Preparation,characterization, electrical and antibacterial properties of sericin/poly(vinyl alcohol)/poly(vinyl pyrrolidone) composites

In this study, we focused on the fabrication of poly(vinyl alcohol) (PVA)/poly(vinyl pyrrolidone) (PVP)/sericin composites via a simple solution‐blending method. The composites were characterized by Fourier transform infrared (FTIR) spectroscopy, UV spectroscopy, X‐ray diffraction (XRD), scanning electron microscopy (SEM), differential scanning calorimetry, thermogravimetric analysis (TGA), and measurements of the conductivity, tensile strength, and antibacterial activity against Staphylococcus aureus. The results of FTIR and UV spectroscopy implied the occurrence of hydrogen bonding between sericin and the PVA/PVP blend. The structure and morphology, studied by XRD and SEM, revealed that the sericin particles were well dispersed and arranged in an orderly fashion in the blend. The glass‐transition temperature (T_g) of the composite was higher than that of the pure blend, and the T_g value shifted toward higher temperatures when the volume fraction of sericin increased. TGA indicated that sericin retarded the thermal degradation; this depended on the filler concentration. The mechanical and electrical properties, such as the tensile strength, alternating‐current electrical conductivity, dielectric constant, and dielectric loss of the composites, were higher than those of the pure blend, and these properties were enhanced when the concentration of sericin was increased up to 10 wt % filler content, whereas the elongation at break of the composite decreased with the addition of sericin particles. The antibacterial properties of the composite showed that sericin had a significant inhibitory effect against S. aureus. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133, 43535.     

Preparation and characterization of poly(vinyl alcohol) and gelatin blend films

Poly(vinyl alcohol) (PVA) is a water-soluble polymer that has been studied intensively because of several interesting physical properties that are useful in technical applications, including biochemical and medical applications. In this article, we report the effects of the addition of gelatin on the optical, microstructural, thermal, and electrical properties of PVA. Pure and PVA/gelatin blend films were prepared with the solution-casting method. These films were further investigated with Fourier transform infrared (FTIR), differential scanning calorimetry (DSC), X-ray diffraction (XRD), ultraviolet–visible (UV–vis) spectroscopy, and dielectric measurements. The FTIR spectrum shows a strong chemical interaction between PVA and gelatin molecules with the formation of new peaks. These peaks are due to the presence of gelatin in the blend films. The DSC results indicate that the addition of gelatin to PVA changes the thermal behavior, such as the melting temperature of PVA, and this shows that the blends are compatible with each other. This also shows that the interaction of gelatin and PVA molecules changes the crystallite parameters and the degree of crystallinity, and this supports the XRD results. The UV–vis optical study also reflects the formation of the complex and its effect on the microstructure of the blend film. Moreover, the addition of gelatin also gives rise to changes in the electrical properties of PVA/gelatin blend films. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

CE／HBPSi／GO复合材料的制备与性能

采用硅烷偶联剂表面处理的氧化石墨烯(GO)与氰酸酯树脂(CE)／超支化聚硅氧烷(HBPSi)共混制备了CE／HBPSi／GO复合材料,研究了GO含量对复合材料力学性能、介电性能、热稳定性和吸水率的影响。结果表明,添加适量GO可以有效提高CE／HBPSi的韧性和强度,还可以改善其介电性能、热稳定性和耐湿性。当GO的质量分数为0.8%时,CE／HBPSi／GO复合材料的冲击强度和弯曲强度达到最大值,分别为15.1 kJ／m2和131.6 MPa,并且该体系的介电常数、介电损耗角正切和吸水率均低于CE／HBPSi体系,热稳定性优于CE／HBPSi体系。     

Graphene oxide reinforced polyvinyl alcohol/polyethylene glycol blend composites as high-performance dielectric material

Novel flexible dielectric composites composed of polyvinyl alcohol (PVA), polyethylene glycol (PEG), and graphene oxide (GO) with high dielectric constant and low dielectric loss have been developed using facile and eco-friendly colloidal processing technique. The structure and morphology of the PVA/PEG/GO composites were evaluated using Fourier transform infrared spectroscopy (FTIR), Raman spectroscopy, UV-vis spectroscopy (UV-vis), X-ray diffraction (XRD), scanning electron microscopy (SEM), and atomic force microscopy (AFM). The dielectric behavior of PVA/PEG/GO composites was investigated in the wide range of frequencies from 50 Hz to 20 MHz and temperature in the range 40 to 150 °C using impedance spectroscopy. The dielectric constant for PVA and PVA/PEG (50/50) blend film was found to be 10.71 (50 Hz, 150 °C) and 31.22 (50 Hz, 150 °C), respectively. The dielectric constant for PVA/PEG/GO composite with 3 wt% GO was found to be 644.39 (50 Hz, 150 °C) which is 60 times greater than the dielectric constant of PVA and 20 times greater than the dielectric constant of PVA/PEG (50/50) blend film. The PVA/PEG/GO composites not only show high dielectric constant but also show low dielectric loss which is highly attractive for practical applications. These findings underline the possibilities of using PVA/PEG/GO composites as a flexible dielectric material for high-performance energy storage applications such as embedded capacitors.     

交联壳聚糖/聚乙烯醇/蜗牛黏液复合膜的制备及性能研究

采用延流法制备了香兰素（V）交联的壳聚糖/聚乙烯醇/蜗牛黏液（CS/PVA/SM）复合膜,并通过热重分析仪（TG）、扫描电子显微镜（SEM）和万能材料试验机等研究了不同CS/SM配比对复合膜光学性能、水蒸气和氧气阻隔能力、力学性能、热力学性能及生物降解性能等的影响。结果表明,CS/PVA/SM复合膜为可降解的亲水性薄膜,当CS溶液/SM溶液体积比为5/3时,复合膜性能优良,其抗氧化活性为87.51 %,其水蒸气透过率比纯CS膜降低了75.16 %,不透明度降低了87.74 %,拉伸强度提高了16.04 %,断裂伸长率提高了28.26倍;随着SM含量的增加,复合膜的热稳定性有所降低;CS溶液/SM溶液体积比为5/1、5/2和5/3时,复合膜表现出良好的相容性;SM的添加使复合膜具有很好的延展性和柔韧性,V的添加提高了复合膜的拉伸强度和抗氧化能力;所制备的CS/PVA/SM复合膜在食品包装领域中有潜在的应用前景。     

Studies of chitosan. I. Preparation and characterization of chitosan/poly(vinyl alcohol) blend films

Various blending ratios of chitosan/poly (vinyl alcohol) (CS/PVA) blend films were prepared by solution blend method in this study. The thermal properties and chemical structure characterization of the CS/PVA blend films were examined by differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), dynamic mechanical analysis (DMA), and Fourier transform infrared (FTIR). Based upon the observation on the DSC thermal analysis, the melting point of PVA is decreased when the amount of CS in the blend film is increased. The FTIR absorption characteristic is changed when the amount of CS in the blend film is varied. Results of X‐ray diffraction (XRD) analysis indicate that the intensity of diffraction peak at 19° of PVA becomes lower and broader with increasing the amount of CS in the CS/PVA blend film. This trend illustrates that the existence of CS decreases the crystallinity of PVA. Although both PVA and CS are hydrophilic biodegradable polymers, the results of water contact angle measurement are still shown as high as 68° and 83° for PVA and for CS films, respectively. A minimum water contact angle (56°) was observed when the blend film contains 50 wt % CS. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

聚碳酸酯对环氧树脂/炭黑复合材料结构与导电性能的影响

利用溶液共混法制备了环氧树脂(EP)/聚碳酸酯(PC)/炭黑(CB)三元及EP/CB二元两种复合材料.采用扫描电子显微镜、光学显微镜、精密阻抗分析仪、高阻计研究了它们的微观形貌及电性能.结果表明,从热力学角度,PC比EP更容易和CB相容,在EP/PC/CB复合材料中,PC可以起到类似表面活性剂的作用;加入PC可以显著提...     

氰酸酯/聚苯醚/超支化聚硅氧烷接枝纳米SiO2复合材料的性能

以介电性能优异的聚苯醚(PPO)改性的双酚A型氰酸酯树脂（CE）为基体,分别以超支化聚硅氧烷接枝的纳米二氧化硅（HBP SiO2）和未处理的纳米二氧化硅（nano SiO2）为改性剂,制备了CE/PPO/HBP SiO2和CE/PPO/nano SiO2两种三元体系复合材料,并利用傅里叶变换红外光谱仪、差示扫描量热仪等分析手段对HBP SiO2及复合材料的结构与性能进行了研究,结果表明,nano SiO2的加入有助于提高改性体系的力学性能,且HBP SiO2比nano SiO2显示出更好的改性效果;CE/PPO/HBP SiO2体系的介电常数均低于CE/PPO/nano SiO2、CE/PPO、CE体系,而介电损耗因子比CE、CE/PPO体系的小,比CE/PPO/nano SiO2体系的大。     

Development and compatibility assessment of new composite film based on sugar beet pulp and polyvinyl alcohol intended for packaging applications

In this study, interaction and compatibility between sugar‐beet pulp (SBP) and polyvinyl alcohol (PVA) in blend films was assessed. Film‐forming dispersions of different ratios of SBP to PVA (100/0, 75/25, 50/50, and 25/75) were cast at room temperature. The effects of adding PVA to SBP on the resulting film's physical, mechanical and barrier properties and thermal stability were investigated. X‐ray diffraction and environmental scanning electron microscopy (ESEM) were used to characterize the structure and morphology of the composites. When PVA was also added to the composite films, the films became softer, less rigid and more stretchable than pure SBP films. The addition of PVA gave significantly greater elongation at break (12.45%) and lower water vapor permeability (1.55 × 10^?10 g s^?1 m^?1 Pa^?1), but tensile strength did not markedly change, remaining around 59.68 MPa. Thermogravimetric analysis also showed that SBP/PVA film had better thermal stability than SBP film. The ESEM results showed that the compatibility of SBP50/PVA50 was better than those of other composite films. These results suggest that when taking all the studied variables into account, composite films formulated with 50% PVA are most suitable for various packaging applications. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 41354.     

壳聚糖/聚乙烯醇共混膜的氢键和相容性

采用溶液共混法制备了不同配比的壳聚糖/聚乙烯醇共混膜,通过变温FTIR、TG、DTA、DSC及XRD等对共混膜的结构、氢键相互作用、热行为和结晶性等进行研究。实验结果表明,共混膜中壳聚糖与聚乙烯醇间存在强烈的氢键相互作用。氢键的存在使壳聚糖的热稳定性提高,聚乙烯醇结晶性下降,促进壳聚糖与聚乙烯醇相容。当壳聚糖/聚乙烯醇共混膜的质量比分别为10/0、7/3、5/5、3/7和0/10时,共混膜的初始分解温度分别为244 ℃、257 ℃、260 ℃、262 ℃和285 ℃。聚乙烯醇熔融温度从193 ℃下降到173 ℃,玻璃化转变温度从74.2 ℃上升至80 ℃,结晶度Xc从3.57%下降到1.97%。     

氰酸酯树脂/八(γ-氯丙基)多面体低聚倍半硅氧烷复合材料

采用八(γ-氯丙基)多面体低聚倍半硅氧烷(T8)改性氰酸酯树脂(CE)制备了系列CE/T8复合材料。研究了复合材料的冲击性能、动态热力学性能、热稳定性能以及断面形貌。结果表明:T8的加入能明显提高复合材料的冲击性能,当加入10%的T8时,复合材料的冲击强度较纯CE提高了12.29 kJ/m2;复合材料在高温阶段(大于500℃)的热稳定性与纯CE相比有一定提高,有助于改善CE的阻燃性能;T8的加入使复合材料的玻璃化转变温度和储能模量均有所降低。     

凹凸棒土杂化粒子改性聚乙烯醇/壳聚糖复合膜的结构与性能研究

采用表面引发接枝聚合法制备凹凸棒土接枝聚丙烯酰胺杂化粒子(ATP-g-PAAm),以此改性聚乙烯醇/壳聚糖复合膜(PVA/CS)。采用傅里叶红外光谱(FTIR)、差示扫描量热(DSC)、热失重分析(TG)等对三元复合膜(PVA/CS/ATP-g-PAAm)进行了表征,考察了杂化粒子含量对复合膜力学性能、热性能、吸湿率和吸附性能的影响。结果表明,ATP-g-PAAm的加入提高了复合膜的力学性能、结晶度和热稳定性,且能显著提升复合膜对Cu~(2+)的吸附能力。当杂化粒子质量分数为4%时,复合膜的拉伸强度、弹性模量和断裂伸长率分别为62.4 MPa、184.5 MPa和141.3%,对Cu~(2+)的吸附量高达156.5 mg/g。     

Preparation of boz/glass fibers/cyanate ester resins laminated composites

A novel kind of high performance laminated composites of Bis allyl benzoxazine/Quartz fibers/Cyanate ester (Bz‐ally/QFs/CE) have been developed. The effects of Bz‐ally on the moisture resistance, mechanical, dielectric, and thermal properties of Bz‐ally/QFs/CE laminated composites were investigated systematically. Compared with QFs/CE laminated composites, the flexural strength and the interlaminar shear strength value of the Bz‐ally/QFs/CE laminated composites were improved markedly with up to 25.2% and 22.3% increasing magnitude, respectively. Meanwhile, the Bz‐ally/QFs/CE laminated composites exhibit lower dielectric constant and loss than QFs/CE laminated composites over the testing frequency from 10 to 60 MHz. In addition, the thermal stability and moisture resistance of Bz‐ally/QFs/CE laminated composites were also superior to that of Boz/QFs/CE laminated composites. POLYM. COMPOS., 38:523–527, 2017. © 2015 Society of Plastics Engineers     

氰酸酯树脂/纳米氧化铜复合材料制备及性能

将无机纳米氧化铜(CuO)粒子加入氰酸酯树脂(CE),以有机锡(DBTDL)实现自由基引发,定量加入环氧树脂(E–54)制得CE/CuO系列复合材料。测试了复合材料的力学性能、导热性能和耐酸碱腐蚀性能,讨论了复合材料性能得以改变的原因。结果表明,无机纳米CuO粒子的引入,有利于CE基体树脂的聚合,无机纳米CuO粒子含量为10.0%时,复合材料差示扫描量热峰顶温度由286.3℃降至223.6℃,下降21.9%;无机纳米CuO粒子质量分数为6.0%时,复合材料弯曲强度达到165.36 MPa,较纯CE基体树脂提高了95.34%,复合材料冲击强度达14.18 kJ/m²,较纯CE基体树脂提高了62.24%;随无机纳米CuO粒子含量的增加,复合材料导热性能得以改善,当无机纳米CuO粒子含量为10.0%时,复合材料热导率增大10.24倍;无机纳米CuO粒子引入量为7.0%时,复合材料强碱腐蚀率为0.155%,比纯CE基体树脂下降38.0%;复合材料强酸腐蚀率为0.072%,比纯CE基体树脂下降60.4%。     

淀粉/聚乙烯醇/蒙脱土复合材料的制备及性能研究

采用熔融挤出法制备了淀粉/聚乙烯醇/蒙脱土三元复合材料。通过对力学测试、DSC、SEM、维卡软化点的分析,研究了PVA和酸酐的含量对材料的力学性能、热性能、吸水率的影响,并讨论了蒙脱土的加入对体系性能的影响。研究发现,适量的顺丁烯二酸酐能够降低淀粉分子链间的氢键作用,并促使其晶区的破坏,从而改善淀粉的加工性能、力学性能以及耐水性,当加入2.5%顺丁烯二酸酐时,材料的拉伸强度提高了60.54%;随着PVA含量的增加,体系力学性能增强,吸水率降低。蒙脱土的加入改善了其加工性能,并有效地提高了材料的力学性能、耐水性以及热稳定性。SEM显示,复合材料各组分之间的相容性较好,淀粉得到良好的塑化。     

Investigation on curing reaction of phthalonitrile resin with nanosilica and the properties of their glass fiber-reinforced composites

In this work, Phthalonitrile containing benzoxazine (BA-ph) and Bisphenol A based cyanate ester (CE) were chosen as the matrix resin. Various amount of nano-SiO₂ was incorporated into BA-ph/CE and their glass fiber-reinforced composite laminates were fabricated. Curing reaction and processability of BA-ph/CE/SiO₂ blends were studied by differential scanning calorimetry and dynamic rheological analysis. Results showed that BA-ph and CE exhibited good processability and curing reaction of BA-ph/CE was not obviously affected by SiO₂. Scanning electron microscope images of the composites showed that SiO₂ particles were well dispersed in BA-ph/CE matrix. Moreover, SiO₂ could act as physical crosslinking points and diluent in matrix as well as between the glass fibers to improve the mechanical properties of composite laminates. As the results of dynamic mechanical analysis and thermogravimetry analysis, composite laminates possessed satisfactory T_g and good thermal stability. With incorporation SiO₂ particles into matrix resin, dielectric constant and dielectric loss of BA-ph/CE/SiO₂/GF composites were increased and showed frequency dependence.     

Percolation phenomena in polymers containing dispersed iron

Metal‐polymer composites based on polyethylene (PE), polyoxymethylene (POM), polyamide (PA) and a PE/POM blend as matrix and dispersed iron (Fe) as filler have been prepared by extrusion of the appropriate mechanical mixtures, and their electrical conductivity, dielectric properties and thermal conductivity have been investigated. The filler spatial distribution is random in the PE‐Fe, POM‐Fe and PA‐Fe composites. In the PE/POM‐Fe composite the polymer matrix is two‐phase and the filler is contained only in the POM phase, resulting in an ordered distribution of dispersed Fe in the volume of polymer blend. The transition through the percolation threshold ?_c is accompanied by a sharp increase of the values of conductivity σ, dielectric constant ε′ and dielectric loss tangent tan δ. The critical indexes of the equations of the percolation theory are close to the theoretical ones in the PE‐Fe and POM‐Fe composites, whereas they take unusually high values in the PE/POMFe composite. Thus, t in the equation σ ～ (φ – φ_c)^t is 2.9–3.0 in the systems characterized by random distribution of dispersed filler and 8.0 in the PE/POM‐Fe system. The percolation threshold φ_c depends on the kind of polymer matrix, becoming 0.21, 0.24, 0.29 and 0.09 for the composites based on PE, POM, PA and PE/POM, respectively. Also the thermal parameters of the PE/POM‐Fe composite are different from those of all other composites. A model explaining the unusual electrical characteristics of the composite based on the polymer blend (PE/POM‐Fe) is proposed, in agreement with the results of optical microscopy.     

Thin polymer films based on poly(vinyl alcohol) containing graphene oxide and reduced graphene oxide with functional properties

In this article, the effect of the addition of graphene oxide (GO) and reduced graphene oxide (rGO) on the mechanical properties, thermal stability, and electrical conductivity of polyvinyl alcohol (PVA) has been investigated. Different weight percentages of nanofillers ranging from 0.5 to 5 wt% have been combined with PVA. The ultrasonic technique has been applied to disperse nanofillers in the PVA solution. The nanocomposite films have been prepared via solution casting technique and the dispersion of nanofillers into the PVA has been studied through optical microscopy. The microstructure, crystallization behavior, and interfacial interaction were characterized through X-ray diffraction and Fourier transform infrared spectroscopy. Differential scanning calorimetry (DSC) and thermogravimetric analysis have been applied to study the thermal properties of the prepared nanocomposites. The DSC results revealed that the crystallization temperature and melting temperature were enhanced in the presence of GO nanofiller. Besides, the tensile strength at break was improved along with the addition of GO; however, elongation at break for PVA/GO and PVA/rGO was diminished. Moreover, all specimens showed insulating behavior and the only sample was electrically conducting, which contain a high amount of rGO (5 wt%).     

Enhancement of thermal conductivity for epoxy laminated composites by constructing hetero-structured GF/BN networks

Due to the rapid development of multifunctional and miniaturized electronic devices, the demand for polymer composites with mechanical properties, high-thermal conductivity, and dielectric properties is increasing. Therefore, the heat dissipation capacity of the composite must be improved. To solve this problem, we report a glass fabric (GF)/boron nitride (BN) network with a highly thermally conductive hetero-structured formed using polyvinyl alcohol (PVA) as an adhesive. The GF and BN are furtherly modified by (3-aminopropyl)triethoxysilane (APTES) for better thermal conductivity enhancement. When the BN content is 30%, the thermal diffusion coefficient and thermal conductivity of obtained PVA-mBN@mGF (PBG) are 2.843 mm²/s and 1.394 W/(m K), respectively. Epoxy (EP) resin is then introduced to prepare PBG/mBN/EP laminated composites via the hot pressing method as applied as thermal conductive composites. A highest thermal conductivity of 0.67 W/(m K) of PBG/mBN/EP laminated composites is obtained, three times higher than that of pure EP. In addition, the PBG/mBN/EP laminated composites also present favorable mechanical, electrically insulating, and dielectric properties.     

Polyarylene ether nitrile/divinyl siloxane-bisbenzocyclobutene composite films: Curing reaction and thermal/mechanical/dielectric properties

Polymer dielectrics, are commonly used as insulating materials for electronic products. Light weight, good mechanical properties and high thermal conductivity are important properties. However, electrical and thermal parameters are interrelated, and it is challenging to have a dielectric polymer that is also resistant to high temperatures and high thermal conductivity. Hence, high-performance composite films were prepared by the method of post-solid phase chemical reaction using polyarylene ether nitrile (PEN) and divinyl siloxane-bisbenzocyclobutene (BCB) as raw materials. First, parameters of the curing reaction were determined by rheological and activation energy calculations. Then, through adjusting the content of BCB resin and treatment temperature, the performance of PEN/BCB composites could be tuned. Thermal properties have been studied by differential scanning calorimetry, dynamic mechanical analysis, thermal gravimetric analysis, and hot-disk method. Here, the PEN/BCB composite electric insulating materials with outstanding thermal performance (T_g: 208–400°C, T_5%: 469–544°C, thermal conductivity: 1.270–2.215 W/m K). Besides, its mechanical and dielectric properties were investigated in detail. It is noteworthy that the tensile strength of composite film can exceed a maximum of 130 MPa, which is 23.19% higher compared to the untreated one. Also, PEN/BCB composites own low dielectric constant (2.27–4.08 at 1 KHz), and the relationship between frequency or a wide temperature range and dielectric constant/loss is stable. Thus, it has a greater potential for applications in electronics in high-temperature environments.