2-D dopant profiling in VLSI devices using dopant-selectiveetching: an atomic force microscopy study

We report a detailed mapping of a 2-D dopant profile on a fully processed industrial sample with large dynamic range and high spatial resolution by utilizing a dopant-selective etching process and Atomic Force Microscopy. The experimental results show excellent agreement with those obtained from SRP and SIMS as corroborative methods. We also discuss the most critical factors which influence the applicability, reproducibility, and reliability of this method     

Low density lipoprotein catabolism is enhanced by the cleaved form of alpha-1-antitrypsin

The frequent occurrence of hypocholesterolaemia following inflammatory processes is well known but unexplained. Elevated plasma levels of serine proteinase inhibitors (serpins) and their complexes with target enzymes have been demonstrated in inflammatory, malignant and infectious diseases which are also often accompanied by low plasma cholesterol levels. Under inflammatory conditions, uncomplexed, but cleaved inactive serpins arising from slow deacylation of the serpin-proteinase complex may be present in the circulation. To determine the influence of native and cleaved forms of serpins, such as alpha-1-antitrypsin (AAT), on lipoprotein metabolism, we investigated the effect of these forms on low density lipoprotein (LDL) catabolism in human HepG2 cell line. We have found that the cleaved form of AAT in concentrations from 125 to 2000 nmol l-1 stimulates LDL binding to the HepG2 cells, by up to 49% with a subsequent increase in LDL uptake and degradation of up to 79 and 65% respectively. Native AAT was also found to increase LDL binding and internalization by 20-25%, independently of the amount of AAT added, an effect most probably due to the cleaved form of AAT produced by local proteolysis of native AAT incubated in the cell culture. Moreover we have shown that the cleaved form of AAT interacts with LDL in vitro, and that such an interaction abolishes AAT ability to stimulate LDL binding and internalization. This study for the first time describes the ability of the cleaved form of AAT to stimulate LDL binding and internalization in HepG2 cell culture, and provides evidence that hypocholesterolaemia occurring during inflammatory processes may be mediated by cleaved forms of serpins.     

Effect of nitrogen ion implantation on impact wear

The effect of nitrogen ion implantation on the impact wear of several metals and alloys with different hardnesses was studied. An impact testing machine was built for this study. In this machine, bullet-shaped projectiles are bounced against a metal surface which is either stationary or rotating. Wear was determined by weight loss measurements. Scanning electron microscopy pictures were taken to study the surface damage. It was found that nitrogen ion implantation improved the impact wear of most of the materials studied. With sliding motion added during the impact, nitrogen ion implantation has little effect.     

Experimental determination of electron and hole mobilities in MOSaccumulation layers

This letter presents for the first time, the experimentally determined majority carrier mobilities in the accumulation layer of a MOSFET for both p-type and n-type channel doping for a wide range of doping concentrations. The measured carrier mobility is observed to follow a universal behavior at high transverse fields, similar to that observed for minority carriers in MOS inversion layers. At the higher doping levels, the effective mobility for majority carriers at low to moderate transverse fields is found to be very close to the bulk mobility. This is believed to be due to carrier screening of the ionized impurity scattering which dominates at the higher doping concentrations     

Coherency Hub Design for Multisocket Sun Servers with CoolThreads Technology

CoHub, a coherency hub ASIC, provides a cost-effective way to extend a glueless two-node chip-multithreading system to a four-node system without changes to the processor. The four-node, 256-thread system achieves near-linear scaling of performance with thread count on transaction-processing workloads. Time-to-market pressure, 800-MHz operation, and a six-stage pipeline were among the constraints that shaped CoHub's design.     

Statistical analysis and modeling of the temperature-dependent sleep behavior of drosophila

The sleep behavior of drosophila is analyzed under different temperatures. The activity per minute of the flies is recorded automatically. Sleep for a fruit fly is defined as the periods without any activity and longer than 5 minutes. Several parameters such as total sleep time, circadian sleep profile, quality of sleep are analyzed. The sleep behaviors are significantly different for flies at different temperature. Interestingly, the durations of daytime sleep periods show a common scale-free power law distribution. We propose a stochastic model to simulate the activities of the population of neurons which regulate the dynamics of sleep–wake process to explain the distribution of daytime sleep.     

A simple model for quantum mechanical effects in hole inversionlayers in silicon PMOS devices

The effects of quantization of the inversion layer of MOSFET devices is an area of increasing importance as technology is aggressively scaled below 0.25 μm. Although electron inversion layers have attracted considerable interest, very little work has been reported for holes. This paper describes the implementation and results of a simple, computationally efficient model, appropriate for device simulators, for predicting the effects of hole inversion layer quantization. This model compares very favorably with experimental results and the predictions of a full-band, self-consistent Schrodinger-Poisson solver     

Mechanical strength of Sn-3.5Ag-based solders and related bondings

The tensile strengths of bulk solders and joint couples of Sn-3.5Ag-0.5Cu, Sn-3.5Ag-0.07Ni, and Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge solders and the shear strengths of ball grid array (BGA) specimens, solder-ball-attached Cu/Ni/Au metallized substrates were investigated. The tensile strength of the bulk is degraded by thermal aging. The Ni-containing solder exhibits lower tensile strength than Sn-3.5Ag-0.5Cu after thermal aging. However, the Ni-containing solder joints show greater tensile strength than the Cu/Sn-3.5Ag-0.5Cu/Cu joint. Fracture of the solder joint occurs between the intermetallic compound (IMC) and the solder. The shear strength and fracture mechanism of BGA specimens are the same regardless of solder composition.