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一阶悬浮力是磁性液体传感器的设计关键。利用任意多物理场直接耦合分析软件COMSOL multiphysics仿真分析了磁性液体一阶悬浮力,一阶悬浮力在最大偏心距纵坐标为-2.5mm,横坐标在-20~25mm的范围内呈周期分布,其平均值为38.43N。同时对没考虑磁场和流场耦合情况下的一阶悬浮力进行了理论计算,仿真和理论计算均表明一阶悬浮力与偏心距离间存在非线性关系,一阶悬浮力的理论计算结果大于仿真分析结果,偏心距越大,理论计算与仿真分析的结果相差越大。磁性液体传感器的设计应该考虑磁场和流场的耦合作用。 相似文献
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用直流磁控溅射方法,在氮气分压为0.5Pa、不同的基底温度下,于玻璃基底上制备了Cu3N薄膜。当基底温度为100℃及以下时,温度越高薄膜的结晶程度越好。当基底温度在100℃以上时,随着基底温度的升高,薄膜的结晶程度逐渐减弱,200℃时结晶已很弱,300℃时已完全不能形成Cu3N晶体。薄膜的电阻率随基底温度的变化不大,薄膜的沉积速率随基底温度的升高在18~30nm/min之间近似地线性增大,薄膜的显微硬度随基底温度的升高而略有降低。对基底温度为室温和100℃下制备的氮化铜薄膜进行不同温度下的真空退火,研究了它们的热稳定性。XRD测试表明,薄膜在200℃时开始出现分解,350℃时完全分解。比较在基底温度为室温和100℃下制备的样品,发现室温下制备的氮化铜薄膜比100℃下制备的氮化铜薄膜稳定。 相似文献
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Copper nitride thin films were deposited on glass substrates by reactive direct current (DC) magnetron sputtering at various N2-gas partial pressures and room temperature. Xray diffraction measurements showed that the films were composed of Cu3N crystallites and exhibited a preferential orientation of the [111] direction at a low nitrogen gas (N2) partial pressure. The film growth preferred the [111] and the [100] direction at a high N2 partial pressure. Such preferential film growth is interpreted as being due to the variation in the Copper (Cu) nitrification rate with the N2 pressure. The N2 partial pressure affects not only the crystal structure of the film but also the deposition rate and the resistivity of the Cu3N film. In our experiment, the deposition rate of Cu3N films was 18 nm/min to 30 nm/min and increased with the N2 partial pressure. The resistivity of the Cu3N films increased sharply with the increasing N2 partial pressure. At a low N2 partial pressure, the Cu3N films showed a metallic conduction mechanism through the Cu path, and at a high N2 partial pressure, the conductivity of the Cu3N films showed a semiconductor conduction mechanism. 相似文献
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采用反应直流磁控溅射镀膜法,在氮气分压为0.9Pa、不同基底温度下、玻璃基底上制备了纳米多晶Cu3N薄膜,并研究了基底温度对薄膜结构和性能的影响。结果表明,当基底温度为100℃及以下时,薄膜以[111]方向择优生长为主;在150℃及200℃时,薄膜以[100]方向择优生长为主;250℃时开始出现Cu的[111]方向生长,300℃时已完全不能形成Cu3N晶体,只有明显的Cu晶体。随基底温度的升高,薄膜的沉积速率在13~28nm/min呈U型变化,低温和高温时较高,150℃时最低;薄膜的电阻率显著降低;薄膜的显微硬度先升后降,100℃时显微硬度最大。 相似文献
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