排序方式: 共有4条查询结果,搜索用时 15 毫秒
1
1.
A novel COB(chip-on-board) structure with integrated multifunction is presented.The structure is prepared by laminating copper plate with FR4 board and then coating with a silver layer to offer high reflectivity and high conductivity.In comparison with MCPCB(aluminum) and ceramics(Al2O3) board,the substrate brings about 10%higher light extracting efficiency than aluminum board and 5%higher flux maintenance ratio than ceramics(Al2O3) board at 3000 h.With integrated multifunction,through an IC component driving high voltage serial LED chips,the COB can be directly connected to AC 110 V or 220 V power supply in lighting application. 相似文献
2.
3.
4.
在发展我国的LED产业过程中。本人认为有几个关键问题必须认识清楚并加以解决。这几个关键问题是:LED上游技术问题;LED封装规模与装备问题;基于LED的固体照明的推广应用问题;LED领域的知识产权与专利问题。本将围绕上述几个关键问题谈些个人看法并提出建议。 相似文献
1