共晶强制性熔化的界面形态

对透明共晶系ＣＢｒ４－８．４ｗｔ－％Ｃ２Ｃ１６生长的典型层片共晶组织强制熔化进行实时实地观测．表明相对于强制生长时的“界面滞后”现象，熔化界面温度高于静止时界面温度，熔化界面比静止界面更靠近热端，称为“界面超前”．随熔化速度增大，“界面超前量”增大；共晶组织分层熔化，出现两个熔化界面，α和β相熔化秩序不同，α，β相分别单独熔化，两熔化界面的相对位置由α，β相成分，熔化速度和共晶相间距等因素决定．     

冷却速度对无铅焊料Sn-3．5Ag合金微观组织和显微硬度的影响

在～10^2K／s、～10^3K／s和～10^4K／s的冷速条件下研究了凝固速度对无铅焊料Sn-3．SAg合金微观组织和显微硬度的影响。结果表明：由于非平衡凝固条件下动力学过冷的影响，导致了该共晶合金实际凝固过程开始于平衡共晶凝固点以下，合金凝固组织中包含初生β-Sn枝晶，且该初生β-Sn枝晶组织随合金凝固速度的提高而发生细化。另外，维氏硬度测试结果表明，无铅焊料Sn-3．5ag合金在不同冷速条件下的凝固组织与显微硬度的关系符合经典Hall-Petch关系式，即初生β-Sn枝晶细化能显著提高焊料合金的显微硬度。     

Al-Y包晶合金非平衡凝固过程及组织特征

包晶凝固过程中小平面-小平面两相复相生长方式是凝固领域研究的一个热点。以初生相和包晶相都是严格计量比金属间化合物的Al-Y包晶合金作为研究对象,利用DSC热分析技术,严格控制冷却速度,获得不同凝固条件的非平衡凝固试样,研究了两相为小平面相的Al-Y包晶合金的凝固行为。发现小平面-小平面包晶系合金包晶凝固过程中,非平衡凝固特性及宏观偏析特点比非小平面包晶系更加明显。凝固特征温度与平衡相图偏差明显,包晶反应温度和包晶相直接凝固温度都远高于平衡相图给定的值,相对于相图是在"过热"条件下发生的,而固溶体型包晶合金一般是在"过冷"条件下发生的。包晶转变过程非常微弱,致使初生相残留量远高于平衡相图。即使对于过包晶成分的合金,其凝固组织中仍存在大量的共晶凝固组织,最终得到的凝固组织与平衡相图存在显著差异。     

冷却速度对无铅焊料Sn-3.5Ag合金微观组织和显微硬度的影响

在～102K/s、～103K/s和～104K/s的冷速条件下研究了凝固速度对无铅焊料Sn-3.5Ag合金微观组织和显微硬度的影响.结果表明:由于非平衡凝固条件下动力学过冷的影响,导致了该共晶合金实际凝固过程开始于平衡共晶凝固点以下,合金凝固组织中包含初生β-Sn枝晶,且该初生β-Sn枝晶组织随合金凝固速度的提高而发生细化.另外,维氏硬度测试结果表明,无铅焊料Sn-3.5Ag合金在不同冷速条件下的凝固组织与显微硬度的关系符合经典Hall-Petch关系式,即初生β-Sn枝晶细化能显著提高焊料合金的显微硬度.     

激光双面区熔Al2O3/Y3Al5O12共晶自生复合陶瓷的制备与表征

采用激光区熔凝固技术制备大尺寸Al2O3/Y3Al5O12(YAG)共晶自生复合陶瓷,考察双面区熔条件下大尺寸氧化物共晶陶瓷的熔化及凝固成形规律,采用扫描电镜、能谱和X射线衍射对其凝固组织特征进行了表征和分析.研究结果表明:在优化的凝固工艺下,激光双面区熔增加了熔凝层的厚度,获得了熔凝层厚度8.2 mm,长度65.0 mm,致密度达98.5%±1%的Al2O3/YAG共晶陶瓷;共晶熔凝层厚度随激光扫描速率的减小而增加,随激光功率的增大而增大,并且致密度随着激光功率的增大呈现先增大后减小的趋势;双面区熔后的Al2O3/YAG共晶陶瓷微观组织由均一分布、相互交织的Al2O3和YAG共晶相组成,共晶层片间距较小(1.0~3.5μm),且与凝固速度满足Jackson-Hunt公式;共晶间距随扫描速率的增大逐渐减小;双面区熔界面处共晶组织生长具有连续性,界面结合良好;共晶陶瓷的Vickers硬度为(18.6±1.0)GPa.     

A1对M2高速钢凝固过程的作用

研究了A1在M2高速钢凝固过程中的行为及其对凝固组织的影响．结果表明，A1具有扩大δ铁素体区，促进以往状树枝晶方式结晶的作用；A1在M2钢中呈负偏析分布，并参与形成M2C共晶碳化物．A1还降低共晶碳化物的分解温度，使共晶碳化物在高温加热时易于分解和粒化．     

亚共晶Ni-Si合金的凝固组织特征研究

采用布里奇曼定向凝固技术制备了NiNi3Si亚共晶复合材料,系统地研究了Ni-Ni3Si亚共晶的定向凝固组织特征。在较低的凝固速率R=3μm/s时亚共晶成分的合金为规则的层片共晶组织。随着凝固速率的增大,当R=8μm/s时,平界面失稳,在第二相的旁边出现浅胞状组织。当R=25μm/s时在析出相的旁边出现了突起的胞状组织。当R=40μm/s时由于固液界面前沿的成分过冷逐渐增大,凝固组织生长成为典型的树枝晶组织。并根据"成分过冷"判据,评估了固液界面前沿的"成分过冷"的大小,理论计算与实验结果基本吻合。此外,根据BH模型计算和比较了α-Ni相的界面生长温度和共晶界面生长温度,证明较高速定向凝固下不太可能制备出全耦合生长的共晶组织。随凝固速率的增大,一次枝晶间距减小,组织细化。     

快速凝固铸造合金中的偏析与组织

本文讨论了不同凝固速度下合金铸件与铸锭中,以至快速凝固的粉末或薄膜中的枝晶臂间距与偏析。以Al-4.5Cu作为例子。在这类工业合金的快速凝固中我们很少去注意不平衡现象。较多的倒是在于寻求途径以获得均匀、平衡的凝固组织。增大凝固速度可提高均匀性,它的作用包括:减少枝晶臂间距,降低树枝晶尖端温度,降低共晶生长温度,消除树枝晶,造成初生相或次生相形核前的过冷。     

电子束区熔定向凝固Ni-Si共晶合金的固-液界面演化规律

采用电子束悬浮区熔定向凝固技术制备了Ni-Ni3Si共晶自生复合材料,在稳态晶体生长区,采用零功率法获取了不同凝固速率的固-液界面。研究表明,随凝固速率的增大,固-液界面的形态发生了明显的变化。在凝固速率较低时,固-液界面基本保持平界面,形成的是规则的层片状共晶组织。随凝固速率的增大,成分过冷增大,平界面失稳,凝固组织的规则性也降低。此外,根据M-S界面稳定性判据,计算了不同凝固速率不同干扰波长对固-液界面稳定性的影响,理论计算与实验结果基本吻合。     

Sn-9Zn无铅焊料合金凝固组织及其在时效中的演变

为了考察Sn-9Zn无铅焊料合金凝固组织及其在时效中的演变,制备了不同冷却条件及不同熔体过热度下Sn-9Zn/Cu焊点,并利用扫描电镜和光学显微镜观察了其组织形貌.观察发现:共晶组织随冷却速率提高而显著细化;同时,随炉缓冷凝固时合金形成完全的层片状共晶组织,而空冷和喷水冷却条件下合金除层片状共晶组织外,还形成了杆状富锌相.实验结果还表明,熔体过热度对出炉空冷合金的共晶组织有显著影响,较高的熔体过热度使共晶组织更细密.在空冷合金的时效过程中,杆状富锌相趋于逐渐溶解消失,90℃时效时还发生了共晶组织的显著粗化.     

Microstructural evolution in AZ91D magnesium alloy during electron beam welding

Vacuum electron beam welding can have a low heat input, which means there is a minimum heat affected zone during welding of AZ91D magnesium alloy. From the observed microstructure, the weld of the AZ91D magnesium alloy can be divided into four regions, which are the weld metal zone, a partially-melted zone adjacent to the fusion boundary, a partially-melted zone adjacent to the base metal and the base metal zone. A sharp transition from the fusion zone to the non-melted zone, especially the characteristic partial melting microstructure and nature of the alloy elements, was observed. It was found that significant partial melting had taken place in the very narrow region around the weld metal of the AZ91D magnesium alloy. The Al content of eutectic β-Mg₁₇Al₁₂ in the partially-melted zone adjacent to the fusion boundary was close to the content in the continuously precipitated eutectic β particles in the fusion zone and much lower than the eutectic β in the base metal. The fully melted eutectic β-phase coexisted with the partially melted eutectic β phase in the partially-melted zone adjacent to the base metal.     

微量Ce对亚快速凝固Al-Zn-Mg-Cu合金组织与性能的影响

通过DSC,XRD,SEM,EDS,静拉伸实验等材料分析方法研究了Ce对亚快速凝固方式铸造Al-Zn-Mg-Cu合金显微组织与力学性能的影响,探求合理的均匀化热处理工艺。结果表明,添加Ce能减小合金枝晶间距,细化晶粒,消除分散缩孔,起到细晶和净化的作用。添加Ce使合金低熔点共晶相的初熔温度降低3℃,相同均匀化条件下微量Ce能促进低熔点共晶相溶入基体,改善合金的均匀化效果。合金A的均匀化温度应低于480℃,合金B的均匀化温度应低于470℃,添加Ce降低了合金的均匀化温度,提高均匀化效率。添加Ce还大幅度提高了合金抗拉强度。     

Numerical Prediction of Eutectic Temperature Using a Multi-phase-Field Model

To evaluate the reliability of metal-carbon eutectic systems as fixed points for the next generation of the international temperature scale, the effect of the eutectic microstructure on the temperature at the solid/liquid (s/l) interface during solidification and melting is preliminarily investigated using a multi-phase-field model. First, the effects of furnace temperature, lamellar spacing, and interface energy on the average temperature of the s/l interface are studied in the solidification process. With increased furnace undercooling, the s/l interface temperature was found to decrease. Calculated eutectic microstructures are then adopted as initial conditions for a melting simulation. The interface undercooling during melting is observed to be smaller than that observed during solidification. This difference in interface undercooling is attributed to the solute/solvent concentration profiles in the liquid phase near the s/l interface being different for melting and solidification.     

脂肪酸二元低共熔混合物相变温度和潜热的理论预测

对低共熔混合物相变温度和潜热的理论预测公式进行了选择和验证,对脂肪酸类二元低共熔混合物的配比、熔点和熔化潜热进行了理论计算。从实际的计算过程来看,计算值与实验值吻合得很好,可以用来计算脂肪酸类低共熔混合物的热特性参数。在15种脂肪酸类低共熔混合物中,熔点最低为10.2℃,最高为51.5℃;熔化潜热最低为138.6J/g,最高为187.5J/g。从工程实际应用来看,脂肪酸类低共熔混合物适用于低温采暖、生活热水、相变墙体、温控混凝土、相变服装等领域。     

An investigation to the effect of deformation-heat treatment cycle on the eutectic morphology and mechanical properties of a Thixocast A356 alloy

The influences of deformation, heat treatment temperature and holding time on morphology and size distribution of Si containing eutectic phases of Thixocast Al-7Si-0.4 Mg alloy were investigated. The novel thermo-mechanical treatment consisted of initial cold working practice followed by a solution heat treatment at 540 °C for durations ranging from 2 min to 120 min followed by water quenching. Optical and scanning electron microscopes were used to study the influence of process parameters on microstructure evolution. Also, final mechanical properties were investigated using hardness test. The results indicate that, under appropriate conditions it is possible to achieve an ultrafine grain microstructure with the eutectic Si fibers fragmented and spheroidized in the entire microstructure. It was also found that, an agglomeration of sphrodized particles occurs and is governed by Ostwald ripening mechanism.     

深过冷Fe-B-Si共晶合金凝固组织纳米化机制探讨

采用深过冷及深过冷加水淬的方法,成功地制备了样品直径为16mm,高为15mm,组织中晶粒平均尺寸小于120nm的Fe76B12Si12合金块体纳米材料。理论分析与实际计算结果表明：该合金凝固组织纳米化的主要原因在于,其共晶两相的生长速度小、组织粗化速率小、溶质平衡分配系数低以及具有相对较低的熔化焓;深过冷Fe-B-Si合金块体纳米软磁材料制备的理想条件是：获得超过冷、选择主要由溶质扩散控制生长的共晶合金成分、获得Fe2B(Si)相为完全准球状形态的二次粒化非规则共晶组织。     

Laser surface modification of a 13.5% Cr, 0.6% C steel

A 13.5% Cr, 0.6% C steel, with an initial microstructure of chromium carbides in a ferrite matrix, was heat-treated by scanning a high-power laser beam over the surface. The aim was to compare the physical and chemical properties produced by this type of selective surface treatment with those resulting from a conventional furnace desensitization and quench-hardening heat treatment. Surface heating homogenized the carbon originally bound in the carbides sufficiently to produce martensite, giving hardening to levels comparable with a conventional heat treatment. Chromium-rich zones, carbides and retained austenite were also detected in the heated microstructure. Surface melting produced complete homogenization of both carbon and chromium, which resulted in the retention of large amounts of austenite in the microstructure on cooling to room temperature. Subsequent refrigeration at — 196 °C transformed some of the austenite to martensite. Pitting corrosion and local reductions in hardness were observed adjacent to treated areas under certain conditions, due to precipitation of secondary carbides and elevated tempering, respectively.     

DFTNAN/DNTF二元相图及低共熔物熔融动力学研究

通过测定3,5-二氟-2,4,6-三硝基苯甲醚（DFTNAN）/3,4-二硝基呋咱基氧化呋咱（DNTF）二元混合体系熔融过程的差示扫描量热（DSC）特征量数据,建立了T-X和H-X二元相图,并获得了该混合体系低共熔物的组成和熔点。然后,研究了低共熔物以及熔点为80 ℃时混合物的黏度、机械感度和理论爆炸性能。分析了不同的升温速率和添加剂对低共熔物熔融过程的影响,并通过Sˇatava-Sˇesták、Coats-Redfern和通用积分方程获得了低共熔物熔融过程的动力学参数Ea、A和最概然机理函数。结果表明,由T-X相图和H-X相图计算得到的DFTNAN/DNTF低共熔物的组成m(DFTNAN)∶m(DNTF)分别为62.94∶37.06和62.88∶37.12,低共熔温度为63.84 ℃。调节DFTNAN和DNTF的比例,可使混合体系既达到熔铸工艺要求的工艺温度（≥80 ℃）,又能保持较高的能量水平和较低的感度。随着升温速率的提高,熔融反应起始温度和峰温发生相应的延后;添加HMX或RDX后,熔融起始温度发生较明显的后移;DFTNAN/DNTF低共熔物的熔融动力学参数Ea和lgA分别为32.95 kJ/mol和2.81,最概然机理函数为f(α)=(1-α)^2/3。     

Intergranular fracture of Al–Li–Cu–Mg alloy resulting from non-equilibrium eutectic melting during solution treatment

Abstract

This investigation has examined intergranular fracture during heat treatment and deformation of an Al–Li–Cu–Mg alloy and of an Al–Li–Cu alloy. When solution treatment of the Al–Li–Cu–Mg alloy was initiated by rapid heating to temperatures ≥ 545°C, non-equilibrium eutectic melting of a grain boundary precipitate phase occurred and the liquid spread along grain boundaries as a thin film. On quenching, intergranular cracks were observed at grain boundaries into which a liquid film had penetrated during solution treatment. For less rapid heating rates, non-equilibrium eutectic melting did not occur and no intergranular cracks were observed after quenching. No evidence of non-equilibrium eutectic melting was observed in the Al–Li–Cu alloy irrespective of the rate of heating to 550°C. During tensile testing of as quenched and quenched and aged specimens of the two alloys, intergranular fracture occurred in most specimens, whether or not non-equilibrium eutectic melting had taken place during solution treatment, indicating that at least one additional mechanism of intergranular fracture was initiated by deformation.

MST/947     

Effect of electromigration induced joule heating and strain on microstructural recrystallization in eutectic SnPb flip chip solder joints

A refinement of the lamellar microstructure was observed in eutectic SnPb solder joints in electromigration. Electromigration has both atomic flux and electron flow. The latter generated joule heating and the former caused strain. The formation of nanoscale lamellar microstructure spent a large amount of interfacial energy, and we proposed that the driving force comes from the strain induced by electromigration under a high current density. Kinetically, refinement of the lamellar microstructure required fast atomic diffusion at a high homologous temperature. The joule heating mainly from the on-chip Al interconnect lines tremendously increased the temperature of solder bumps and enabled fast atomic diffusion. The strain induced by electromigration, when combined with a high homologous temperature, could lead to recrystallization in the sample to form the nanoscale lamellae.