Developing conductive immiscible polystyrene/polypropylene blends with a percolated conducting polyaniline/polyamide filler by tuning its specific interactions with the styrene-based triblock compatibilizer grafted with maleic anhydride

An approach to induce conductivity in immiscible polystyrene/polypropylene (PS/PP) blends is described using a percolated conducting polyaniline/polyamide (PANI/PA) filler combined with a polystyrene-block-poly(ethylene-ran-butylene)-block-polystyrene-graft-maleic anhydride compatibilizer. The approach is based on the ability of the compatibilizer to concomitantly stabilize the cocontinuous morphology and to improve the state of dispersion of the PANI/PA filler. Selective localization of PANI/PA in the PS phase with improved filler dispersion is achieved with the optimal master batch (MB) preparation technique followed by its optimized sequence addition to the blend components. This results in an increase in the dc conductivity by six decades as compared with that of the neat compatibilized blend at an effective 4.8-wt % PANI concentration. An investigation of the effect of functionality and concentration of the filler and the compatibilizer on the filler connectivity in the blend is performed. The prevailing specific interactions are analyzed by Fourier transform infrared spectroscopy and thermogravimetric analysis of the MBs. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2020 , 137, 48433.     

The effect of curing temperature on thermal,physical and mechanical characteristics of two types of adhesives for aerospace structures

The effects of cure temperatures on the thermal, physical and mechanical characteristics of two types of thermosetting structural epoxy film adhesives were determined in detail. The aim of this paper is to assess the effect of cure temperatures (82–121 °C) on the degree of cure of the two adhesives and the relevant void formations that need to be addressed in bonded part production and repair. Two thermal parameters were used to characterize the advancement of the reaction, such as degree of cure and glass transition temperature. The joint properties with respect to the cure temperatures were characterized by void content and bond-line thickness measurements and lap shear strength tests. Experimental results presented that all lap shear strengths were well within minimum shear strength (29 MPa) required by the specification of the film-type adhesive. However, the lap shear strength testing after aging at 82 °C and 95%R.H for 1000 h showed that the improved durability when the adhesive is cured at 121 °C did not occur for the 82 °C cure. Low curing conversion (75–77% degree of cure) combined with high voids (over 2 areal%) has a catastrophic effect on the bonding qualities at the metal-adhesive interface and due to lack of cohesion in the adhesive. The changes in the interface caused by the low temperature curing may contribute to an increased susceptibility of the bonded joint to moisture and consequent bond-line degradation.     

Crystallization of Bismuth Borosilicate-Based Dielectric Thick Films on a LiZn Ferrite Substrate

The compatibility and crystallization of dielectric thick films, consisting of a bismuth borosilicate glass and crystalline cordierite, on a LiZn ferrite substrate were investigated by focusing on phase development and microstructural changes. Significant diffusion of Li and Fe from the substrate to the dielectric was confirmed as unexpected crystalline phases such as Li₂Al₂Si₃O₁₀ and Fe₂O₃ were found in the thick films fired at 850°C. The crystallization was believed to be initiated from the film interface and developed further toward the film surface as evidenced from cross-sectional microstructures of the films with additional firings. The degree of crystallization and the relative contents of the observed phases were dependent on the ratio between the glass and cordierite and the number of refirings.     

Characterization of Cu(In,Ga)Se2 thin films prepared by RF magnetron sputtering using a single target without selenization

Cu(In_1?xGa_x)Se₂ (CIGS) thin films were prepared using a single quaternary target by RF magnetron sputtering. The effects of deposition parameters on the structural, compositional and electrical properties of the films were examined in order to develop the deposition process without post-deposition selenization. From X-ray diffraction analysis, as the substrate temperature and Ar pressure increased and RF power decreased, the crystallinity of the films improved. The scanning electron microscopy revealed that the grains became uniform and circular shape with columnar structure with increasing the substrate temperature and Ar pressure, and decreasing the RF power. The carrier concentration of CIGS films deposited at the substrate temperature of 500 °C was 2.1 × 10¹⁷ cm^?3 and the resistivity was 27 Ω cm. At the substrate temperature above 500 °C, In and Se contents in CIGS films decreased due to the evaporation and it led to the deterioration of crystallinity. It was confirmed that CIGS thin films deposited at optimal condition had similar atomic ratio to the target value even without post-deposition selenization process.     

Flame propagation enhancement by plasma excitation of oxygen. Part I: Effects of O3

The thermal and kinetic effects of O₃ on flame propagation were investigated experimentally and numerically by using C₃H₈/O₂/N₂ laminar lifted flames. Ozone produced by a dielectric barrier plasma discharge was isolated and measured quantitatively by using absorption spectroscopy. Significant kinetic enhancement by O₃ was observed by comparing flame stabilization locations with and without O₃ production. Experiments at atmospheric pressures showed an 8% enhancement in the flame propagation speed for 1260 ppm of O₃ addition to the O₂/N₂ oxidizer. Numerical simulations showed that the O₃ decomposition and reaction with H early in the pre-heat zone of the flame produced O and OH, respectively, from which the O reacted rapidly with C₃H₈ and produced additional OH. The subsequent reaction of OH with the fuel and fuel fragments, such as CH₂O, provided chemical heat release at lower temperatures to enhance the flame propagation speed. It was shown that the kinetic effect on flame propagation enhancement by O₃ reaching the pre-heat zone of the flame for early oxidation of fuel was much greater than that by the thermal effect from the energy contained within O₃. For non-premixed laminar lifted flames, the kinetic enhancement by O₃ also induced changes to the hydrodynamics at the flame front which provided additional enhancement of the flame propagation speed. The present results will have a direct impact on the development of detailed plasma-flame kinetic mechanisms and provided a foundation for the study of combustion enhancement by O₂(a¹Δ_g) in part II of this investigation.     

Characteristics of gas-liquid chromatography

The effects of sample size, liquid loading, particle size, column length, and column temperature on retention volumes were studied and separation factor, column efficiency, partition coefficient, and heat of solution were also obtained by gas-liquid chromatography. The feed materials were chosen by similar boiling points as diethylether, dimethoxymethane and dichloromethane. The relations between retention volume and above mentioned various variables were obtained. Separation factor was more affected by column temperature than other variables, and decreased with the temperature. HETP increased almost linearly with sample size. From the exponential relationship between partition coefficient and column temperature heat of solution of each material was calculated.     

The effects of solution properties and polyelectrolyte on electrospinning of ultrafine poly(ethylene oxide) fibers

The effects of solution properties and polyelectrolyte on the electrospinning of poly(ethylene oxide) (PEO) solutions were investigated. Ultrafine PEO fibers without beads were electrospun from 3, 4, 7 and 7 wt% PEO solutions in chloroform, ethanol, (dimethylformamide) DMF and water, respectively. At these concentrations, the values of [η]C were ∼10 for all solutions. The average diameters of PEO fibers were ranged from 0.36 to 1.96 μm. The higher the dielectric constant of solvent was, the thinner PEO fiber was. The average diameters of electrospun PEO fibers from PEO/water solutions were decreased and their distributions were narrowed by adding 0.1 wt% poly(allylamine hydrochloride) (PAH) and poly(acrylic acid sodium salt) (PAA) due to the increased charge density in solutions. The addition of PAH and PAA lowered the minimum concentration for electrospinning of a PEO/water solution to 6 wt%.     

Preparation of high molecular weight poly(vinyl pivalate) with high yield and high molecular weight poly(vinyl alcohol) by emulsion polymerization of vinyl pivalate and saponification

To prepare high molecular weight (HMW) poly(vinyl pivalate) (PVPi) with high yield and high linearity which is a promising precursor for syndiotactic poly (vinyl alcohol) (PVA), vinyl pivalate (VPi) was emulsion polymerized, using 2,2′‐azobis(2‐amidinopropane) dihydrochloride (AAPH) as an initiator and sodium dodecyl sulfate (SDS) as an emulsifier. The effect of the polymerization conditions on the conversion, molecular weight, and degree of branching was investigated. PVA with maximum number‐average degree of polymerization (P_n) of 6200 could be prepared by complete saponification of PVPi, with P_n of 13,300–16,700 obtained at polymerization temperature of 50°C, using SDS and AAPH concentration of 2.0 × 10^?3 mol/L of water and 1.0 × 10^?3 mol/L of water, respectively, and the maximum conversion was about 90%. From the emulsion polymerization of VPi, spherical PVPi with high yield was effectively prepared, which might be useful for the precursor of syndiotactic PVA micro‐ and nano‐spheres with various surface properties. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 104: 410–414, 2007     

Preparation of hydroxyapatite/poly(vinyl alcohol) composite film with uniformly dispersed hydroxyapatite particles using citric acid

Biocompatible hydroxyapatite (HA)/poly(vinyl alcohol) (PVA) composites and their transparent films were prepared by the coprecipitation and solvent casting method. The formation of HA in PVA composite powder was confirmed by the characteristic phosphate bands at 1100–1032 and 565 cm^?1 at FT‐IR spectra, and the weight ratio of HA to PVA was 50/50 examined by TGA. The crystal melting temperature of HA/PVA decreased compared with that of pure PVA. HA/PVA (50/50) composite powder and pure PVA were dissolved in dimethyl sulfoxide to obtain a film with HA/PVA weight ratio of 10/90. To improve HA particles' dispersity, which is one of the major factors affecting the mechanical properties of composite materials, various contents of citric acid were used for the preparation of HA/PVA films. At a citric acid concentration of 5 wt %, HA/PVA film with good dispersity of HA particles was obtained. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2007     

High thermal conductivity of spark plasma sintered silicon carbide ceramics with yttria and scandia

A fully dense SiC ceramic with a room‐temperature thermal conductivity of 262 W·(m·K)^?1 was obtained via spark plasma sintering β‐SiC powder containing 0.79 vol% Y₂O₃‐Sc₂O₃. High‐resolution transmission electron microscopy revealed two different SiC‐SiC boundaries, that is, amorphous and clean boundaries, in addition to a fully crystallized junction phase. A high thermal conductivity was attributed to a low lattice oxygen content and the presence of clean SiC‐SiC boundaries.