In_(0.53)Ga_(0.47)As光电PIN二极管

<正>特点 掺Sn的InP衬底上生长In_(0.53)Ga_(0.47)As液相外延材料,正面光注入型台式结构,Zn扩散形成PN结.用途 光纤通讯     

InP衬底上Ga_(0.47)In_(0.53)As/InP液相外延生长

<正>我所自81年4月份开展InP-GalnAs液相外延生长以来,已于8月中旬在InP衬底上生长出与衬底晶格相匹配的Ga_(0.47)In_(0.53)AS/InP的液相外延层.三元层表面光亮平整的双层外延材料,其禁带宽度为0.74～0.75eV,晶格失配率为2.77×10~(-4)左右.为进一步检验材料的特性,今年11月初用这种材料进行了长波长光电探测器试验.该器件采用Zn扩散结     

退火对Zn扩散的影响及其在InGaAs探测器中的应用

采用闭管扩散方式,对不同结构的异质结外延材料In0.81Al0.19As/In0.81Ga0.19As、InAs0.6P0.4/In0.8Ga0.2As、InP/In0.53Ga0.47As实现了Zn元素的P型掺杂,采用扫描电容显微技术(SCM)和二次离子质谱(SIMS)研究了在芯片制备中高温快速热退火(RTP)处理环节对p-n结结深的影响。结果表明:由于在这3种异质结外延材料中掺杂的Zn元素并未完全激活,导致扩散深度明显大于p-n结结深;高温快速热退火处理并不会显著影响结深的变化,扩散完成后的p-n结深度可以近似为器件最终的p-n结结深;计算了530℃下Zn在In0.81Al0.19As、InAs0.6P0.4、InP中的扩散系数D分别为1.327×10-12cm2/s、1.341 10-12cm2/s、1.067×10-12cm2/s。     

InP衬底上Ga_(0.47)In_(0.53)As/InP液相外延生长

用液相外廷获得了与InP晶格匹配的Ga_(0.47),In_(0.53)As单晶外延层.本文叙述在(100)和(111)InP衬底上Ga_(0.47)In_(0.53)As/InP液相外延生长方法.用常规滑动舟工艺生长的这种外延层,其表面光亮,Ga的组分x=0.46～0.48,晶格失配率小于2.77×10~(-4),禁带宽度E_g=0.74～0.75eV.使用这种Ga_(0.47)In_(0.53)As/InP/InP(衬底)材料研制的长波长光电探测器,在波长为0.9～1.7μm范围内测出了光谱响应曲线,在1.55μm处呈现峰值.     

In0.53Ga0.47As/InP高速光电二极管材料生长及光电性能

利用低压MOCVD技术制备PIN结构的InP基InGaAs外延材料。采用分层吸收渐变电荷倍增(SAGCM)结构,通过两次Zn扩散、多层介质膜淀积、Au/Zn p型欧姆接触、Au/Ge/Ni n型欧姆接触等标准半导体平面工艺,设计制造正入射平面In_(0.53)Ga_(0.47)As/InP雪崩光电二极管器件。该器件采用与InP衬底晶格匹配的In_(0.53)Ga_(0.47)As材料做吸收层,InP材料做倍增层,同时引入InGaAsP梯度层。探测器件光敏面直径50μm,器件测试结果表明该器件光响应特性正常,击穿电压约43 V,在低于击穿电压3 V左右可以得到大约10 A/W的光响应度,在0 V到小于击穿电压1 V的偏压范围内,暗电流只有1 nA左右。光电二极管在8 GHz以下有平坦的增益,适用于5 Gbit/s光通信系统。     

Cd和Zn在InP和InGaAsP中的扩散(E_g=0.95～1.35eV)

研究了566～715℃温度范围内 InP 中 Cd 和 Zn 的扩散问题。采用由 Cd_3P_2和 InP 粉末为混合源的 Cd 扩散,使我们能得到几微米以下的浅扩散深度(X_j),并形成无表面损伤的平坦的 p-n 结。另一方面采用包括 Zn_3P_2(或ZnP_2)+InP 粉末为混合源的 Zn 扩散为快速扩散,结果造成扩散前沿不平整。当采用磷硅玻璃(PSG)掩膜进行 InP 的选择扩散时,如果扩散时石英管中的 InP 粉末量不足(≤100mg),发现沿掩膜边缘会产生滑移位错。还进行了与 InP 晶格匹配的 InGaAsP(E_g=0.95～1.35eV)中的 Cd 扩散研究工作。业已发现扩散深度随着带隙能量的减小而单调减小。     

闭管扩散Zn对InP表面性质的影响

利用闭管扩散方法以Zn3P2为扩散源,在不同扩散温度和扩散时间下对非故意掺杂InP(100)晶片进行扩散.用电化学C-V法(ECV)和二次离子质谱法(SIMS)分别测出了空穴浓度和Zn的浓度随深度的分布曲线.结果表明扩散后InP表面空穴和Zn的浓度在扩散结附近突然下降,InP表面空穴浓度主要取决于扩散温度,扩散深度随着扩散时间的增长而变大,InP表面Zn浓度一般比空穴浓度高一个数量级.另外对扩散后的样品进行光致发光(PL)测试,表明在保证表面载流子浓度的同时,适当降低扩散温度和增加扩散时间能减小对InP表面性质的影响.     

闭管扩散Zn对InP表面性质的影响

利用闭管扩散方法以Zn3P2为扩散源,在不同扩散温度和扩散时间下对非故意掺杂InP(100)晶片进行扩散.用电化学C-V法(ECV)和二次离子质谱法(SIMS)分别测出了空穴浓度和Zn的浓度随深度的分布曲线.结果表明扩散后InP表面空穴和Zn的浓度在扩散结附近突然下降,InP表面空穴浓度主要取决于扩散温度,扩散深度随着扩散时间的增长而变大,InP表面Zn浓度一般比空穴浓度高一个数量级.另外对扩散后的样品进行光致发光(PL)测试,表明在保证表面载流子浓度的同时,适当降低扩散温度和增加扩散时间能减小对InP表面性质的影响.     

闭管扩散Zn对InP表面性质的影响

利用闭管扩散方法以Zn3P2为扩散源，在不同扩散温度和扩散时间下对非故意掺杂InP (100）晶片进行扩散. 用电化学C-V法（ECV）和二次离子质谱法(SIMS)分别测出了空穴浓度和Zn的浓度随深度的分布曲线. 结果表明扩散后InP表面空穴和Zn的浓度在扩散结附近突然下降，InP表面空穴浓度主要取决于扩散温度，扩散深度随着扩散时间的增长而变大，InP表面Zn浓度一般比空穴浓度高一个数量级. 另外对扩散后的样品进行光致发光（PL) 测试，表明在保证表面载流子浓度的同时，适当降低扩散温度和增加扩散时间能减小对InP表面性质的影响.     

电子工艺

Y2000-62210-361 0012783直径为100毫米的 In_(0.53)Ga_(0.47)As/InP 芯片加工工艺的进展=Progress with 100 mm diameter In_(0.53)Ga_(0.47)As/InP wafer processing[会,英]/Olsen,G.H.&Lange,M.J.//Proceedings of 11th International Con-ference on Indium Phosphide and Related Materials.—361-363(UC)介绍了利用在直径为50和75毫米 InP 衬底上生长的 InGaAs/InP 外延层制备出的光探测器的结果。利用100000Ω-cm2的晶格匹配的材料生产出最优分流电阻的芯片。X 射线形貌测试表明,利用直径为100毫米的圆片获得了低缺陷密度(<10000cm-2)的掺铁的磷化铟衬底。参2     

InP基一镜斜置三镜腔型光电探测器理论分析及实验研究

介绍了一种新型长波长InP基一镜斜置三镜腔型（OMITMiC）光电探测器，并对其进行了数值模拟。介绍了该光电探测器的两项关键制备工艺。首先，利用动态掩膜湿法腐蚀技术，通过调节HCl：HF：CrO3腐蚀溶液的选择比。在与InP晶格匹配的In0.72Ga0.28As0.6P0.4外延层上制备出了不同倾角的楔形结构。其次，利用选择性湿法腐蚀技术，通过FeCl3；H2O溶液对In0.53Ga0.47As牺牲层的腐蚀，制备出了具有InP／空气隙的高反射率分布式布拉格反射镜（DBR）。     

The characteristics of Zn-doped InP using spin-on dopant as a diffusion source

Zn diffusion into InP was carried out ex-situ using a spin-on dopant as a diffusion source. The characteristics of Zn-doped InP are analyzed using low-temperature photoluminescence (PL), differential Hall measurement, and secondary ion mass spectrometry (SIMS). Dopant activation of Zn is close to 100% using this method. Band-to-acceptor (B-A) transition peak is dominant in PL, which is a characteristic usually found in in-situ doping. This evidence along with an activation energy of 0.5 eV show that the diffusion is substitutional rather than interstitial.     

Impurity-induced disordering of AIGalnAs quantum wells by low temperature Zn diffusion

We investigated impurity-induced disordering (IID) in AIGalnAs multi-quantum wells (MQWs) on InP substrate by Zn diffusion under low temperature conditions. Blue-shift of band-gap energy of lattice-matched AIGalnAs MQW on InP strongly depended on the temperature of Zn diffusion. The lattice-matched MQW was not completely disordered below 500°C. On the other hand, photoluminescence spectra from compressively strained AIGalnAs MQW, after disordering was independent of the temperature of Zn diffusion. Considerable disordering was observed in the strained MQW, which was saturated even at the low temperature of 400°C. The measured hole concentration of the Zn diffused layer at 400°C was as low as 3 × l0¹⁸cm⁻³ The IID lasers were also fabricated and characterized. No significant increase in the optical loss due to the Zn diffusion was observed in these lasers. On leave from Toshiba Co., Japan.     

非故意掺杂吸收层InP/InGaAs异质结探测器研究

为了获得低噪声铟镓砷（InGaAs）焦平面,需要采用高质量的非故意掺杂InGaAs（u-InGaAs）吸收层进行探测器的制备。采用闭管扩散方式,实现了Zn元素在u-InGaAs吸收层晶格匹配InP/In_0.53Ga_0.47As异质结构材料中的P型掺杂,利用扫描电容显微技术(SCM)对Zn在材料中的扩散过程进行了研究,结果表明,随着扩散温度和时间增加,p-n结结深显著增加,u-InGaAs吸收层材料的扩散界面相比较高吸收层浓度材料（5×1016 cm?3）趋于缓变。根据实验结果计算了530 ℃下Zn在InP中的扩散系数为1.27×10?12 cm2/s。采用微波光电导衰退法(μ-PCD)提取了InGaAs吸收层的少子寿命为5.2 μs。采用激光诱导电流技术(LBIC)研究了室温下u-InGaAs吸收层器件的光响应分布,结果表明:有效光敏面积显著增大,对实验数据的拟合求出了少子扩散长度L_D为63 μm,与理论计算基本一致。采用u-InGaAs吸收层研制的器件在室温(296 K)下暗电流密度为7.9 nA/cm2,变温测试得到激活能E_a为0.66 eV,通过拟合器件的暗电流成分,得到器件的吸收层少子寿命τ_p约为5.11 μs,与微波光电导衰退法测得的少子寿命基本一致。     

Open-tube diffusion techniques for InP/LnGaAs heterojunctior bipolar transistors

Open-tube diffusion techniques used between 450 and 600° C are described which involve the supply of diffusant from a vapour source (via a solution) and a solid evaporated metal source. Investigations of Zn into InP and InGaAs(P) have been undertaken using both sources. SIMS profile analyses show that in the case of the vapour source the profiles indicate a concentration-dependent diffusion coefficient while the solid source diffusions can be well described by a Gaussian-type profile. The usefulness of the vapour source method has been demonstrated in the fabrication of bipolar transistors which exhibit good d.c. characteristics. The solid source method is limited by the slow diffusion velocity and more gradual profile. The InGaAs(P)/InP materials system has important applications in optical communications and future high speed microwave and switching devices. Useful technologies allied to the introduction of impurities into Si by diffusion, have gradually been emerging for use in the III-V semiconductor family. Closed tube systems1 have been used in order to contain the volatile group V species and prevent surface erosion. In addition, simpler open tube systems^2,3 have been developed that maintain a sufficient overpressure of the group V element. Zn and Cd p-dopants have been studied extensively because of the volatility and relatively large diffusion rates in III-V semiconductors. Opentube diffusion into both InP and InGaAs^2-6 has been studied but little detail has appeared concerning InGaAs and InGaAsP. In this paper we describe a comprehensive study of the diffusion of Zn into InP and InGaAs(P) using both open-tube vapour source and a Au/Zn/Au evaporated solid source with SiN_x acting both as a mask and also an encapsulant to prevent loss of Zn and decomposition of the substrate material. The techniques have been successfully applied to the fabrication of InP/lnGaAs heterojunction bipolar transistors which show good dc characteristics. Reference to InGaAs in the text implies the InP lattice-matched composition In_0.53Ga_0.47As.     

InGaAs PIN光电探测器的暗电流特性研究

从理论上分析了In0.53Ga0.47As PIN光电探测器在不同掺杂浓度及反向偏压下的暗电流特性,并与研制的器件的实测结果进行了比较和讨论.模拟结果表明:在低偏压下,器件中的产生复合电流起主要作用,偏压增大时,隧道电流起主要作用,且In0.53Ga0.47As光吸收层的载流子浓度对器件的暗电流有很大的影响,实测器件特性与模拟结果完全符合.文中还对器件结面积和电极尺寸等对暗电流的影响进行了比较和分析.     

In0.15Ga0.85As／GaAs多量子阱子能带跃迁压力效应

用光调制吸收光谱方法在不同压力条件下研究了In_(0.15)Ga_(0.85)As/GaAs应变多量子阱的子能带跃迁,发现子能带跃迁能量随压力的变化行为与构成量子阱的组成体材料带间跃迁能量的变化相似,并且子能带跃迁能量压力系数与量子阱的宽度有关。还讨论了压力可能引起的导带不连续率的变化和In_(0.15) Ga_(0.85)As应变层的临界厚度。     

New dark current component of InGaAs／InP HPDs confirmed by DLTS

The dark current of In_(0.47) Ga_(0.53) As/InP heterojunction photodiodes (HPDs) was analysed. We found that there exists a new dark current component-deep level-assisted tunnelling current.DLTS was used to measure the In_(0.47)Ga_(0.53)As/InP HPDs. An electronic trap which has a thermal activation energy of O.44 eV, level concentration of 3.10×10^(13)cm^(-3) and electronic capture cross section of 1.72×10^(12)cm^2 has been found.It s existence results in the new tunnelling current.