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1.
We present the results from a user study looking at the ability of observers to mentally integrate wind direction and magnitude over a vector field. The data set chosen for the study is an MM5 (PSU/NCAR Mesoscale Model) simulation of Hurricane Lili over the Gulf of Mexico as it approaches the southeastern United States. Nine observers participated in the study. This study investigates the effect of layering on the observer's ability to determine the magnitude and direction of a vector field. We found a tendency for observers to underestimate the magnitude of the vectors and a counter‐clockwise bias when determining the average direction of a vector field. We completed an additional study with two observers to try to uncover the source of the counter‐clockwise bias. These results have direct implications to atmospheric scientists, but may also be able to be applied to other fields that use 2D vector fields.  相似文献   
2.
A method for detecting shorted windings in operational turbine-generators is described. The method is based on the traveling wave method described by El-Sharkawi, et. al. (1971). The method is extended in this paper to operational rotors by the application of a neural network feature extraction and novelty detection. The results of successful laboratory experiments are also reported  相似文献   
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This study is to investigate the factors influencing the alcohol production byKluyveromyces fragilis using the juice of Jerusalem Artichoke tubers. The cell growth rate and ethanol production rate were stimulated by aeration and by the addition of unsaturated fatty acids and the cell mass production and the ethanol production were substantially improved. It was found that oxygen and unsaturated fatty acids added played a decisive role on the increase of alcohol tolerance of yeast.  相似文献   
6.
Generating quadrilateral meshes is a highly non-trivial task, as design decisions are frequently driven by specific application demands. Automatic techniques can optimize objective quality metrics, such as mesh regularity, orthogonality, alignment and adaptivity; however, they cannot make subjective design decisions. There are a few quad meshing approaches that offer some mechanisms to include the user in the mesh generation process; however, these techniques either require a large amount of user interaction or do not provide necessary or easy to use inputs. Here, we propose a template-based approach for generating quad-only meshes from triangle surfaces. Our approach offers a flexible mechanism to allow external input, through the definition of alignment features that are respected during the mesh generation process. While allowing user inputs to support subjective design decisions, our approach also takes into account objective quality metrics to produce semi-regular, quad-only meshes that align well to desired surface features.  相似文献   
7.
A generalized plane strain condition is assumed for an edge interfacial crack between die passivation and underfill on an organic substrate flip chip package. C4 solder bumps are explicitly modeled. Temperature excursions are treated as loading conditions. The design factors studied include underfill elastic modulus, underfill coefficient of thermal expansion (CTE), fillet height, and die overhang. Varying underfill modulus and CTE produces a different stress field at underfill/die passivation interface, different stress intensity factor (SIF), and phase angle (/spl psi/) even under the same loading condition. The baseline case uses underfill with elastic modulus of 6 GPa, CTE of 36 ppm//spl deg/C and fillet height equal to half die thickness. Four more cases involving underfill material properties are investigated by varying elastic modulus between 3 and 9 GPa, and by varying CTE between 26 and 46 ppm//spl deg/C. The effect of fillet height is also studied by assuming no fillet and full fillet, i.e., fillet height equal to die thickness. Finally, two cases concerning the influence of die overhang, defined as the nominal distance between outermost solder joint and die edge, are investigated. Fracture parameters, including energy release rate (G) and phase angle (/spl psi/), are evaluated as a function of dimensions. Underfill material properties (elastic modulus and CTE), fillet configuration, and die overhang can be optimized to reduce the risk of underfill delamination in flip chip or direct chip attach (DCA) applications.  相似文献   
8.
基于时间滞后概念,建立了压缩系统动态响应分析的通用模型,并对温度突升条件下多级轴流压缩系统的动态响应及气动稳定性进行了详细的数值分析。对两个算例的分析,结果表明了本文新模型的可行性。  相似文献   
9.
In this study, inorganic silica nanoparticles are used to manipulate the morphology of 6,13‐bis(triisopropylsilylethynyl)‐pentacene (TIPS pentacene) thin films and the performance of solution‐processed organic thin‐film transistors (OTFTs). This approach is taken to control crystal anisotropy, which is the origin of poor consistency in TIPS pentacene based OTFT devices. Thin film active layers are produced by drop‐casting mixtures of SiO2 nanoparticles and TIPS pentacene. The resultant drop‐cast films yield improved morphological uniformity at ~10% SiO2 loading, which also leads to a 3‐fold increase in average mobility and nearly 4 times reduction in the ratio of measured mobility standard deviation (μStdev) to average mobility (μAvg). Grazing‐incidence X‐ray diffraction, scanning and transmission electron microscopy as well as polarized optical microscopy are used to investigate the nanoparticle‐mediated TIPS pentacene crystallization. The experimental results suggest that the SiO2 nanoparticles mostly aggregate at TIPS pentacene grain boundaries, and 10% nanoparticle concentration effectively reduces the undesirable crystal misorientation without considerably compromising TIPS pentacene crystallinity.  相似文献   
10.
A laser/modulator driver IC for 10-Gb/s-SONET OC-192-fiber optic transmitters is described. Depending on the user application, the IC is capable of driving more than 100 mA of current into a laser diode or over 50 mA into an electro-absorption or Mach-Zehnder modulator. Rise and fall times below 20 pS are achieved. The driver employs a novel dual-mode actively matched output buffer that provides a dc-coupled back termination of either 25 or 50 Ω. Compared to an output buffer with a resistive termination, this buffer dissipates only half as much power. In addition, the buffer has the the ability to reject external bias and will therefore not load bias sources used to set laser threshold currents and modulator offset voltages. The low power consumption makes the IC most suitable for co-packaging with uncooled lasers and electro-absorption modulators. The driver is fabricated in a 0.25-μm gate length production GaAs PHEMT process with substrate thru vias, thin-film resistors, and MIM capacitors  相似文献   
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