共查询到20条相似文献,搜索用时 140 毫秒
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介绍了在纳米晶浮栅存储器数据保持特性方面的研究工作,重点介绍了纳米晶材料的选择与制备和遂穿介质层工程。研究证明,金属纳米晶浮栅存储器比半导体纳米晶浮栅存储器具有更好的电荷保持特性。并且金属纳米晶制备方法简单,通过电子束蒸发热退火的方法就能够得到质量较好的金属纳米晶,密度约4×1011cm-2,纳米晶尺寸约6~7nm。实验证明,高介电常数隧穿介质能够明显改善浮栅存储器的电荷保持特性,所以在引入金属纳米晶和高介电常数遂穿介质之后,纳米晶浮栅存储器可能成为下一代非挥发性存储器的候选者。 相似文献
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硅纳米晶非挥发存储器由于其卓越的性能以及与传统工艺的高度兼容性,近来引起高度关注。采用两步低压化学气相淀积(LPCVD)生长方式制备硅纳米晶(Si-NC),该方法所制备的硅纳米晶具有密度高、可控性好的特点,且完全兼容于传统CMOS工艺。在此基础上制作四端硅纳米晶非挥发存储器,该器件展示出良好的存储特性,包括10 V操作电压下快速地擦写,数据保持特性的显著提高,以及在105次擦写周期以后阈值电压(Vt)飘移低于10%的良好耐受性。该器件在未来高性能非挥发存储器应用上极具潜质。 相似文献
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Krishnamohan T. Krivokapic Z. Uchida K. Nishi Y. Saraswat K.C. 《Electron Devices, IEEE Transactions on》2006,53(5):990-999
For the first time, the tradeoffs between higher mobility (smaller bandgap) channel and lower band-to-band tunneling (BTBT) leakage have been investigated. In particular, through detailed experiments and simulations, the transport and leakage in ultrathin (UT) strained germanium (Ge) MOSFETs on bulk and silicon-on-insulator (SOI) have been examined. In the case of strained Ge MOSFETs on bulk Si, the resulting optimal structure obtained was a UT low-defect 2-nm fully strained Ge epi channel on relaxed Si, with a 4-nm Si cap layer. The fabricated device shows very high mobility enhancements >3.5/spl times/ over bulk Si devices, 2/spl times/ mobility enhancement and >10/spl times/ BTBT reduction over 4-nm strained Ge, and surface channel 50% strained SiGe devices. Strained SiGe MOSFETs having UT (T/sub Ge/<3 nm) very high Ge fraction (/spl sim/ 80%) channel and Si cap (T/sub Si cap/<3 nm) have also been successfully fabricated on thin relaxed SOI substrates (T/sub SOI/=9 nm). The tradeoffs in obtaining a high-mobility (smaller bandgap) channel with low tunneling leakage on UT-SOI have been investigated in detail. The fabricated device shows very high mobility enhancements of >4/spl times/ over bulk Si devices, >2.5/spl times/ over strained silicon directly on insulator (SSDOI; strained to 20% relaxed SiGe) devices, and >1.5/spl times/ over 60% strained SiGe (on relaxed bulk Si) devices. 相似文献
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Sushkov A. A. Pavlov D. A. Andrianov A. I. Shengurov V. G. Denisov S. A. Chalkov V. Yu. Kriukov R. N. Baidus N. V. Yurasov D. V. Rykov A. V. 《Semiconductors》2022,56(2):122-133
Semiconductors - III–V/Ge/Si(001), III–V/Ge/SOI(001), and III–V/GaAs(001) heterostructures are fabricated and investigated. The Ge buffer layer for the III–V/Ge/Si structure... 相似文献
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《Electron Device Letters, IEEE》1981,2(7):169-171
Solar cells with conversion efficiencies of 12% (AM1) have been fabricated from single-crystal GaAs epilayers grown by CVD on Ge-coated Si substrates. The cells utilize an n+/p/p+shallow-homo junction GaAs structure on a thin (<0.2 µm) epitaxial Ge layer. These solar cells are the first reported GaAs devices fabricated on Si substrates. 相似文献
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Shang H. Okorn-Schimdt H. Ott J. Kozlowski P. Steen S. Jones E.C. Wong H.-S.P. Hanesch W. 《Electron Device Letters, IEEE》2003,24(4):242-244
In this letter, we report germanium (Ge) p-channel MOSFETs with a thin gate stack of Ge oxynitride and low-temperature oxide (LTO) on bulk Ge substrate without a silicon (Si) cap layer. The fabricated devices show 2 /spl times/ higher transconductance and /spl sim/ 40% hole mobility enhancement over the Si control with a thermal SiO/sub 2/ gate dielectric, as well as the excellent subthreshold characteristics. For the first time, we demonstrate Ge MOSFETs with less than 100-mV/dec subthreshold slope. 相似文献
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Si基Ge波导光电探测器的制备和特性研究 总被引:2,自引:2,他引:0
以外延Ge薄膜为吸收区,在Si基上制备了Ge波导光电探测器。利用超高真空化学汽相淀积(UHV/CVD)设备,采取低温高温两步法,在Si(100)衬底上外延出厚度约为500nm的高质量纯Ge层。探测器采用脊型波导结构,Al电极分别制作在波导的台面上下形成背对背肖特基结。I-V特性测试表明,在-1V偏压下,暗电流密度为0.2mA/cm2。由于Si与Ge热失配引起外延的Ge薄膜受到0.2%张应变,减小了Ge带隙,光响应波长范围扩展到1.60μm以上。在70mW、1.55μm入射光照射下,测得光电流比暗电流高出近1个数量级。 相似文献
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Zhi-Yuan Cheng Currie M.T. Leitz C.W. Taraschi G. Fitzgerald E.A. Hoyt J.L. Antoniadas D.A. 《Electron Device Letters, IEEE》2001,22(7):321-323
We demonstrate electron mobility enhancement in strained-Si n-MOSFETs fabricated on relaxed Si1-xGex-on-insulator (SGOI) substrates with a high Ge content of 25%. The substrates were fabricated by wafer bonding and etch-back utilizing a 20% Ge layer as an etch stop. Epitaxial regrowth was used to produce the upper portion of the Si0.75Ge0.26 and the surface strained Si layer. Large-area strained-Si n-MOSFETs were fabricated on this SGOI substrate. The measured electron mobility shows significant enhancement over both the universal mobility and that of co-processed bulk-Si MOSFETs. This SGOI process has a low thermal budget and thus is compatible with a wide range of Ge contents in Si1-xGex layer 相似文献
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Lombardo S. Pinto A. Raineri V. Ward P. La Rosa G. Privitera G. Campisano S.U. 《Electron Device Letters, IEEE》1996,17(10):485-487
We have fabricated n-p-n, Si/Ge2Si1-x heterojunction bipolar transistors (HBTs) with the GexSi1-x base formed by high-dose Ge implantation followed by solid phase epitaxy. The fabrication technology is a standard self-aligned, double polysilicon process scheme for Si with the addition of the high-dose Ge implantation. The transistors are characterized by a 60 mn-wide neutral base with a Ge concentration peak of ≈8 at.% at the base-collector junction. The HBTs show good electrical characteristics and compared to Si homojunction transistors show lower base resistance, larger values of current gain, and a lower emitter-to-collector transit time 相似文献
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Ranade P. Takeuchi H. Wen-Chin Lee Subramanian V. Tsu-Jae King 《Electron Devices, IEEE Transactions on》2002,49(8):1436-1443
This work summarizes the results of several experiments to investigate the potential applications of Silicon-Germanium alloy in the fabrication of shallow source/drain (S/D) extension Junctions for deep submicron PMOS transistors. Two approaches were used for the fabrication of p/sup +/-Si/sub 1-x/Ge/sub x//n-Si heterojunctions. In the first approach, high dose Ge ion implantation followed by boron implantation into Si was used to form very shallow p/sup +/-Si/sub 1-x/Ge/sub x//n-Si junctions (x/spl les/0.2). In the second approach, thin Ge films were deposited onto Si substrates by conventional low pressure chemical vapor deposition. This was followed by boron implantation into the Ge and thermal annealing to co-diffuse Ge and B atoms into Si and form p/sup +//n heterojunctions. The electrical characteristics of the heterojunction diodes were comparable to those of conventional Si (homo) junctions. Secondary ion mass spectrometry (SIMS) concentration-depth profiles indicate that dopant segregation in the Si/sub 1-x/Ge/sub x/ regions resulted in the formation of ultra-shallow and abrupt junctions that could be used as S/D extensions for sub-100 nm CMOS generations. PMOS transistors fabricated using these techniques exhibit superior short-channel performance compared to control devices, for physical gate lengths down to 60 nm. 相似文献
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Modulation-doped FET (MODFET) structures with hole channels consisting of pure Ge were grown by molecular beam epitaxy (MBE) on Si substrates. To overcome the relatively large lattice mismatch, between Si and Ge, a relaxed Si1-xGex buffer layer with linearly graded Ge concentration and a final x value of around 70% was grown first. Hall mobilities of up to 1300 cm2/V-s at room temperature and 14000 cm2/V-s at 77 K were measured. Devices with and without gate recess were fabricated, which result in enhancement- and depletion-type FETs. Maximum extrinsic transconductances of 125 and 290 mS/mm at room temperature and 77 K, respectively, were found for gate lengths L G around 1.2 μm 相似文献
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Lombardo S.A. Privitera V. Pinto A. Ward P. La Rosa G. Campisano S.U. 《Electron Devices, IEEE Transactions on》1998,45(7):1531-1537
Si/GexSi1-x heterojunction n-p-n bipolar transistors (HBT's) with a double-polysilicon self-aligned structure were fabricated by using high dose Ge implantation for the formation of the Si/GexSi1-x heterostructure and As and BF2 implantation for emitter and base doping. DC and high frequency electrical characteristics are investigated for Ge concentrations up to 7 at.% and for base widths down to 35 nm. Improvements in electrical characteristics compared to reference Si transistors are demonstrated. Experimental data indicating that these improvements are related to an effective band gap engineering are shown and discussed 相似文献