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热网络法在发动机舱温度场仿真中的应用 总被引:1,自引:0,他引:1
对应用于温度场分析的热网络方法及基于热网络法的软件SINDA/FLUINT进行了介绍.利用热网络法和流体网络法对某发动机舱进行热仿真与热分析.建立了飞行器发动机舱各部件与其内外流体之间的网络关系及仿真模型,并进行耦合求解,得到此发动机舱各部件不同位置的温度分布,并对优化方案进行了仿真.其结果为发动机舱热分析及布局设计提供了参考. 相似文献
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本文依据热阻网络法,经过迭代计算,对某一太阳能吸附式空气取水器热损所受环境条件影响进行了稳态条件下的数值分析。 相似文献
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非稳态卡计法测定真空集热管热损系数的研究 总被引:2,自引:0,他引:2
应用非稳态卡计法理论导出了真空集热管热损系数公式,并对四种真空集热管进行了实测,其结果与网络法理论计算值相符,在实测的基础上归纳得到计算真空集热管热损系数的经验公式。 相似文献
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讨论了一种新型管的管簇结构腔体式吸收器,基于网络法建立了确定各种热流的控制方程及总热阻并给出集热器及各主要部件的效率定义式,最后对热性能进行了详细的数值分析。 相似文献
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针对试验所得碾压混凝土热学参数的随机性以及温度场的复杂性,提出基于BP人工神经网络的反分析方法。建立神经网络模型,利用有限元正分析得到的样本去训练网络,然后利用实际所测温度对热学参数进行反分析,根据反分析后的热学参数利用有限元进行温度场正分析,分析比较预测参数与试验参数所得非稳定温度场。通过工程实例,结果表明,该方法用于获取碾压混凝土坝热学参数是可行的。 相似文献
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This work presents a novel mathematical model for the analysis of thermal stresses in a radiative annular fin with temperature-dependent thermal conductivity and radiative parameter. An approximate analytical solution for thermal stresses is derived using a homotopy perturbation method (HPM)-based closed-form solution of steady-state nonlinear heat transfer equation, coupled with classical elasticity theory. The effect of thermal parameters on the temperature field and the thermal stress fields are discussed. The various thermal parameters, such as a parameter describing the temperature-dependent thermal conductivity, coefficient of thermal expansion, coefficient of radiative parameter, and the variable radiative parameter, are inversely estimated for a given stress field. For inverse modeling, a population-based sine cosine algorithm (SCA) was employed to estimate the thermal parameters. The inverse modeling is verified by using the estimated thermal parameters in the closed-form solution of stress field. The reconstructed stress fields obtained from the inversely estimated parameters are then compared with the reference stress field. Results show a very good agreement between the reference stress field and the inversely estimated stress fields. 相似文献
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Masaru Ishizuka 《亚洲传热研究》1997,26(8):541-553
In recent years there has been a growing demand for smaller and lighter electronic circuits which have greater complexity, multifunctionality, and reliability. High-density multichip packaging technology has been used in order to meet these requirements. The higher the density scale is, the larger the power dissipation per unit area becomes. Therefore, in the design process it has become very important to carry out a thermal analysis. However, the heat transport model in multichip modules is very complex and its treatment is tedious and time consuming. This paper describes an application of the thermal network method to the transient thermal analysis of multichip modules and proposes a simple model for multichip modules as a preliminary thermal design tool. Based on the results of a transient thermal analysis, the validity of the thermal network method and the simple thermal analysis model are confirmed. © 1998 Scripta Technica, Heat Trans Jpn Res, 26(8): 541–553, 1997 相似文献
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针对航空涡轮叶片的温度场预测问题,采用CFD(computational fluid dynamics)软件和有限元计算理论与方法,以对流冷却叶片的温度场与热应力求解为例,分别计算了涡轮进口温度均匀和不均匀时叶片的温度场和热应力,分析了涡轮进口温度不均匀对叶片热应力的影响,其中叶片温度场的求解采用气热耦合的方法即直接应用CFD软件计算叶片温度场,再依据温度场进行了有限元热应力分析.结果表明,进口温度不均匀时比进口温度均匀时叶片的热应力增大10%左右. 相似文献
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