IEEE-PES Transmission and Distribution Conference and Exposition Call for Papers

Static network-related system voltage stability margin (VSM) depends on the availability of reactive power to support the transport of real power from sources to sinks. Based on this premise, the total VAr loss is minimized in the unified OPF framework considering real and reactive power controllers, and its effect on VSM is studied. Studies are conducted on a three-bus system, the IEEE 30-bus system, and a 191-bus Indian electric power system, and their results are reported.     

Evaluation of hot hardness and creep of a 350 grade commercial maraging steel

The hardening response and the indentation creep of a 350 grade commercial maraging steel were evaluated using a hot hardness tester. The hardness versus temperature plot exhibited three distinct regions. Hardness response was noted between 500–800 K. The unusually high values of activation energy and stress exponent obtained during the creep experiment could be rationalized by a novel concept of introducing a back stress term in the indentation creep relation. The corrected value of the activation energy was found to be reasonably in agreement with the activation energy for diffusion of Ni in iron. Results are supplemented with microstructural observation.     

Matching and Interpolation of Shapes using Unions of Circles

While the notion of shape of an object is very intuitive, its precise definition is very elusive, and defining a useful metric for the shape distance between objects is a difficult endeavor. At the same time many successful techniques have been developed which interpolate between two objects, so in essence interpolate between shapes. W e present here work which uses a representation of objects as union of circles to define a distance between two objects and to base a method to interpolate between the two. This method can be used in a totally automatic fashion (that is, without any user intervention), or users can guide a pre-registration phase as well as a segmentation phase, after which the matched segments are interpolated pair-wise. The union of circles representation of the two objects is obtained from the Delaunay triangulation of their boundary points. The circles can be simplified to obtain smaller data sets. The circles are then optimally matched according to a distance metric between circles which is a function of their position, size, and feature, that is, a local configuration of circles. The interpolation between the two objects is then obtained by interpolating between the matched pairs of circles (the interpolations can be affine or non -affine). Examples with simple and more complex objects show how the technique can give results which correspond closely to the human notion of shape interpolation. The interpolations shown include some between a calf and a cow and between a cow and a giraffe. The examples given are in two dimensions, but all the steps except the segmentation have been implemented as well for three dimensional objects. W e also show the results of computation of distances between the objects used in our examples.     

Fermi-Level Pinning in Nanocrystal Memories

The nanocrystal (NC) work-function engineering, which plays an important role on the NC memory characteristics such as memory window and retention time, were long regarded as a matter of choice on NC materials. In this letter, we report opposite polarities of charge storage in Au NC memories with different control oxides. The effective NC work function is found to be not only a bulk property of the NC, but also governed by the interface with surrounding dielectric, as a result of the Fermi-level pinning. By replacing Au NCs with C₆₀ molecules, we also show the pinning effect generally exists at quantum-dot-based devices with high density of interface states. This fundamental interface property should be taken into account in the selection of NC and dielectric materials for the NC memory optimization     

Long Duration Persistent Photocurrent in 3 nm Thin Doped Indium Oxide for Integrated Light Sensing and In-Sensor Neuromorphic Computation

Miniaturization and energy consumption by computational systems remain major challenges to address. Optoelectronics based synaptic and light sensing provide an exciting platform for neuromorphic processing and vision applications offering several advantages. It is highly desirable to achieve single-element image sensors that allow reception of information and execution of in-memory computing processes while maintaining memory for much longer durations without the need for frequent electrical or optical rehearsals. In this work, ultra-thin (<3 nm) doped indium oxide (In₂O₃) layers are engineered to demonstrate a monolithic two-terminal ultraviolet (UV) sensing and processing system with long optical state retention operating at 50 mV. This endows features of several conductance states within the persistent photocurrent window that are harnessed to show learning capabilities and significantly reduce the number of rehearsals. The atomically thin sheets are implemented as a focal plane array (FPA) for UV spectrum based proof-of-concept vision system capable of pattern recognition and memorization required for imaging and detection applications. This integrated light sensing and memory system is deployed to illustrate capabilities for real-time, in-sensor memorization, and recognition tasks. This study provides an important template to engineer miniaturized and low operating voltage neuromorphic platforms across the light spectrum based on application demand.     

Clock Distribution Methodology for PowerPC? Microprocessors

Clock distribution design for high performance microprocessors has become increasingly challenging in recent years. Design goals of state-of-the-art integrated circuits, dictate the need for clock networks with smaller skew tolerances, large sizes, and lower capacitances. In this paper we discuss some of the issues in clock network design that arise in this context. We describe the clock design methodology and techniques used in the design of clock distribution networks for PowerPC microprocessors that aim at alleviating some of these problems.     

Estimation of reliability of stress-strength model with non-identical component strengths

An attempt has been made in this paper to estimate the reliability of an s-out-of-k system with non-identical component strengths when component strengths follow an exponential distribution. A further assumption is made that all the components are subjected to a common random stress which also follow an exponential distribution. Bayes and maximum likelihood estimators of such system reliability are considered. A Bayes estimate is obtained by using Lindley's approximation. Comparisons are made on the basis of efficiency and Pitman nearness probability through a Monte-Carlo study.     

Clock Distribution Methodology for PowerPC™ Microprocessors

Clock distribution design for high performance microprocessors has become increasingly challenging in recent years. Design goals of state-of-the-art integrated circuits, dictate the need for clock networks with smaller skew tolerances, large sizes, and lower capacitances. In this paper we discuss some of the issues in clock network design that arise in this context. We describe the clock design methodology and techniques used in the design of clock distribution networks for PowerPC? microprocessors that aim at alleviating some of these problems.

     

Characteristics of microstrip transmission lines withhigh-dielectric-constant substrates

An efficient numerical code is developed from a full-wave analysis in the Fourier transform domain to determine the characteristics of a single-strip or multistrip coplanar transmission line. Modes of both even and odd symmetries are included. The impedance of the transmission line is calculated using the power-current equivalent model. Coupling constants between the even and the odd modes are also calculated. Results are provided for a shielded two-strip coupled microstrip transmission line on high-dielectric-constant substrate such as lanthanum aluminate with applications to superconducting transmission lines