Numerical simulation of characteristics of near-field microstrip probe having pyramidal shape

A pyramid-type microstrip probe (PTMP) with metal tips is proposed for scanning near-field microscopes to obtain high spatial resolution of a few nanometers and high optical efficiency. Properties of an ordinary PTMP and the PTMP with a single metal tip are investigated by using a rigorous finite-integral technique simulation (MICROWAVE STUDIO package) and analyzing characteristics of working modes of the probe. Numerical simulation has demonstrated that an ordinary PTMP and the PTMT with a single metal tip exhibit large far- and near-transmission coefficients, field enhancement, and high spatial resolution. These high parameters imply that both types of microstrip probe may be utilized for optical and magnetic data storage, nanolithography, and other types of nanotechnology that use light for modification of a thin surface layer.     

Comparative studies of parameters calibration for focused ion beam deposition

This paper describes the interaction between operating parameters of target wafer surface. We use an organometallic (C) precursor gas in the focused ion beam deposition process. Under the beam intensity conditions (30kV), the influences of the on-target beam control parameters, such as dwell time, beam spacing, minimum frame time and scan type, were investigated by the deposition tests. The analysis was carried out with the variation of dimensions and shapes of the single pattern. The operating parameters considered in this research are implemented in the next double-patterning deposition. The test presented how their interaction appeared on the processing results. The analysis configured out the FIB induced deposition of single pattern with the variation of operating parameters. Additionally the result shows that the sequent beam job influenced the double-patterning deposition significantly. On-beam target conditions should be optimized for the target complicated shapes and high aspect-ratios     

A threshold-based thinning algorithm for a visual,automated snow-cover measurement system

An automated snow-cover measuring system is developed to measure the amount of snowfall by analyzing the visual image of a reference pole under an unstructured outdoor environment. The system consists of a reference pole, a CCD camera (including an infra-red module), and a PC which transfers the processed information to remote users via the Internet. The snow depth is estimated based on the lowest uncovered position of the pole with the captured image. After correcting the image distortion through an expansive coefficient curve, the corrected image is compared to a virtual measuring scale (VMS) for the accurate measurement. To enhance the visual measurement process, the captured images are pre-processed and the camera is calibrated for the natural outside light condition of the varied weather. The snow-cover measuring (SCM) algorithm is used to detect the height of the piled snow. This measuring system can also continuously transfer the raw images, as well as the estimated snow depth to remote clients through the Internet. The experimental results show that the system improves the reliability and accuracy of the measurement, and that it is convenient to use.     

Creep behavior of undoped and La–Nb codoped PZT based micro-piezoactuators for micro-optical modulator applications

Time-dependent deformation (creep) behaviors of piezoelectric microactuators have been investigated. Position (or gap height) drift of microbridged actuator beam and its displacement amplitude change with time could be attributed to the anelastic behavior of the driving unit itself based on lead zirconate titanate (PZT) in the actuator, and as well as to the mechanical stress states established in the microactuator beam after the surface release of the micromachined actuator structure. From creep analyses of a simple microcantilever and microbridge beam structures, it was turned out that the overall creep behavior in microbridged piezoactuator structure was mainly dependent on the actuator beam initial deflection configuration governed both by residual stress of the actuating part Pt/PZT/Pt stack and the stress gradient through the silicon nitride (SiNx) microbridge beam.