匀掺杂突变PN结光电流响应的解析解模型,根据解析解,在不同参数下用Mathematica作图观察,并与计算机辅助设计技术(TCAD)数值模拟仿真结果对比,验证解析解的正确性;最后基于解析解,通过分析剂量率、偏压、PN结几何尺寸、掺杂浓度、载流子扩散系数、少子寿命等参数对稳态光电流的影响,提出一个更方便工程计算的稳态光电流模型。     

An advanced physics-based sub-circuit model of a punch-trough insulated gate bipolar transistor

An advanced sub-circuit model of the punch-trough insulated gate bipolar transistor (PT IGBT) based on the physics of internal device operation has been described in this article. The one-dimensional physical model of low-gain wide-base BJT is employed based on the equivalent non-linear lossy transmission line, whereas a SPICE Level 3 model is used for the diffused MOST part. The influence of voltage dependent drain-to-gate overlapping capacitance and the conductivity modulated base (drain) ohmic resistance are modelled separately. The main advantages of novel PT IGBT model are a small set of model parameters, an easy implementation in SPICE simulator and the high accuracy confirmed by comparing the simulation results with the electrical measurements of test power circuit.     

Modeling and analysis of single-event transient sensitivity of a 65 nm clock tree

The soft error rate (SER) due to heavy-ion irradiation of a clock tree is investigated in this paper. A method for clock tree SER prediction is developed, which employs a dedicated soft error analysis tool to characterize the single-event transient (SET) sensitivities of clock inverters and other commercial tools to calculate the SER through fault-injection simulations. A test circuit including a flip-flop chain and clock tree in a 65 nm CMOS technology is developed through the automatic ASIC design flow. This circuit is analyzed with the developed method to calculate its clock tree SER. In addition, this circuit is implemented in a 65 nm test chip and irradiated by heavy ions to measure its SER resulting from the SETs in the clock tree. The experimental and calculation results of this case study present good correlation, which verifies the effectiveness of the developed method.     

器件与电路参数对SET波形影响仿真研究

利用Sentaurus TCAD仿真软件,建立并校准了MOSFET仿真模型。分析了NMOS器件在重离子轰击下产生的SET波形。结果表明,轰击位置在漏极且入射角呈120°时,器件具有最大的峰值电流。通过建立MIX、TCAD、SPICE三种反相器模型并施加重离子轰击,研究了不同模拟方式下电路响应对SET波形的影响,指出了采用双指数电流源在SPICE电路中模拟的不准确性。采用MIX模型探究了器件结构及电路环境对SET波形的影响。结果表明,LET能量、栅极长度、轨电压和负载电容都会对SET波形脉宽及平台电流大小产生显著影响,说明了建立SET模拟波形时须综合考虑这些因素。     

14 nm FinFET栅围寄生电容的建模与拟合

提出了一种基于保角映射方法的14 nm鳍式场效应晶体管(FinFET)器件栅围寄生电容建模的方法。对FinFET器件按三维几何结构划分寄生电容的种类,再借助坐标变换推导出等效电容计算模型,准确表征了不同鳍宽、鳍高、栅高和层间介质材料等因素对寄生电容的依赖关系。为了验证该寄生电容模型的准确性,对不同结构参数的寄生电容进行三维TCAD仿真。结果表明,模型计算结果与仿真结果的拟合度好,准确地反映了器件结构与寄生电容之间的依赖关系。     

Experimental research of heavy ion and proton induced single event effects for a Bi-CMOS technology DC/DC converter

This paper tested and analyzed heavy ion and proton induced single event effects (SEE) of a commercial DC/DC converter based on a 600 nm Bi-CMOS technology. Heavy ion induced single event transients (SET) testing has been carried out by using the Beijing HI-13 tandem accelerator at China Institute of Atomic Energy. Proton test has been carried out by using the Canadian TRIUMF proton accelerator. Both SET cross section versus linear energy transfer (LET) and proton energy has been measured. The main study conclusions are: (1) the DC/DC is both sensitive to heavy ion and proton radiations although at a pretty large feature size (600 nm), and threshold LET is about 0.06 MeV·mg/cm²; (2) heavy ion SET saturation cross section is about 5 magnitudes order larger than proton SET saturation cross section, which is consistent with the theory calculation result deduced by the RPP model and the proton nuclear reaction model; (3) on-orbit soft error rate (SER) prediction showed, on GEO orbit, proton induced SERs calculated by the heavy ion derived model are 4-5 times larger than those calculated by proton test data.     

130 nm NMOS器件的单粒子辐射电荷共享效应

研究了同一p阱内两个130nm NMOS器件在受到重离子辐射后产生的电荷共享效应。使用TCAD仿真构造并校准了130nm NMOS管。研究了在有无p+保护环结构及不同器件间距下,处于截止态的NMOS晶体管之间的电荷共享,给出了电荷共享效应与SET脉冲电流产生的机理。同时分析了NMOS晶体管中的寄生双极管效应对反偏漏体结电荷收集的加剧作用。仿真结果表明,p+保护环可以有效地减小NMOS器件间的电荷共享,加速SET脉冲电流的泄放,证实了p+保护环对器件抗单粒子辐射的有效性,从而给出了该方法在抗单粒子辐射器件版图设计中的可行性。     

基于25 nm FinFET结构的SRAM单粒子效应研究

对基于25 nm FinFET结构的SRAM单粒子效应进行研究。使用Synopsys Sentaurus TCAD仿真软件进行器件工艺校准,并对独立3D FinFET器件以及包含FinFET器件和HSpice模型的混合电路(如6管SRAM单元)进行单粒子瞬态仿真。通过改变重粒子入射条件,分析影响瞬态电流峰值、脉宽、漏极翻转阈值等参数的因素。研究发现,混合模型中,FinFET结构器件的漏极翻转阈值为0.023 MeV·cm²/mg,对未来基于FinFET结构的器件及电路结构的加固提出了更高的要求。     

The Effect of Temperature-Induced Quiescent Operating Point Shift on Single-Event Transient Sensitivity in Analog/Mixed-Signal Circuits

This paper discusses the different sensitivities of laser-induced single-event transients (SET) with changed temperature (from 300 to 348 K) for an analog/mixed-signal DC/DC PWM controller IC. Basic analog circuits, such as the amplifier, the comparator, and the current mirror, are selected to perform the experiment. The SET energies for some devices decrease while those for others remain constant. The spice simulation implies that the temperature-induced quiescent operating point shift can dramatically affect the SET sensitivity, especially in a complex analog/mixed-signal system. This effect also gives insights on radiation hardened design and testing in analog/mixed-signal circuits.