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1.
2.
Xue‐Yong Liu Xiao‐Bin Ding Zhao‐Hui Zheng Yu‐Xing Peng Albert S
C Chan C
W Yip Xin‐Ping Long 《Polymer International》2003,52(2):235-240
Amphiphilic magnetic microspheres ranging in diameter from 5 to 100 µm were prepared by dispersion copolymerization of styrene and poly(ethylene oxide) vinylbenzyl (PEO‐VB) macromonomer (MPEO) in the presence of Fe3O4 magnetic fluid. The effects of various polymerization parameters on the average particle size were systematically investigated. The average particle size was found to increase with increasing styrene concentration and initiator concentration. It also increased with decreasing stabilizer concentration and molecular weight of MPEO. The content of the hydroxyl groups localized in the microspheres ranged from 0.01 to 0.2 mmol g?1. © 2003 Society of Chemical Industry 相似文献
3.
Removal of gold from basic solutions containing [Au(CN)2]? has been demonstrated using the inherently conducting polymer polypyrrole. Polymers containing sulfonated aromatic dopants have been found to display a significant ability to remove gold from such solutions. Experiments performed in solutions containing both gold and copper cyanide complexes indicate that the recovery process is not highly selective. However, the polypyrroles used display significantly faster rates of gold recovery than activated carbon. © 2003 Society of Chemical Industry 相似文献
4.
Shi-Jin Ding Hang Hu Lim H.F. Kim S.J. Yu X.F. Chunxiang Zhu Li M.F. Byung Jin Cho Chan D.S.H. Rustagi S.C. Yu M.B. Chin A. Dim-Lee Kwong 《Electron Device Letters, IEEE》2003,24(12):730-732
For the first time, we successfully fabricated and demonstrated high performance metal-insulator-metal (MIM) capacitors with HfO/sub 2/-Al/sub 2/O/sub 3/ laminate dielectric using atomic layer deposition (ALD) technique. Our data indicates that the laminate MIM capacitor can provide high capacitance density of 12.8 fF//spl mu/m/sup 2/ from 10 kHz up to 20 GHz, very low leakage current of 3.2 /spl times/ 10/sup -8/ A/cm/sup 2/ at 3.3 V, small linear voltage coefficient of capacitance of 240 ppm/V together with quadratic one of 1830 ppm/V/sup 2/, temperature coefficient of capacitance of 182 ppm//spl deg/C, and high breakdown field of /spl sim/6 MV/cm as well as promising reliability. As a result, the HfO/sub 2/-Al/sub 2/O/sub 3/ laminate is a very promising candidate for next generation MIM capacitor for radio frequency and mixed signal integrated circuit applications. 相似文献
5.
A.L. Pan H.G. ZhengZ.P. Yang F.X. Liu Z.J. Ding Y.T. Qian 《Materials Research Bulletin》2003,38(5):789-796
Small Ag particles or clusters dispersed mesoporous SiO2 composite films were prepared by a new method: First the matrix SiO2 films were prepared by sol-gel process combined with the dip-coating technique, then they were soaked in AgNO3 solutions followed by irradiation of γ-ray at room temperature and in ambient pressure. The structures of these films were examined by X-ray diffraction (XRD), high-resolution transmission electron microscope (HRTEM), and optical absorption spectroscopy. It has been shown that the Ag particles grown within the porous SiO2 films are very small, and they are isolated and dispersed from each other with very narrow size distributions. With increasing the soaking concentration and an additional annealing, an opposite peakshift effect of the surface plasmon resonance (SPR) was observed in the optical absorption measurements. 相似文献
6.
Ying Ding Chunqing Wang Yanhong Tian Binbin Zhang 《Metallurgical and Materials Transactions A》2006,37(12):1017-1025
in-situ transmission electron microscopy (TEM) tensile tests on as-cast and aged 63Sn37Pb solder alloys were conducted, and the fracture
behavior in nanometer scale ahead of the crack tip was inspected and discussed. Results show that the fracture was completed
by connecting the discontinuous cracks or voids. Dislocation behavior was concentrated along the grain boundaries for as-cast
samples, and displayed mainly as dislocation climb. The crack was intergranular dominated under the lower strain rate. While
remarkable mutual dislocation emission was detected in the aged solder. Transgranular cracks were dominant in the fractured
area, and they propagated by linking up with the nanometer scale cracks ahead of the crack tips under the effective promotion
of the inverse dislocation emission. At the same time, the partial interphase or intergranular cracks in the thinned area
were also found. Under this condition, a new critical stress intensity factor K
c
′ to define the mutual dislocation emission was proposed. 相似文献
7.
Kameyama H. Miyajima T. Zhi Ding 《IEEE transactions on circuits and systems. I, Regular papers》2008,55(3):851-860
In multicarrier systems, when the order of a channel impulse response is larger than the length of the cyclic prefix (CP), there is a significant performance degradation due to interblock interference (IBI). This paper proposes a blind-channel shortening method in which the equalizer parameter vector is formed by the noise subspace of the received signal correlation matrix so that the output power is maximized. The proposed method can not only shorten the effective channel impulse response to within the CP length but also maximize the output signal-to-interference-and-noise ratio while eliminating the IBI. We point out that the performance depends on the choice of a decision delay and propose a simple method for determining the appropriate delay. We propose both a batch algorithm and an adaptive algorithm and show by simulation that they are superior to the conventional algorithms. 相似文献
8.
Eng Leong Tan Ding Yu Heh 《Microwave and Wireless Components Letters, IEEE》2008,18(5):296-298
This letter presents an unconditionally stable alternating direction implicit finite-difference time-domain (ADI-FDTD) method with fourth order accuracy in time. Analytical proof of unconditional stability and detailed analysis of numerical dispersion are presented. Compared to second order ADI-FDTD and six-steps SS-FDTD, the fourth order ADI-FDTD generally achieves lower phase velocity error for sufficiently fine mesh. Using finer mesh gridding also reduces the phase velocity error floor, which dictates the accuracy limit due to spatial discretization errors when the time step size is reduced further. 相似文献
9.
Bin Xie Shi X.Q. Han Ding 《Components and Packaging Technologies, IEEE Transactions on》2008,31(2):361-369
In an anisotropic conductive adhesive (ACA) assembly, the electrical conduction is usually achieved with the conductive particles between the bumps of integrated circuit (IC) and corresponding conductive tracks on the glass substrate. Fully understanding of the mechanical and electrical characteristics of ACA particles can help to optimize the assembly process and improve the reliability of ACA interconnection. Most conductive particles used in the ACA assembly are with cracks in the metal coating of the particles after the ACA bonding. This paper introduced the fracture analysis by applying the cohesive elements in the numerical model of the nickel-coated polymer particle and further simulating the cracks initiation and propagation in the nickel coating during the ACA bonding. The simulation results showed that the stress distribution on the nickel-coated particle with cracks was significantly different from that on the nickel-coated particle without crack, indicating that the stress analysis by taking the crack into consideration is very important for the reliability assessment of the ACA interconnection. The stress analysis of cohesive elements indicated that the cracks initiated at the central area of the nickel coating and propagated to the polar area. Furthermore, by the introduction of a new parameter of the virtual resistance, a mathematical model was established to describe the electrical characteristics of the nickel-coated particle with cracks. The particle resistance of the nickel-coated particle with cracks was found to be much higher than that of the particle without crack in the optimized bonding pressure range, indicating that it is necessary to take the crack into consideration for the particle conduction analysis as well. Therefore, the fracture analysis on the conductive particle by taking the crack into consideration could accurately evaluate the reliability of ACA interconnection and avoid serious reliability issues. 相似文献
10.
对唐钢薄板坯连铸机生产的SS400钢的生产工艺进行了分析,认为薄板坯连铸机生产的SS400钢,在采取了精炼站在线定氧,将钢水全氧控制在25×10~(-6)左右,同时连铸采取保护浇注和轻压下等技术后,能够确保薄板坯连铸SS400钢的顺利浇注,轧制的板带材表面质量良好,机械性能符合要求。 相似文献