Exploiting ILP, TLP, and DLP with the polymorphous trips architecture

The Tera-op reliable intelligently adaptive processing system (TRIPS) architecture seeks to deliver system-level configurability to applications and runtime systems. It does so by employing the concept of polymorphism, which permits the runtime system to configure the hardware execution resources to match the mode of execution and demands of the compiler and application.     

Optimizing Chain Topology of Bottle Brush Copolymer for Promoting the Disorder-to-Order Transition

The order-disorder transitions (ODT) of core-shell bottle brush copolymer and its structural isomers were investigated by dissipative particle dynamics simulations and theoretically by random phase approximation. Introducing a chain topology parameter λ which parametrizes linking points between M diblock chains each with N monomers, the degree of incompatibility at ODT ((χN)ODT; χ being the Flory–Huggins interaction parameter between constituent monomers) was predicted as a function of chain topology parameter (λ) and the number of linked diblock chains per bottle brush copolymer (M). It was found that there exists an optimal chain topology about λ at which (χN)ODT gets a minimum while the domain spacing remains nearly unchanged. The prediction provides a theoretical guideline for designing an optimal copolymer architecture capable of forming sub-10 nm periodic structures even with non-high χ components.     

Dieless drawing steel wires using a dielectric heating method and modeling the process dynamics

Modern industries require the production of multi-functional, inorganic, micron-sized metal wires. This study suggests a novel method that could potentially offer a highly efficient dieless drawing technology for manufacturing thin stainless steel fibers. The method is based on a hot-working principle, using microwaves as the heat source and SiC as the susceptor. Experimental trials with a laboratory rig showed that the new system worked effectively for drawing the stainless steel wires and should be able to realize the diameter attenuation with a diameter reduction of up to 21%. The theoretical model describing the deformation behavior of the stainless steel wires in the working zone along with the constitutive equation of Bingham model modified with a power law and Zener–Hollomon parameter turned out to match very good with the actual results of the experiment. The coefficient of variation of the drawn wire diameter increased, as the draw ratio increased, which could be attributed to the occurrence of the narrow necking zone.     

Effects of microstructural evolution and intermetallic layer growth on shear strength of ball-grid-array Sn-Cu solder joints

The shear strength of ball-grid-array (BGA) solder joints on Cu bond pads was studied for Sn-Cu solder containing 0, 1.5, and 2.5 wt.% Cu, focusing on the effect of the microstructural changes of the bulk solder and the growth of intermetallic (IMC) layers during soldering at 270°C and aging at 150°C. The Cu additions in Sn solder enhanced both the IMC layer growth and the solder/IMC interface roughness during soldering but had insignificant effects during aging. Rapid Cu dissolution from the pad during reflow soldering resulted in a fine dispersion of Cu₆Sn₅ particles throughout the bulk solder in as-soldered joints even for the case of pure Sn solder, giving rise to a precipitation hardening of the bulk solder. The increased strength of the bulk solder caused the fracture mode of as-soldered joints to shift from the bulk solder to the solder/IMC layer as the IMC layer grew over a critical thickness about 1.2 m for all solders. The bulk solder strength decreased rapidly as the fine Cu₆Sn₅ precipitates coarsened during aging. As a consequence, regardless of the IMC layer thickness and the Cu content of the solders, the shear strength of BGA solder joints degraded significantly after 1 day of aging at 150°C and the shear fracture of aged joints occurred in the bulk solder. This suggests that small additions of Cu in Sn-based solders have an insignificant effect on the shear strength of BGA solderjoints, especially during system use at high temperatures.     

Binary blends of nylons with ethylene vinyl alcohol copolymers: Morphological,thermal, rheological,and mechanical behavior

Binary blends of ethylene vinyl alcohol copolymers, containing 62 (EVOH-62) and 71 (EVOH-71) mole percent vinyl alcohols, with nylons (nylon-6, nylon-6/12, and nylon-12) have been prepared from melt mixing in a twin screw compounding machine. Morphological, thermal, rheological, and mechanical properties were determined. EVOH-62/nylon-6 and EVOH-71/nylon-6 blends showed homogeneous phase morphologies in the nylon-6-rich region, and fine phase separations (c.a. 2 × 10^?7 m) in the EVOH-rich region. Melting point depression, positive deviations in viscosity and flexural modulus, and negative deviation in impact strength from the simple additive rule were generally observed. And the results were possibly interpreted in terms of compatibility and increased nylon/EVOH interactions over the nylon/nylon interactions. On the contrary, clean phase separations in large domains were observed from EVOH-71/nylon-6/12 and EVOH-71 /nylon-12 blends. Fibrillation was also obtained from EVOH rich blends. Probably due to the incompatible nature of these blends, yield at low rate of shear and a mechanical property drop were also observed.     

Photonic Crystal Palette of Binary Block Copolymer Blends for Full Visible Structural Color Encryption

Structural color (SC) arising from a periodically ordered self-assembled block copolymer (BCP) photonic crystal (PC) is useful for reflective-mode sensing displays owing to its capability of stimuli-responsive structure alteration. However, a set of PC inks, each providing a precisely addressable SC in the full visible range, has rarely been demonstrated. Here, a strategy for developing BCP PC inks with tunable structures is presented. This involves solution-blending of two lamellar-forming BCPs with different molecular weights. By controlling the mixing ratio of the two BCPs, a thin 1D BCP PC film is developed with alternating in-plane lamellae whose periodicity varies linearly from ≈46 to ≈91 nm. Subsequent preferential swelling of one-type lamellae with either solvent or non-volatile ionic liquid causes the photonic band gap of the films to red-shift, giving rise to full-visible-range SC correlated with the pristine nanostructures of the blended films in both liquid and solid states. The BCP PC palette of solution-blended binary solutions is conveniently employed in various coating processes, allowing facile development of BCP SC on the targeted surface. Furthermore, full-color SC paintings are realized with their transparent PC inks, facilitating low-power pattern encryption.     

The effects of covering on complex wave propagation in gyromagneticslotlines

The evolution of complex leaky waves in partially open gyromagnetic slotlines into complex modes in a shielded slotline is presented. Given a particular stratified gyromagnetic slotline with two sidewalls present, four types (Types I-IV) of guided structures are defined and investigated, depending upon the four possible combinations of top and bottom covers. The behavior of the complex solutions is discussed for the partially open gyromagnetic slotlines. Initially, the slotline of Type I, which lacks both top and bottom covers, shows that no coupling exists among various pairs of leaky waves. By adding only a top cover into Type I, the resultant slotline of Type II exhibits certain coupling between different sets of leaky waves. Similarly, by adding only a bottom cover into Type I, the resultant slotline of Type III shows that certain strong leaky waves of Types I and II now become weak leaky waves. From these numerical experiments, we deduce that the complex modes supported by Type IV, which is completely shielded, can be the result of the mode coupling of the two previously found leaky waves in Types II and III waveguides, respectively. Therefore, the formation of complex modes in shielded slotline is related to the effects of covering on mode coupling of the various leaky waves of the partially open slotlines     

Room‐Temperature Metallic Fusion‐Induced Layer‐by‐Layer Assembly for Highly Flexible Electrode Applications

To fabricate flexible electrodes, conventional silver (Ag) nanomaterials have been deposited onto flexible substrates, but the formed electrodes display limited electrical conductivity due to residual bulky organic ligands, and thus postsintering processes are required to improve the electrical conductivity. Herein, an entirely different approach is introduced to produce highly flexible electrodes with bulk metal–like electrical conductivity: the room‐temperature metallic fusion of multilayered silver nanoparticles (NPs). Synthesized tetraoctylammonium thiosulfate (TOAS)‐stabilized Ag NPs are deposited onto flexible substrates by layer‐by‐layer assembly involving a perfect ligand‐exchange reaction between bulky TOAS ligands and small tris(2‐aminoethyl)amine linkers. The introduced small linkers substantially reduce the separation distance between neighboring Ag NPs. This shortened interparticle distance, combined with the low cohesive energy of Ag NPs, strongly induces metallic fusion between the close‐packed Ag NPs at room temperature without additional treatments, resulting in a high electrical conductivity of ≈1.60 × 10⁵ S cm^?1 (bulk Ag: ≈6.30 × 10⁵ S cm^?1). Furthermore, depositing the TOAS–Ag NPs onto cellulose papers through this approach can convert the insulating substrates into highly flexible and conductive papers that can be used as 3D current collectors for energy‐storage devices.     

Admissibility and stabilization of singular continuous 2D systems described by Roesser model

Multidimensional Systems and Signal Processing - The paper considers first, the admissibility conditions for continuous 2D systems represented by Roesser model by dealing with non-strict LMIs....     

Experimental study on the life prediction of servo motors through model-based system degradation assessment and accelerated degradation testing

The advent of smart factories has resulted in the frequent utilization of industrial robots within factories to increase production automation and efficiency. Due to the increase in the number of industrial robots, it has become more important to prevent any unexpected breakdowns of the factory. As a result, the lifespan prediction of machinery has become a crucial factor because such failures can be directly associated with factory productivity resulting in significant losses. Most of the failures occur within one of the core components of the robot arm, the servo motor, and thus we will focus on the analysis of the servo motor in this study. However, sensor attachment to such equipment is considered difficult due to the dynamic movement of the robot arm, meaning that internal instrumentation should be utilized during analysis. In addition, no definite measure to determine the degradation of the motor exists, and thus a new degradation index is proposed in this study. Therefore, in this study, the lifespan of the servo motor will be estimated through accelerated degradation testing methods based on a new system degradation assessment method, which estimates the fault of the system using observer-based residuals with encoder data obtained from internal instrumentation.