A novel cross-shape DGS applied to design ultra-wide stopband low-pass filters

This letter presents a novel low-pass filter with an ultra-wide stopband. The proposed filter is comprised of a new cross-shape defected ground structure (CSDGS). By using this structure, the filter not only supports conventional DGS performances with a sharp rejection, but also exhibits an ultra-wide stopband. For the deigned low-pass filter, an insertion loss of less than 2dB from dc to 3.5GHz and the rejection is better than 20dB from 4.3 to 15.8GHz. Predicted performances show widened and deepened stopband beyond the low passband. Furthermore, it is confirmed by measurement.     

A PCB-compatible 3-dB coupler using microstrip-to-CPW via-hole transitions

A 3-dB coupler by implementing microstrip-to-coplanar waveguide (CPW) via-hole transitions is proposed. The proposed coupler, with the advantages of wider coupled line widths and spacing without using any bonding wires, can eliminate the uncertain factors of conventional Lange couplers caused by the printed circuit board (PCB) manufacturing processes. The proposed coupler can be easily fabricated on a single-layer PCB substrate instead of using multilayer substrates. Good agreements between the simulation and the measurement in the frequency range from 0.45 to 5 GHz can be achieved. The measured results at the center frequency of 2.4 GHz have the return loss better than -15dB; the insertion loss of coupled and direct ports is about 3/spl plusmn/ 0.2dB and the relative phase difference of 89/spl plusmn/0.3/spl deg/. The dimension of the coupler is 3.1cm /spl times/ 1.8cm.     

The formation of a SiOx interfacial layer on low-k SiOCH materials fabricated in ULSI application

The characterizations of SiOCH films using oxygen plasma treatment depends linearly on the O₂/CO flow rate ratio. According to the results of Fourier transform infrared spectroscopy (FTIR) and X-ray photoelectron spectroscopy (XPS) analyses, it was found that the carbon composition decreases with increasing O₂/CO flow rate ratio, because more carbon in the Si–O–C and Si–CH₃ bonds on the film surface would be converted by oxygen radicals. It was believed that the oxygen plasma could oxidize the SiOCH films and form a SiO_x interfacial capping layer without much porosity. Moreover, the result of FTIR analysis revealed that there was no water absorbed on the film. A SiO₂-like capping layer formed at the SiOCH film by the O₂/CO flow rate ratio of 0.75 had nearly the same dielectric properties from the result of capacitance–voltage (C–V) measurement in our research.     

A DC model for asymmetric trapezoidal gate MOSFET's in stronginversion

Asymmetric trapezoidal gate (ATG) MOSFET is an innovative device having a structure of a relatively narrow drain-side width in order to reduce parasitic effects for enhancing device performance. In this paper, we develop a DC model for ATG MOSFET's. We use a charge-based approach to explore the asymmetric feature between source and drain of ATG MOSFET's, and obtain analytic formulae for threshold voltage, body effect, drain current, and channel length modulation effect in linear and saturation regions for both forward and reverse modes of operations. The model provides a physical analysis of the ATG structure, shows good agreement with measurement data, and is useful in circuit simulation with ATG devices     

An investigation of molecular beam epitaxy “in-situ” grown Ag/GaAs schottky diodes

Electrical properties of molecular beam epitaxy “in-situ” grown Ag on (001) GaAs Schottky diodes were investigated. X-ray rocking curves show a (111) main peak for “in-situ” Ag grown at low temperature. During annealing, the main peak of Ag rotates from (111) to (200) to closely match that of the underlying GaAs lattice. The barrier height, 0.991 eV (determined by C-V measurement), decreases whereas doping concentration increases with increasing annealing temperature. Interdiffusion and the formation of some compound phases were also observed during annealing. A simple model, in which Ga dissociates from GaAs resulting in an increase in uncompensated ions at the metal-semiconductor interface, is proposed to explain the observation that carrier concentrations increase after annealing.     

Influence of annealing ambient on GaAs oxide prepared by the liquid phase method

The characteristics of GaAs native oxides prepared by the liquid phase chemical-enhanced oxidation technique annealed at various ambiences including N₂, O₂, and mixture of N₂ (85%) and H₂ (15%) are investigated. The annealing temperatures range from 300 to 700 °C. The shrinkage of oxide film thickness, the increase of refractive index, the decrease of surface roughness, the enhancement of breakdown field strength and the reduction of leakage current have been obtained for all annealing conditions, except for annealing in the ambient atmosphere of N₂ or O₂ at temperature of 700 °C. It is found that annealed oxide films exhibited better thermal stability in an atmosphere of N₂/H₂ up to an annealing temperature of 700 °C. This is due to the existence of H atoms in the oxide films as demonstrated by SIMS depth profiles.     

N-shaped negative differential resistance in a transistor structurewith a resistive gate

Voltage-controlled negative differential resistance (NDR) characteristics in a N-AlGaAs/p⁺-GaAs/n-GaAs transistor structure are proposed and demonstrated. The gate, made using self-aligned p-type diffusion, is placed in the n-GaAs collector layer instead of the p⁺-GaAs base layer, resulting in a so-called resistive gate. For a fixed gate voltage, the device current is modulated by the applied anode voltage. Under appropriate gate voltage with respect to the anode, the device shows good voltage-controllable NDR characteristics, including large peak-to-valley current ratios (PTV's) and a voltage extension in the N-shaped curve which is equivalent to the common-emitter breakdown voltage in a transistor. A numerical model based on the transistor model for the carrier transport in this device, taking account of the influence of the applied anode voltage on the gate, is proposed. The experimental results show large room temperature PTV's (e.g., 140 at a gate bias of 1.5 V) and large voltage extension in N-shaped curves (about 9 V). Reasonable agreement between theoretical and experimental results is observed     

Investigation of negative differential resistance phenomena inGaSb/AlSb/InAs/GaSb/AlSb/InAs structures

The negative differential resistance (NDR) phenomena were observed in GaSb/AlSb/InAs/-GaSb/AlSb/InAs resonant interband tunnel structures. Electrons have resonantly achieved interband tunneling through the InAs/GaSb broken-gap quantum well. The InAs well width causes significant variations of the peak current density and NDR behaviors. The peak current density varies exponentially with the AlSb barrier thickness. The multiple NDR behavior was observed with appropriate InAs well and AlSb barrier thicknesses, e.g., 30 Å thick AlSb barrier and 240 Å wide InAs well. Only single negative resistance has, otherwise, been seen. The three-band model was used to interpret the effect of the InAs well and AlSb barrier on the current-voltage characteristics of GaSb/AlSb/InAs/GaSb/AlSb/InAs structures     

Direct bonding of recessed-structure SAW filter on silicon substrate

A procedure for fabricating a recessed surface acoustic wave (SAW) device coupled with silicon substrate is reported. The recessed structure is stable and rugged enough against the bonding process, and it can be applied to integrate a semiconductor device into one chip by a direct bonding technique. In this paper, the tensile strength of silicon (Si)-to-recessed-SAW filter is measured, and the performance of the device is discussed.