Merocyanine/C60 Planar Heterojunction Solar Cells: Effect of Dye Orientation on Exciton Dissociation and Solar Cell Performance

In this study the charge dissociation at the donor/acceptor heterointerface of thermally evaporated planar heterojunction merocyanine/C₆₀ organic solar cells is investigated. Deposition of the donor material on a heated substrate as well as post‐annealing of the complete devices at temperatures above the glass transition temperature of the donor material results in a twofold increase of the fill factor. An analytical model employing an electric‐field‐dependent exciton dissociation mechanism reveals that geminate recombination is limiting the performance of as‐deposited cells. Fourier‐transform infrared ellipsometry shows that, at temperatures above the glass transition temperature of the donor material, the orientation of the dye molecules in the donor films undergoes changes upon annealing. Based on this finding, the influence of the dye molecules’ orientations on the charge‐transfer state energies is calculated by quantum mechanical/molecular mechanics methods. The results of these detailed studies provide new insight into the exciton dissociation process in organic photovoltaic devices, and thus valuable guidelines for designing new donor materials.     

Preparation of Ring-Shaped Thermoelectric Legs from PbTe Powders for Tubular Thermoelectric Modules

Waste heat recovery—for example, in automotive applications—is a major field for thermoelectric research and future application. Commercially available thermoelectric modules are based on planar structures, whereas tubular modules may have advantages for integration and performance in the field of automotive waste heat recovery. One major drawback of tubular generator designs is the necessity for ring-shaped legs made from thermoelectric material. Cutting these geometries from sintered tablets leads to considerable loss of thermoelectric material and therefore high cost. Direct sintering of ring-shaped legs or tubes of thermoelectric material is a solution to this problem. However, sintering such rings with high homogeneity and density faces some difficulties related to the mechanical properties of typical thermoelectric materials such as lead telluride (PbTe)—particularly brittleness and high coefficient of thermal expansion. This work shows a process for production of thermoelectric rings made of p- and n-doped PbTe. Long tubes of PbTe have been sintered in a current-assisted sintering process with specially designed sintering molds, coated with a diffusion barrier, and finally cut into ring-shaped slices. To demonstrate the technology, a tubular thermoelectric module has been assembled using these PbTe rings.     

Recent Advances in Birefringence Studies at THz Frequencies

In the last few years, various studies on terahertz (THz) birefringence have been presented, based on polarization-sensitive THz time-domain spectroscopy. The field of THz birefringence is a wide one covering several aspects, such as different materials exhibiting THz birefringence, polarization-sensitive THz technology, as well as numerous methods for extracting the birefringence properties of a sample from the THz data. Therefore, this paper aims at reviewing recent results on THz birefringence measurements presented in literature, addressing the above aspects and giving an overview of the topic. Moreover, it will focus on the investigation of birefringent fibrous samples, where specific results will be discussed in detail. Altogether, this paper should give a comprehensive view on the recent achievements in the measurements of THz birefringence.     

Impact of traffic localization on communication rates in ad-hoc networks

The effect of traffic distribution on communication rates and receiver complexity in ad-hoc networks is addressed, considering a network with constant density of users and a certain traffic model. Information theoretic upper bounds on communication rates are derived under an assumption that transmitting nodes as well as receiving nodes cooperate. It is shown that for the case of large signal attenuation the bounds hold even when the cooperation among users is limited to a certain region of the network domain. Furthermore, achievability bounds on communication rates are derived. The bounds rely on two proposed local cooperation strategies. A comparison shows that the upper bounds are tight and closely follow the achievability results. Finally, the impact of traffic localization on the receiver complexity is addressed.     

Scaling of analog LDPC decoders in sub-100 nm CMOS processes

Analog implementations of digital error control decoders, generally referred to as analog decoding, have recently been proposed as an energy and area competitive methodology. Despite several successful implementations of small analog error control decoders, little is currently known about how this methodology scales to smaller process technologies and copes with the non-idealities of nano-scale transistor sizing. A comprehensive analysis of the potential of sub-threshold analog decoding is examined in this paper. It is shown that mismatch effects dominated by threshold mismatch impose firm lower limits on the sizes of transistors. The effect of various forms of leakage currents is also investigated and minimal leakage current to normalizing currents are found using density evolution and control simulations. Finally, the convergence speed of analog decoders is examined via a density evolution approach. The results are compiled and predictions are given which show that process scaling below 90 nm processes brings no advantages, and, in some cases, may even degrade performance or increase required resources.     

SCR operation mode of diode strings for ESD protection

Diodes and diode strings in 90 nm and beyond technologies are investigated by measurement and device simulation. After a thorough calibration, the device simulator is utilised to achieve a better understanding and an enhanced device performance of diode strings under static and transient ESD conditions. Thereto, parasitic transistors and a so far neglected parasitic thyristor (SCR) in the diode string are regarded, exploited and optimised.     

Cooperative Distributed MIMO Channels in Wireless Sensor Networks

The large number of network nodes and the energy constraints make Wireless Sensor Networks (WSN) one of the most important application fields for Cooperative Diversity. Node cooperation increases the spatial diversity of wireless channels and, thus, reduces the transmitted power. In this paper, we propose a multi-hop WSN with nodes grouped in cooperative clusters that exploits transmit and receive cooperation among cluster nodes. Multi-hop transmission is carried out by concatenating single cluster-to-cluster hops, where every cluster-to-cluster link is defined as a cooperative distributed multiple-input-multiple-output (MIMO) channel. Transmit diversity is exploited through a time-division, decoder-and-forward, relaying scheme based upon two time slots: the Intracluster Slot, used for data sharing within the cluster, and the Intercluster Slot, used for transmission between clusters. At the receiver side, a distributed reception protocol is devised based upon a Selection Diversity algorithm. The proposed multi-hop cooperative WSN is optimally designed for minimum end-to-end outage probability by deriving the optimum time and power allocated on the intracluster and intercluster slots of every single hop, given a per-link energy constraint. A simplified suboptimum resource allocation is also proposed, which performs close to the optimal policy. Results show that the proposed scheme achieves diversity equal to the equivalent MIMO system and significantly reduces energy consumption with respect to. the non-cooperative channel     

An analytic method to predict the thermal map of cryosurgery iceballs in MR images

This paper presents a newly developed method to estimate, in magnetic resonance (MR) images, the temperatures reached within the volume of an iceball produced by a cryogenic probe. Building on the direct measurements of the MR signal intensity and its correlation with independent temperature variations at the phase transition from liquid to solid, the thermal information embedded in the images was accessed. The volume and diameter of the growing iceball were estimated from a time series of MR images. Using regressions over the volume in the time and thermal domains, this method predicted the cryogenic temperatures beyond the range of sensitivity of the MR signal itself. We present a validation of this method in samples of gelatin and ex vivo pig liver. Temperature predictions are shown to agree with independent thermosensor readings over a range extending from 20 degrees C down to -65 degrees C, with an average error of less than 6 degrees C.     

A Cooperative Nearest Neighbours Topology Control Algorithm for Wireless Ad Hoc Networks

In this article, we introduce a simple distributed algorithm that assigns appropriate individual transmission powers to devices in a wireless ad hoc network. In contrast to many other proposed algorithms, it does without special hardware. It requires only local neighbourhood information and therefore avoids flooding information throughout the network. Finally, the cooperative nature of the algorithm avoids that devices cause excessive interference by using unnecessarily high transmission powers. By means of simulation, we show that the topologies created by this algorithm without any global knowledge are as effective as topologies resulting from a good choice of a common transmission power (which would require global knowledge) in terms of the achievable throughput. This work was supported in part by the German Federal Ministry of Education and Research (BMBF) as part of the IPonAir project.     

Thermal Stress Assessment for Transient Liquid-Phase Bonded Si Chips in High-Power Modules Using Experimental and Numerical Methods

The potential of transient liquid-phase (TLP) bonding for chip packaging applications has been evaluated, focusing on three interlayer arrangements (Ag-Sn-Ag, Ni-Sn-Ni, and Ag-Sn-Ni). Shear tests on TLP-bonded components provided the interlayer-dependent mechanical strength as well as failure mode and position. Critical local stresses, i.e., failure criteria, within the intermetallic compound (IMC) layer were derived by replicating the shear test conditions with finite-element methods. The missing coefficient of thermal expansion for Ag₃Sn IMC was obtained by producing small IMC bulk samples and subjecting them to dilatometric measurements. The experimental results were implemented into a finite-element model of a representative power module architecture to provide first predictions on thermally induced residual stresses that could be classified into fail/safe, as successfully validated by TLP chip bonding experiments. A numerical parameter study then assessed thermal stresses, including failure prediction and design optimization for TLP-bonded Si chips, considering the influence of process temperature, service conditions, TLP interlayer system, and metallization layers within the TLP joint. The presented procedure serves as a guideline to choose an appropriate TLP interlayer system for predefined boundary conditions, or vice versa.