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Erfahrungen mit der Auswaschung von Kartoffelreibsel ohne Wasserzusatz

Experience in Potato Pulp Washing without Water Addition. In order to reduce the quantity of waste water from potato starch factories many have tried to keep the amount of water, required for washing out the starch from the pulp as low as possible. Our process is based on utilization of the water contained in the potatoes (approx. 80%, including soluble components) for starch extraction, in such a way that undiluted fruit water is separated and further treatment can be carried out in a comparatively economical way. Most of today's starch factories are tied up with production methods that make it impossible to utilize the water contained in the potatoes, as there is firstly no possibility of recirculating the fruit water and secondly there are foaming problems causing a negative effect on the efficiency. A continuous process guaranteeing a direct flow, excluding accumulation of foam, was installed and tested in both a Swedish and in a Dutch factory. The experience obtained showed that starch extraction with fruit water has no negative influence on the efficiency of the extraction (approx. 1 % free starch in the pulp DS/DS) and that up to 80% of the fruit water could be removed in a concentrated form. By extending the extraction process, and by using 300 l of process water from the refining section per ton of potatoes, separation of the fruit water can be increased up to 97%.     

Smaller,Stronger, More Stable: Peptide Variants of a SARS-CoV-2 Neutralizing Miniprotein

Based on the structure of a de novo designed miniprotein (LCB1) in complex with the receptor binding domain (RBD) of the SARS-CoV-2 spike protein, we have generated and characterized truncated peptide variants of LCB1, which present only two of the three LCB1 helices, and which fully retained the virus neutralizing potency against different SARS-CoV-2 variants of concern (VOC). This antiviral activity was even 10-fold stronger for a cyclic variant of the two-helix peptides, as compared to the full-length peptide. Furthermore, the proteolytic stability of the cyclic peptide was substantially improved, rendering it a better potential candidate for SARS-CoV-2 therapy. In a more mechanistic approach, the peptides also served as tools to dissect the role of individual mutations in the RBD for the susceptibility of the resulting virus variants to neutralization by the peptides. As the peptides reported here were generated through chemical synthesis, rather than recombinant protein expression, they are amenable to further chemical modification, including the incorporation of a wide range of non-proteinogenic amino acids, with the aim to further stabilize the peptides against proteolytic degradation, as well as to improve the strength, as well the breadth, of their virus neutralizing capacity.     

Implementation of electron beam grey scale lithography and proximity effect correction for silicon nanowire device fabrication

An electron beam lithography exposure strategy combining efficient proximity effect correction (PEC) with multi-pass grey scale is compared with a more conventional strategy based on a single-pass exposure without PEC. Exposure results for different types of nanowire structures are presented. Line edge and line width roughness (LER and LWR) values for both approaches are determined. The novel exposure strategy presented in this work reduced LER by ∼25% and LWR by ∼40%.     

Transverse modes under external feedback and fiber couplingefficiencies of VCSEL's

We report a detailed study on the transverse mode behavior of vertical-cavity surface-emitting lasers (VCSEL's) under strong external feedback. Backreflections from a glass facet result, periodically depending on the feedback phase, in variations of the transverse mode pattern of strongly index guided multitransverse-mode-emitting lasers. As a result, butt-coupling efficiencies of these lasers strongly depend on laser-fiber distance. For typical active VCSEL diameters around 15-μm fiber-coupled powers into standard 50 μm-core diameter graded-index (GI) silica fibers vary by nearly 10 dB. Even for high-numerical aperture 100-μm-core diameter fibers, power variations of up to 2 dB are observed     

Analysis of the Survivability of GaN Low-Noise Amplifiers

This paper presents a detailed analysis of the stressing mechanisms for highly rugged low-noise GaN monolithic-microwave integrated-circuit amplifiers operated at extremely high input powers. As an example, a low-noise amplifier (LNA) operating in the 3-7-GHz frequency band is used. A noise figure (NF) below 2.3 dB is measured from 3.5 to 7 GHz with NF<1.8 dB between 5-7 GHz. This device survived 33 dBm of available RF input power for 16 h without any change in low-noise performance. The stress mechanisms at high input powers are identified by systematic measurements of an LNA and a single high electron-mobility transistor in the frequency and time domains. It is shown that the gate dc current, which occurs due to self-biasing, is the most critical factor regarding survivability. A series resistance in the gate dc feed can reduce this gate current by feedback, and may be used to improve LNA ruggedness     

3-D deformable image registration: a topology preservation scheme based on hierarchical deformation models and interval analysis optimization.

This paper deals with topology preservation in three-dimensional (3-D) deformable image registration. This work is a nontrivial extension of, which addresses the case of two-dimensional (2-D) topology preserving mappings. In both cases, the deformation map is modeled as a hierarchical displacement field, decomposed on a multiresolution B-spline basis. Topology preservation is enforced by controlling the Jacobian of the transformation. Finding the optimal displacement parameters amounts to solving a constrained optimization problem: The residual energy between the target image and the deformed source image is minimized under constraints on the Jacobian. Unlike the 2-D case, in which simple linear constraints are derived, the 3-D B-spline-based deformable mapping yields a difficult (until now, unsolved) optimization problem. In this paper, we tackle the problem by resorting to interval analysis optimization techniques. Care is taken to keep the computational burden as low as possible. Results on multipatient 3-D MRI registration illustrate the ability of the method to preserve topology on the continuous image domain.     

Capacitively coupled transmission line pulsing cc-TLP––a traceable and reproducible stress method in the CDM-domain

This paper describes a new test method called capacitively coupled transmission line pulsing cc-TLP. It is applied to different test circuits which were mounted on specially designed package emulators with a defined background capacitance. The test results are compared with the ESD thresholds obtained by CDM tests. The cc-TLP results correlate well with the CDM data.     

Effects of load and thermal conditions on Pb-free solder joint reliability

Reliability of lead-free solder joints has been a hot topic widely debated in the electronic industry. Most published data indicate that a change to lead-free soldering has the potential benefit of more reliable solder joints than the current Sn-Pb eutectic solder joints. However, in reality many mechanical, metallurgical, thermal, and environmental factors affect the service reliability of solder joints. This paper tries to shed some light on the effects of mechanical loading and thermal conditions on solder joint reliability. These conditions are determined not only by external environments but also by the solder alloy itself and the joint geometry. Analyses with first principles are carried out on solder joints of both areal array and peripheral packages. Effects on fatigue life of solder joint geometry, thermal and mechanical characteristics of components and substrate materials, and application conditions are discussed. The analysis helps explain why lead-free solder joints may not be more reliable in certain application conditions than the current Sn-Pb eutectic solder joints.