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A series of new o‐phenylenediamine (OPD)/o‐phenetidine (PHT) copolymers with partly phenazine‐like structures has been successfully synthesized at three polymerization temperatures by chemically oxidative polymerization in four different polymerization media. The molecular structures and properties of the resulting OPD/PHT polymers were investigated by IR, UV–vis and high‐resolution 1H NMR spectroscopies, and DSC, in order to ascertain the effect of reaction temperature, comonomer ratio and acid medium. The copolymerization mechanism of OPD with PHT monomers has been proposed. It is found that the statistical OPD/PHT copolymer obtained at a temperature of 118 °C has a higher degree of polymerization than that obtained at 12–17 °C. The OPD content in the copolymers calculated from NMR spectroscopic analysis is higher than that in the feed OPD content, whereas the OPD content calculated from element analysis is slightly lower than the feed OPD content. It can be predicted that denitrogenation takes place in the OPD units during the polymerization process at OPD/PHT molar ratios of 90/10 and 100/0. These OPD/PHT copolymers exhibit a much better solubility than the OPD homopolymer, hence suggesting an incorporation of PHT units into the phenazine structure of the homopolymer. The thermal behavior of the copolymers was also studied. Copyright © 2004 Society of Chemical Industry 相似文献
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The process of dispensing one-component heat-cure adhesives was investigated in order to understand current application processes and to guide new process development. Typical one-component adhesives exhibit non-Newtonian rheological behavior, and hence Newtonian fluid mechanics does not adequately describe the dispensing process. In the present study, the adhesives were modeled as Bingham fluids possessing a yield stress and a steady state viscosity. The model of the dispensing apparatus includes four major flow sections connected in a serial configuration. The fluid mechanics equations derived for Bingham fluids in the individual flow sections were solved by numerical methods in order to understand the interrelationships between the material variables (e.g. yield stress, viscosity, temperature dependencies) and process variables (e.g. pressure, flow geometry, temperature, output). The concept of the model is generic and the details of the model can be modified for any forced-flow adhesive application process.
The adhesive flow properties significantly influence the process output. Dispensing temperature, among the process variables, has the strongest effect on process output. A ± 1.0·C perturbation in the dispensing temperature can cause as much as a 14% variation in the bead size for the range of adhesives studied. Differences in flow characteristics result in differences in processability and non-linear temperature/pressure sensitivity. The non-linear sensitivity can be eliminated by operating the dispensing process isothermally. Finally, the process limits for one-component adhesives, which are susceptible to chemical instability induced by viscous heating during processing, are defined and discussed in terms of a modified Brinkman number that takes into account viscous dissipation, heat conduction and convection, and chemical stability of the material during processing. 相似文献
The adhesive flow properties significantly influence the process output. Dispensing temperature, among the process variables, has the strongest effect on process output. A ± 1.0·C perturbation in the dispensing temperature can cause as much as a 14% variation in the bead size for the range of adhesives studied. Differences in flow characteristics result in differences in processability and non-linear temperature/pressure sensitivity. The non-linear sensitivity can be eliminated by operating the dispensing process isothermally. Finally, the process limits for one-component adhesives, which are susceptible to chemical instability induced by viscous heating during processing, are defined and discussed in terms of a modified Brinkman number that takes into account viscous dissipation, heat conduction and convection, and chemical stability of the material during processing. 相似文献
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Diabetes mellitus is a common disease. It affects multiple organ systems. Adverse effects of hyperglycemia on infection, fracture healing, and bone remodeling have been recently reported. This study was conducted to evaluate the clinical and radiographic results of 93 total hip arthroplasties in 78 consecutive patients with diabetes. All femoral components were cemented using contemporary cementing techniques. Prophylactic antibiotics were given in each case. The mean follow-up period was 4.1 years (range, 2-6.5 years). Ninety-six percent of the hips were rated excellent or good. Radiolucencies were observed in only 3.7% of the stems, while 22.2% of the cups showed radiolucencies. There was a 4% revision incidence. There was no postoperative infection in this series--a distinct improvement from previously reported series. However, complications remained high at 24.3%. The most frequent complication was urinary tract infection (14.2%). The most serious complication was myocardial infarction. The authors believe total hip arthroplasty can be safely performed in patients with diabetes, provided that adequate medical and follow-up evaluations are performed. The medium-term clinical and radiographic follow-up evaluations are not inferior to reported series in patients without diabetes. 相似文献
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