首页 | 本学科首页   官方微博 | 高级检索  
文章检索
  按 检索   检索词:      
出版年份:   被引次数:   他引次数: 提示:输入*表示无穷大
  收费全文   2232篇
  免费   78篇
  国内免费   10篇
电工技术   12篇
综合类   2篇
化学工业   800篇
金属工艺   44篇
机械仪表   44篇
建筑科学   38篇
矿业工程   2篇
能源动力   107篇
轻工业   191篇
水利工程   12篇
石油天然气   6篇
无线电   168篇
一般工业技术   435篇
冶金工业   109篇
原子能技术   23篇
自动化技术   327篇
  2024年   4篇
  2023年   34篇
  2022年   93篇
  2021年   92篇
  2020年   84篇
  2019年   79篇
  2018年   89篇
  2017年   75篇
  2016年   63篇
  2015年   52篇
  2014年   94篇
  2013年   323篇
  2012年   112篇
  2011年   107篇
  2010年   90篇
  2009年   89篇
  2008年   86篇
  2007年   71篇
  2006年   76篇
  2005年   65篇
  2004年   38篇
  2003年   37篇
  2002年   28篇
  2001年   25篇
  2000年   26篇
  1999年   27篇
  1998年   32篇
  1997年   23篇
  1996年   24篇
  1995年   25篇
  1994年   24篇
  1993年   21篇
  1992年   26篇
  1991年   17篇
  1990年   16篇
  1989年   24篇
  1988年   12篇
  1987年   12篇
  1986年   7篇
  1985年   9篇
  1984年   7篇
  1983年   18篇
  1982年   13篇
  1981年   5篇
  1980年   4篇
  1979年   11篇
  1978年   9篇
  1976年   7篇
  1975年   4篇
  1971年   3篇
排序方式: 共有2320条查询结果,搜索用时 0 毫秒
1.
2.
3.
A standard metric conventionally employed to compare the performance of different multiprocessor systems is speedup. Although providing a measure of the improvement in execution speed achievable on a system, this metric does not yield any insight into the factors responsible for limiting the potential improvement in speed. This paper studies the performance degradation in shared-memory multiprocessors as a result of contention for shared-memory resources. A replicate workload framework with a flexible mechanism for workload specification is proposed for measuring performance. Two normalized performance metrics—efficiency and overhead factor—are introduced to quantify the factors limiting performance and facilitate comparison across architectures. Finally, the proposed model is employed to measure and compare the performance of three contemporary shared-memory systems, with special emphasis on the newly released BBN Butterfly-II (TC2000), currently undergoing Beta test.  相似文献   
4.
5.
Editorial     
  相似文献   
6.
A dynamic rcsring dnim war built to study the effects of air temperature, moisture content and grain shape on fragility of the air dried kernels. For drying rares under 0.05 kglkg min. the fragility of kernels could br described empirically as a function of the three experimental parameters.  相似文献   
7.
This report reviews some fundamental and practical aspects of steam drying technologies based mainly on studies published in Japan. Steam drying kinetics, and some industrial technologies particularly for drying of foods, textiles and sludges are reviewed with focus on quality of dried material, drying time, dryer selection and energy recovery from steam dryer exhaust. For energy recovery, heat pump technologies are outlined along with characteristics of different types of steam compressors. A new process is proposed for steam drying; it combines a direct-indirect dryer followed by a direct steam dryer for internal moisture removal.  相似文献   
8.
A set of runs were performed on the catalytic and thermal cracking of the tars present fn the gasifier off-gas stream; the cracking referred to here Js essentially hydrocracking, in view of the considerable amount of hydrogen being present in the gas stream. The catalyst evaluated for tar cracking was a commercial cobalt-molybdenum catalyst, suppported on γ-Al2O3(Katalco-477). It was observed that there was a decrease in the amount of tar obtained with the cracking unit on-line with the gasifier; the tars were cracked to gaseous products in the presence of catalyst. Furthermore, it appeared that higher ring structures were transformed to less heavier components; thus cracking could become beneficial in downstream processing of the gas stream coming out of a gasifier.  相似文献   
9.
A single-feed dual frequency compact microstrip antenna with a shorting pin is described. This new antenna configuration gives a large variation in frequency ratio of the two operating frequencies, without increasing the overall size of the antenna  相似文献   
10.
At frequencies beyond 1 GHz, every component of the IC package contributes to the RF performance, whether required or not. In this work, we study the effects of packaging materials namely, the substrate and the globtop/underfill material on RF performance. We have measured interconnects on two area-array CSPs, the ball grid array and the polymer stud grid array using IMEC’s MCM-D technology. The measurements on the package interconnect show that the losses in the package substrate material account for about 50% of the total losses at 1.8 GHz and this drops to less than 20% at 5.2 GHz. The losses due to impedance mismatch dominate the losses especially below 10 GHz and considerable improvement in performance cannot be obtained by using an improved/expensive substrate. The other study is about the influence of globtop/underfill materials on wirebonds (through 3D EM simulations) as well as on standard 50 Ω MCM-D transmission lines (through experiments). While a higher value of dielectric constant of the globtop/underfill material is better on wirebonds, the influence of loss tangent is felt only above values of 0.1. The influence of seven different globtop/undefill materials on 50 Ω transmission lines has been used to extract their dielectric constant and loss tangent values at 30 GHz. These results are very valuable since one can hardly find the properties of globtop/underfill materials beyond 1 GHz.  相似文献   
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号