IC/microfluidic hybrid system for magnetic manipulation of biological cells

This paper introduces an integrated circuit (IC)/microfluidic hybrid system for magnetic manipulation of biological cells. The hybrid system consists of an IC and a microfluidic system fabricated on top. Biological cells attached to magnetic beads are suspended inside the microfluidic system that maintains biocompatibility. The IC contains a microcoil array circuit that produces spatially-patterned microscopic magnetic fields. Programmable, rapid reconfiguration of the field pattern made possible by the IC allows an efficient simultaneous manipulation of multiple individual bead-bound cells with precise position control. Two prototypes, SiGe/microfluidic and CMOS/microfluidic hybrid systems, validate the proposed approach.     

Two-dimensional computer simulation models for MOSLSI fabrication processes

A two-dimensional process simulation program has been developed. The process models used for this program are oxidation, diffusion, ion implantation, and deposition/etching of CVD films. The numerical models are based on a finite-difference approximation to diffusion equation. A large number of equations derived from the diffusion equation are solved by Stone's method because of its excellent rate of convergence. Attention is paid primarily to lateral impurity diffusion and lateral oxidation near the edge of the oxidation mask. Oxidation enhanced diffusion of boron is also included. We have obtained good quantitative agreement between calculated and experimentally observed diffused line capacitance variation with reverse bias voltage which is strongly affected by the lateral channel stop diffusion in a locally oxidized process.     

Process control system for VLSI fabrication

A modular framework for the implementation of process control in VLSI fabrication is described. The system integrates existing approaches to process control with new methodologies in order to achieve online optimization and control of unit processes with consideration of preceding and following process steps. The process control system is based on three core modules. The flexible recipe generator determines an initial operating point in response to a new product design. The run-by-run controller tunes the recipe between runs based on feedback from postprocess and in situ measurements. The real-time controller further modifies the equipment settings during a process step based on in situ measurements. The algorithmic bases of these modules are described. The flexible recipe generator was used to optimize the LPCVD (low-pressure chemical vapor deposition) of polysilicon. The run-by-run controller was used to locally optimize and control a simulation of the LPCVD of polysilicon     

Design and fabrication of thin film resistive heaters for hybrid optoelectronic packaging

This paper presents the technology for the design and fabrication of planar resistive heaters made from vacuum deposited nichrome thin films on a quartz substrate. These heaters are suitable as isolated local heat sources for melting solder to attach discrete components on a hybrid optoelectronic integration platform. Numerical simulations are performed using the Finite Element Method (FEM) to determine the geometry of the heaters in order to deliver adequate thermal performance. Multiple heater elements are batch processed on a 3.0 in polished fused quartz wafer using standard photolithographic techniques. Use of polyimide as a reliable insulation layer between the nichrome thin film and the solder has improved the thermal uniformity over the heater surface. Individual heaters can reach temperatures close to 300/spl deg/C drawing 7.1 W of power on an uncooled alumina platform and 12.0 W on an uncooled copper platform. This temperature is high enough to melt gold-tin (AuSn) solder (with eutectic melting point of 280/spl deg/C), typically used for attaching different optoelectronic components on a substrate.     

Controllable fabrication of carbon nanotube-polymer hybrid thin film for strain sensing

A strain sensing material based on carbon nanotubes-polymer hybrid film has been fabricated by the vacuum filtration and poly(dimethylsiloxane) (PDMS) molding transfer methods. The density and thickness of the film is tuned by simply controlling the volume of dilute suspension filtered through the membrane. These composites are resilient under large strain and there is a wide linear range of resistance-strain dependence. We demonstrate that the thin films with thicker CNTs networks exhibit more significant resistance-strain sensitivity under the same stain and the strain sensing material shows reproducible resistance-strain sensitivity depending only on the initial CNTs suspension volume. It may be possible to fabricate strain sensing material in large volume for future smart device applications.     

Technical and economic aspects of the different fibre fabrication processes

The processes for making preforms for hard glass fibres are the Vad process, the Ovd process, the Mcvd (Pmcvd) process and the Pcvd process. This paper discusses the processes themselves, the optical properties of multimode, single-mode and high Na fibres made with these processes and the potentials of the different processes. For really large scale applications it will be necessary to reduce the costs of manufacturing these fibres. The factors that determine these costs are discussed and ways in which they can be reduced are indicated.     

Application of two-dimensional process/device simulation for evaluating MOSFET fabrication processes

Applications of a two-dimensional process/device simulator are presented for evaluating the fabrication conditions of MOSFETs. By comparing the simulated results with the measured values, variations in the fabrication sequence have been found. In the analytical mode, a checkup flow is proposed for determining anomalous device structure parameters, such as channel length and gate-oxide thickness. For optimization, the main cause of fluctuating device performance is found automatically. The simulation results confirm that both analysis and optimization modes are effective for identifying variations in the fabrication conditions.     

光电混合综合判别相关器自动跟踪系统

在本文中，作者回顾了综合判别函数基本理论，简要地介绍了用ＳＤＦ实现畸变不变相关的的技术途径。在此基础上，成功地将ＳＤＦ相关器应用于目标跟踪，并利用ＳＤＦ相关器构成了一个自动跟踪实验系统。实验结果证明：该系统具有比较好的收敛性和跟踪性能。     

Fiber-coupler fabrication with automatic fusion-elongation processes for low excess loss and high coupling-ratio accuracy

A novel fiber-coupler fabrication system which automatically processes fusion and elongation is presented. Not only conventional single-mode fiber couplers but also polarization-maintaining fiber couplers with excellent characteristics such as excess losses less than 0.11 dB and coupling-ratio accuracy better than 1.3 percent were obtained. In addition, it was confirmed that polarization crosstalk for polarization-maintaining fiber couplers in the present system was lower than that for the conventional manual method. The fabrication yield and reliability of the present system have been much higher than those of the conventional method and the processing time for fabrication could also be reduced.     

An inorganic resist technology and its applications to LSI fabrication processes

An Ag/Se-Ge inorganic resist technology is applied to photolithographic processes in LSI fabrication. This paper describes exposure latitude, RIE characteristics, resist fabrication and exposure throughputs, pattern alignment, defocus tolerances and fabrication yields of Al interconnection.Lateral Ag diffusion does not effectively improve the exposure tolerance. The technology exhibits good compatibility with other equipment and technologies, offering satisfactory throughput. Excellent accuracy in pattern alignment is obtained owing to dry-deposition fabrication and the suitable optical properties of the Se-Ge inorganic film, which result in regulated and distinct alignment signals. Defocus tolerance in the resist is larger than that of polymer resist by 2 ∽ 3 μm in the submicron pattern. Al interconnections using this resist demonstrate a short-circuit failure rate of less than 1% and small variation in linewidth having a standard deviation of σ_w = 0.08 μm.In practical processes, the significant advantages of this resist are its bilayer resist structure (doped Ag-Se-Ge and underlying Se-Ge) and its dry deposition, very thin, favorable optical characteristics.     

IC工艺用超纯水系统的TOC实验研究

从运行管理角度,以实验方法考察了IC工艺用超纯水制造过程中TOC(总有机碳)的若干问题。通过在线测量一次纯水、二次纯水的TOC含量和相应的数据统计,评估了水平各异的两套超纯水制造系统中各主要装置对TOC的除去效率及其对TOC的影响。     

综合型情报侦察系统的效能评估体系

综合型情报侦察系统结构复杂,多层次、立体化,具有广阔的应用前景,但目前缺少一 个比较完善可信的针对综合型情报侦察系统的效能评估体系。而传统的效能评估方法涉及面 窄,结构单一,不能用于评估复杂的综合型情报侦察系统。为了解决以上问题,在分析已有 效能评估体系的基础上,结合综合型情报侦察系统的特点,建立了一个高效全面的评估体系 ,用于指导和规范综合型情报侦察系统的效能评估工作,有效地提高了系统的综合作战能力 。     

Simulation of critical IC fabrication processes using advanced physical and numerical methods

Critical steps of IC fabrication are simulated by one- and two-dimensional computer programs using advanced physical models. Our codes deal with an arbitrary number of physical quantities such as concentrations of dopants, vacancies, interstitials and clusters, the electrostatic potential, and so on. Furthermore, they easily permit the exchange or variation of the physical models under consideration. As typical applications phenomena of coupled diffusion in one and two dimensions and dynamic arsenic clustering are investigated. The differences caused by the models of the zero space-charge approximation and the solution of the exact Poisson equation are studied by examples of As-B diffusion with various doping concentrations at different temperatures. A dynamic cluster model developed for the simulation of thermally annealed As implantations is compared to measured data of laser annealing experiments. A short outline of the mathematical and the numerical problems is given to show the amount of sophistication necessary for up-to-date process simulation.     

Feasible approach for processes integration of CMOS transistor gate/side-wall spacer patterning fabrication

As the gate length is scaling down, the spacer design for CMOS transistor becomes increasingly critical manufacturing process. In recent CMOS technologies, side-wall spacers play an important role in the control of short channel effects by offsetting ion implantation profiles from the edge of the gate. The present approach to overcome these fabrication limitations. The spacer patterning technology yields critical dimension variations of minimum-sized features which are much smaller than achieved by optical integrated lithography and etching processes. Generally relates to semiconductor manufacturing, and more particularly to nanotechnology fabrication feasibility for CMOS wafer process on gate spacer technology manufacture feasibility. A modified side-wall spacer patterning method was implemented for using conventional lithography and etching processing technology. Based on the systematical investigation of the effects of the various etch conditions on etching profile and their impacts on the sidewall transistor gate structure, a novel integrated process for well controlled side-wall spacer formation was developed for fabrication.     

Modeling microwave and hybrid heating processes including heatradiation effects

This paper presents an efficient simulation tool for conventional, microwave, and combined heating. Two heat-transfer mechanisms are included: conductive and radiant heat transfer. The conductive heat transfer is modeled by a finite-difference algorithm. A modeling technique for radiant heat transfer in nonuniform grids has been developed and is here presented for the first time. For the radiant heat transfer a finite-difference scheme is not applicable, as radiation from a material surface; is not bounded to the immediate vicinity, as is conductive heat transfer. Therefore, ray optical methods are used. Rays connecting mutually visible surfaces are obtained by a new fast method. Necessary, but acceptable simplifications allow fast computations. The algorithms are integrated conveniently together with an electromagnetic finite-difference time-domain program to one simulation tool. Representative simulations are presented for an oven heated conventionally, by microwaves, and by a combination of both     

Computer-controlled scanning electron microscope system for high-resolution microelectronic pattern fabrication

A small, dedicated computer has been interfaced to a scanning electron microscope (SEM) for the purpose of generating, registering, and fabricating microelectronic device and circuit patterns with submicron dimensions. A preliminary registration accuracy of ±0.1 µm over a (950-µm)²pattern field has been demonstrated.     

Design and fabrication of a novel quick-change system

In robotics, the quick-change system is a device that when attached to the wrist of a robot, increases its ability to automatically change the grippers/end-effectors when necessary. As a result, this will increase the robot's flexibility in handling various shaped objects and tools.This paper presents an overview of the design features and the fabrication results of a novel quick-change system for robotics applications. Upon fabrication, the AMRC quick-change system was tested satisfactorily with a series of different robotic grippers; namely the magnetic, vacuum, inflatable and finger-like grippers.     

A hybrid system for two-dimensional image recognition

In this paper, after briefly considering the reasons that prevented the development of hybrid systems for signal processing (SP), we point out the requirements for their future exploitation. The need for a better knowledge of different approaches in the scientific community and the definition of methodologies for designing hybrid systems are highlighted as two key points. Then we suggest that the well-known “task-structure analysis” design technique should be modified to make it suitable for hybrid systems. The proposed modification is based on the main need to choose the roles of different approaches and the mechanisms to integrate them. As an example we describe the design of a hybrid system for two-dimensional (2-D) image recognition; the system is based on the integration of a numerical, a symbolic, and a connectionist approach. We detail the integration of the symbolic and connectionist approaches to the generation of the models of the objects to be recognized. We describe the main problems involved and the solutions adopted. In particularly, we exploit the synergistic aspects of the two approaches in order to overcome the bottleneck of knowledge acquisition. Finally, we report experimental results on two applications to show some advantages of the proposed hybrid system     

Strong fiber Bragg grating fabrication by hybrid 157- and 248-nmlaser exposure

A permanent 248-nm photosensitivity response was locked into hydrogen-loaded standard telecommunication fiber by uniform 157-nm F₂-laser pre-exposure. Strong (>30 dB) fiber Bragg gratings were efficiently generated after hydrogen out-diffusion, improving the thermal stability. The 157-mn radiation produced weakly absorbing Si-OH and Ge-OH absorption bands at 1.39-μm     

A system model and inversion for synthetic aperture radar imaging

A system model and its corresponding inversion for synthetic aperture radar (SAR) imaging are presented. The system model incorporates the spherical nature of a radar's radiation pattern at far field. The inverse method based on this model performs a spatial Fourier transform (Doppler processing) on the recorded signals with respect to the available coordinates of a translational radar (SAR) or target (inverse SAR). It is shown that the transformed data provide samples of the spatial Fourier transform of the target's reflectivity function. The inverse method can be modified to incorporate deviations of the radar's motion from its prescribed straight line path. The effects of finite aperture on resolution, reconstruction, and sampling constraints for the imaging problem are discussed.