Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

On the convergence of the inverses of Toeplitz matrices and its applications

Many issues in signal processing involve the inverses of Toeplitz matrices. One widely used technique is to replace Toeplitz matrices with their associated circulant matrices, based on the well-known fact that Toeplitz matrices asymptotically converge to their associated circulant matrices in the weak sense. This often leads to considerable simplification. However, it is well known that such a weak convergence cannot be strengthened into strong convergence. It is this fact that severely limits the usefulness of the close relation between Toeplitz matrices and circulant matrices. Observing that communication receiver design often needs to seek optimality in regard to a data sequence transmitted within finite duration, we define the finite-term strong convergence regarding two families of matrices. We present a condition under which the inverses of a Toeplitz matrix converges in the strong sense to a circulant matrix for finite-term quadratic forms. This builds a critical link in the application of the convergence theorems for the inverses of Toeplitz matrices since the weak convergence generally finds its usefulness in issues associated with minimum mean squared error and the finite-term strong convergence is useful in issues associated with the maximum-likelihood or maximum a posteriori principles.     

脉冲式半导体激光器准直光学系统的设计

根据具体的探测环境和探测精度,通过理论分析,提出了脉冲式半导体激光器准直光束的单透镜设计方法和柱面透镜的设计方法,并且给出了具体的设计参数。可以获得高斯光束的准直发散角为1.48mrad;高斯光束的腰粗为0.325mm。     

户式中央空调的节能研究

对户式中央空调系统节能问题作了研究,从住宅建筑空调负荷的计算特点和方法、系统主机容量的确定、末端设备的选择到系统调节特性等诸多方面,综合考虑,并结合实际工程,阐述了影响户式中央空调能量消耗的各种主要因素和改进措施.     

闪光灯泵浦Nd3+:GGG激光特性研究

用闪光灯泵浦掺钕钆镓石榴石(Nd^3 ：GGG)激光晶体，研究了脉冲宽度0．5ms、1ms、1．5ms和2ms的放电泵浦下激光输出，实验获得了1．92J的最大激光能量．     

Al、Mo含量对铸造钛合金力学性能的影响

运用正交实验 ,考察了Al、Mo含量对Ti Al Mo 1Zr系铸造钛合金力学性能的影响。试验结果表明 :随Al、Mo含量提高 ,铸造合金的强度增加 ,塑性和冲击韧性降低 ,但Al、Mo的交互作用却使合金塑性提高 ,强度和冲击韧性降低     

草酸钙在硫酸软骨素自组装膜上周期沉淀的研究

利用硫酸软骨素(chondroitin sulfate，CS)在云母基底上通过浇铸法制备的自组装膜为基底，诱导草酸钙在其上的凝集生长。发现当硫酸软骨素的浓度为1．Omg／ml时在该膜体系中可形成规整的周期性草酸钙环状沉淀。这种有序的环状结构可能是耗散结构的一种具体表现形式。利用原子力显微镜(atomic forcemicroscope，AFM)和傅立叶红外光谱仪对这种结构进行了表征，实验结果显示合适浓度下形成的CS膜在一定程度上可以抑制草酸钙的凝集结晶，表明高分子基质与无机离子间强烈的相互作用对无机盐的成核结晶有显著影响，为探讨结石的形成与抑制提供了一定的实验依据。     

高温酸化助排剂HC2-1的研究

为了满足高温油藏和深井酸化作业残酸返排的需要，通过表面活性剂的筛选和复配研究，得到了高温酸化助排剂HC2—1。其性能评价结果表明，HC2—1具有使用浓度低、表面活性高的特点，在20％的HCI溶液中，当其浓度为50mg／L时，表面张力为20．7mN／m；具有良好的耐温性能，在180℃下恒温48h，HC2—1仍保持较高的表面活性；具有良好的耐盐能力，加有HC2—1的20％HCl溶液和CaCO3反应至HCl完全消耗，整个反应过程体系无新相生成且表面张力基本不变；可增大酸液体系的润湿角，进一步降低毛细管阻力，使酸液返排率由46％提高到97％，在促进酸液返排的同时与原油不发生乳化反应。     

视频流无缝拼接中的帧转换

帧转换在MPEG-2视频流无缝拼接中有着非常重要的作用。文中就压缩域视频流的无缝拼接中的帧转换技术进行了深入的分析。文中以12帧IBBP结构的GOP为例分析了拼接点处应采用的帧转换方案,在此基础上给出帧转换的具体实现,并通过一个帧转换实验对之进行了验证。     

珠光体球化的分形研究

珠光体球化反映到金相上，是一种不规则图像的变化，并且具有分形的特征，可望用分形几何的方法来进行描述。以Cr-Mo钢的珠光体球化为例，用分形维数来描述珠光体球化程度；用小岛法对15CrMo钢的珠光体球化图谱进行了测量。实验表明，珠光体球化从1级到6级，其相应的分形维数范围为1.3156-1.9282。从电厂运行了10^5h的15CrMo钢管上取样，实测了该试样的珠光体球化等级，结果表明，以分形维数表示的球化程度与按图谱评定的球化等级完全吻合。