High-performance MIM capacitor using ALD high-k HfO/sub 2/-Al/sub 2/O/sub 3/ laminate dielectrics

For the first time, we successfully fabricated and demonstrated high performance metal-insulator-metal (MIM) capacitors with HfO/sub 2/-Al/sub 2/O/sub 3/ laminate dielectric using atomic layer deposition (ALD) technique. Our data indicates that the laminate MIM capacitor can provide high capacitance density of 12.8 fF//spl mu/m/sup 2/ from 10 kHz up to 20 GHz, very low leakage current of 3.2 /spl times/ 10/sup -8/ A/cm/sup 2/ at 3.3 V, small linear voltage coefficient of capacitance of 240 ppm/V together with quadratic one of 1830 ppm/V/sup 2/, temperature coefficient of capacitance of 182 ppm//spl deg/C, and high breakdown field of /spl sim/6 MV/cm as well as promising reliability. As a result, the HfO/sub 2/-Al/sub 2/O/sub 3/ laminate is a very promising candidate for next generation MIM capacitor for radio frequency and mixed signal integrated circuit applications.     

C-t analysis of MOS capacitors under constant current stress

The effect of high oxide field stress is studied using capacitance-time (C-t) measurements of MOS capacitors. The stress results in parallel shifts of the C-t curve along the time axis. The flatband voltage shift ΔV_FB obtained from the initial deep depletion capacitance C(t=0⁺) follows the same trend as that from the high-frequency C-V characteristics. However, the discrepancy between the two flatband voltages becomes larger as the stress increases due to the effect of interface charges on C-t characteristics. The flatband voltage difference is converted to interface trap density, showing a steady increase of interface trap density with stress, similar to that from low-frequency C-V measurements     

Development of Stretch Solder Interconnections for Wafer Level Packaging

A wafer level packaging technique has been developed with an inherent advantage of good solder joint co-planarity suitable for wafer level testing. A suitable weak metallization scheme has also been established for the detachment process. During the fabrication process, the compliancy of the solder joint is enhanced through stretching to achieve a small shape factor. Thermal cycling reliability of these hourglass-shaped, stretch solder interconnections has been found to be considerably better than that of the conventional spherical-shaped solder bumps.     

Influence of lips on thin-walled sections

Turning the free edge of an unstiffened flange inwards or outwards to form a ‘lip’, can substantially improve the local buckling resistance of a member. The lip is the most common type of edge stiffener used in cold-rolled, thin-walled sections. In this paper the behaviour of plate elements of thin-walled sections stiffened by compound lips (i.e. lips which are folded twice to form ‘lips on the lips’) is examined both theoretically and experimentally. An outline of a series of tests on compound edge-stiffened thin-walled sections of various geometries is given and some load-end compression displacement paths are compared with the theoretical predictions. Reasonably good agreement is obtained between the experimental and theoretical results. Comparisons of the theoretical predictions with experimental results of other researchers are also presented in this paper.     

An attempt to compare the performance of bioscrubbers and biotrickling filters for degradation of ethyl acetate in gas streams

This study presents a comparison of the efficiency of a bioscrubber and a biotrickling filter (BTF) for the removal of ethyl acetate (EA) vapour from a waste gas stream, under the same operating conditions. The maximum EA elimination capacity achieved in the bioscrubber was 550 g m^?3 h^?1 with removal efficiency higher than 96%. For higher EA loadings the bioscrubber was oxygen limited, which caused incomplete EA biodegradation. When pure oxygen was fed to the bioscrubber at a rate of 0.02 L min^?1, the bioscrubber recovered and could treat higher EA loadings without any oxygen limitation. The BTF achieved EA elimination capacity of 600 g m^?3 h^?1 with removal efficiency higher than 97% and the dissolved oxygen concentration remained substantially higher than in the bioscrubber. However, severe channelling and blockage of the spray nozzle occurred due to the excessive biomass growth. Overall, the bioscrubber system was easier to operate and control than the BTF, while an enhancement of the oxygen mass transfer in the bioscrubber could potentially increase its performance by up to three times. Copyright © 2005 Society of Chemical Industry     

The radiation crosslinking and scission of ethylene-propylene copolymers studied by solid-state nuclear magnetic resonance

Methyl groups from chain scission and H-crosslinks have been identified by solid-state nuclear magnetic resonance in amorphous ethylene-propylene copolymers containing 23 and 36 mole % propylene after γ-irradiation to 10 MGy at 30°C. G (scission) and G (crosslink) values determined from the n.m.r. spectra and by extraction are in agreement, which suggests that the crosslinks are not clustered. This may differ from the situation in polyethylene where there is a substantial crystalline content. G(S). G(X) and the ratio G(S)/G(X) increase with increasing propylene content of the copolymers.     

Implementing Information Systems: Some Practical Advice and a Richer Model

Recent research suggests that implementing information systems presents considerable difficulties and that many implementations are total or partial failures. This paper argues that what both practitioners and students require are richer and more acceptable models of information systems implementation. Accordingly, case study data concerning the introduction of manufacturing resource planning (MRP II) are used to illustrate five patterns of behaviour (rites) which capture important social actions; and four components of changing psychological orientation. It is argued that appreciation of the rites and psychological developments identified here will support effective change programmes. Guidelines based on our model are provided for practitioners.     

Effects of viscosity on the bitterness and astringency of grape seed tannin

To examine the separate effects of viscosity and sweetness on astringency, aqueous solutions of grape seed tannin (GST) were thickened with carboxymethyl cellulose (CMC) from 2 to 45 cP (experiment 1) or sweetened with 0 to 1.8 g/L aspartame (experiment 2). Trained subjects continuously rated astringency and bitterness in duplicate. Subjects were categorized by the salivary flow induced by citric acid and ability to taste n-propyl thiouracil (PROP). In experiment 1, maximum intensity and total duration of astringency were significantly decreased as viscosity rose, although time to maximum intensity of astringency was not affected. Maximum intensity and total duration of bitterness were not significantly affected by increasing viscosity; however, the onset of bitterness was significantly delayed. In experiment 2, increasing sweetness had no affect on any astringency parameter, although maximum intensity of bitterness was significantly decreased. Neither PROP nor salivary flow-status had any effect on perception of bitterness or astringency in either experiment.     

Design aspects of planar and conventional SMPS transformer: a cost benefit analysis

The intent of this paper is to design a high-frequency transformer that is to be incorporated into the DC/DC pulsewidth-modulated switch-mode power supplies by two different technical approaches: a conventional wound-coil magnetic using copper wires, and a planar magnetic with layered copper tracks on laminated printed circuit board. Comparisons will be made between the two approaches in terms of profile: mounting height and surface area, and performance: power losses and efficiency. Other indicators like temperature rise and leakage inductance that causes electromagnetic interference, and cost, materials, and process fluency are also to be looked into. A sandwiched configuration for primary and secondary windings is proposed for the planar type. Issues arising and typical phenomena encountered will be discussed in detail. Primarily, the dominating factor in performance, cost effectiveness, or circuit compactness that restrains the choice of a particular type is to be evaluated.