Some properties of Sb2Te3−xSex for nonvolatile memory based on phase transition

Composition dependence of properties of Sb₂Te_3–x Se _x in the range 0x<3 were studied using differential thermal analysis and X-ray diffraction. Sb₂Te_3–x Se _x form solid solution for 0<x1.25 and 2.75x<3. A systematic study of crystallization temperature in Sb₂Te_3–x Se _x (0x2.75) thin films prepared by flash evaporation was carried out. In preliminary experiments for some compositions, more than 10³ repetitions between amorphous and crystalline states were attained by the application of electric pulses.     

Effect of vanadium and chromium on the microstructural features of V–Cr–Mn–Ni spheroidal carbide cast irons

The objective of this investigation is to study the influence of vanadium（5.0wt%–10.0wt%） and chromium（0–9.0wt%） on the microstructure and hardness of Cr-V-Mn-Ni white cast irons with spheroidal vanadium carbides. The alloys＇ microstructural features are presented and discussed with regard to the distribution of phase elements. The structural constituents of the alloys are spheroidal VC, proeutectoid cementite, ledeburite eutectic, rosette-shaped carbide eutectic（based on M7C3）, pearlite, martensite, and austenite. Their combinations and area fraction（AF） ratios are reported to be influenced by the alloys＇ chemical composition. Spheroidized VC particles are found to be sites for the nucleation of carbide eutectics. Cr and V are shown to substitute each other in the VC and M7C3 carbides, respectively. Chromium alloying leads to the formation of a eutectic（γ-Fe ＋ М7С3）, preventing the appearance of proeutectoid cementite in the structure. Vanadium and chromium are revealed to increase the total carbide fraction and the amount of austenite in the matrix. Cr is observed to play a key role in controlling the metallic matrix microstructure.     

Generation of copper nanoparticles during alkaline etching of an Al-30 at.%Cu alloy

A mechanism of formation of copper nanoparticles is proposed for alkaline etching of a sputtering-deposited Al-30 at.%Cu alloy, simulating the equilibrium θ phase of 2000 series aluminium alloys. Their formation involves enrichment of copper in the alloy beneath a thin alumina film, clustering of copper atoms, and occlusion of the clusters, due to growth of alumina around the clusters, to form nanoparticles. The proposed mechanism is supported by medium energy ion scattering, Rutherford backscattering spectroscopy, X-ray photoelectron spectroscopy, and transmission electron microscopy of the alloy following immersion in the sodium hydroxide solution, which disclose the enrichment of copper and the generation of the nanoparticles in the etching product of hydrated alumina. The generation of the nanoparticles is dependent upon the enrichment of copper in the alloy in a layer of a few nanometres thickness, with no requirement for bulk de-alloying of the alloy.     

The oxidation of nanocrystalline Ni3Al fabricated by mechanical alloying and spark plasma sintering

Nanocrystalline Ni₃Al was fabricated through mechanical alloying of elemental powders and spark plasma sintering. The nanocrystalline Ni₃Al has a nearly full density after being sintered at 1223 K for 10 min under a pressure of 65 MPa. Isothermal and cyclic oxidations of nanocrystalline Ni₃Al were tested at 1173–1373 K with intervals of 100 K. The results indicate that nanocrystalline Ni₃Al exhibits excellent isothermal and cyclical oxidation resistance. The oxide scales consist primarily of dense and continuous -Al₂O₃. The grain refinement is beneficial for improving the oxidation resistance of Ni₃Al by providing more nucleation centers for the Al₂O₃ formation, promoting the selective formation of Al₂O₃ and improving the adhesion of oxide scales to the matrix.     

Grain orientation effects on copper enrichment and oxygen generation during anodizing of an Al-1at.%Cu alloy

Anodizing of solid-solution Al-1at.%Cu alloy in ammonium pentaborate electrolyte is shown to develop two distinct types of amorphous film. On alloy grains of {1 0 0} orientation, the alumina film is of uniform thickness and relatively featureless. For other grains, the film is of non-uniform thickness and contains oxygen bubbles. In both cases, copper species are distributed throughout the film. Copper is enriched in the alloy to ∼5.8×10¹⁵ Cu atoms cm⁻² for bubble-free grains, with similar or slightly lower levels for other grains. Evidently, copper enrichment alone does not lead to generation of oxygen. Other factors suggested to be involved, each dependent upon grain orientation, are the structure of the enriched alloy layer, the cyclic nature of the oxidation of copper, and the generation of modulated film compositions.     

Initial stages of plasma electrolytic oxidation of titanium

The initial stages of oxide growth on titanium are examined in a recently developed commercial alkaline pyrophosphate/aluminate electrolyte of interest for plasma electrolytic oxidation of light metal alloys. Constant current anodizing was employed, with resultant films examined by scanning and transmission electron microscopies and Rutherford backscattering spectroscopy. The initial film is relatively uniform and composed of TiO₂, with low concentrations of aluminium and phosphorus species incorporated from the electrolyte. With increase in voltage the film breaks down locally, and regions of original and modified film develop simultaneously, with the latter occupying more of the surface as the voltage rises. Porous regions due to dielectric breakdown also become increasingly evident. At 240 V, sparking commences, and the surface reveals extensive, relatively uniform porosity, with the coating now containing much enhanced concentrations of aluminium and phosphorus species compared with the coating at lower voltages. The films develop at low efficiency due to generation of oxygen. The oxygen is produced within the original film material and at sites of dielectric breakdown. The former type of film develops a two-layered morphology, with an outer layer of amorphous TiO₂ and an inner layer with numerous fine and course cavities. The cavities are due to the generation of oxygen that may be associated with the formation of anatase in the inner layer.     

Development of flexible displays using back‐channel‐etched In–Sn–Zn–O thin‐film transistors and air‐stable inverted organic light‐emitting diodes

We developed flexible displays using back‐channel‐etched In–Sn–Zn–O (ITZO) thin‐film transistors (TFTs) and air‐stable inverted organic light‐emitting diodes (iOLEDs). The TFTs fabricated on a polyimide film exhibited high mobility (32.9 cm²/Vs) and stability by utilization of a solution‐processed organic passivation layer. ITZO was also used as an electron injection layer (EIL) in the iOLEDs instead of conventional air‐sensitive materials. The iOLED with ITZO as an EIL exhibited higher efficiency and a lower driving voltage than that of conventional iOLEDs. Our approach of the simultaneous formation of ITZO film as both of a channel layer in TFTs and of an EIL in iOLEDs offers simple fabrication process.     

High-temperature strength and thermal stability of a unidirectionally solidified Al2O3/YAG eutectic composite

A unidirectional solidification method was investigated to manufacture Al2O3/YAG eutectic composites with high-temperature resistance that would make them usable at very high temperatures. We were successful in manufacturing a single-crystal Al2O3/single-crystal YAG eutectic composite with a dimension of 40 mm in diameter and 70 mm in length containing no colonies or pores. This composite also displayed excellent high-temperature strength characteristics. The flexural strength was in the range 350400 MPa from room temperature up to 2073 K (just below its melting point of about 2100 K) with no apparent temperature dependence. During tensile tests above 1923 K, the eutectic composite showed evidence of plastic deformation occurring by dislocation motion, and a yield phenomenon similar to many metals was observed. In addition, the microstructure of the composite was extremely stable: after 1000 h of heat treatment at 1973 K in an air atmosphere there was no growth. The above superior high-temperature characteristics are caused by such factors as the eutectic composite having a single-crystal Al2O3/single-crystal YAG structure, the formation of a compatible interface with no amorphous phase and thermal stability, and the combined effect of a YAG phase with superior high-temperature characteristics. © 1998 Chapman & Hall     

Nitric oxide decomposition in air by using nonthermal plasmaprocessing with additives and catalyst

Catalyst (copper-coated zeolite catalyst, i.e., Cu-ZSM-5) was used to enhance NO_x removal plasma chemical reactions. Two kinds of hydrocarbons (2-propane-1-ol, 2-propanol) were added to the synthesized flue gas before the nonthermal plasma process, and their effects on NO_x removal characteristics were investigated. Enhancement effects of NO_x removal by the nonthermal plasma process with hydrocarbons as the additives were confirmed. Usually, the catalyst's working temperature is much higher than the room temperature. A catalytic reactor was installed after the plasma reactor. Catalytic effects on NO_x removal characteristics disappeared when the synthesized flue gas temperature was increased (~250°C). When the synthesized flue gas temperature was at room temperature, about 90% NO _x removal efficiency was realized with a combination of hydrocarbons, the catalytic reactor, and the pulsed discharge plasma     

Effect of Elastic Energy due to Atomic Size Factor on Ordering and Decomposition Behaviour of Binary Solid Solutions

A theory recently developed by the present authors is applied to the study of the effect of elastic energy due to atomic size factor on the transformation behaviour of binary solid solutions. lt is found that elastic interaction energy (EIE), which is a part of the total elastic energy plays a key role in both ordering elastic interaction ordering (EIO) and spinodal decomposition. The present study gives a reasonable explanation to the historical dilemmas, "elastic energy paradox" and "atomic size factor paradox . By solving these confusing problems, the coexistence of ordering (EIO) and decomposition, which has been regarded as impossible by conventional theories. can be well understood. The mechanism is as follows: lowering of elastic energy demands EIO, and such an ordering provides a driving force for spinodal decomposition. Therefore, in alloys with large atomic size factor, spinodal decomposition is preceded and induced by ordering. Ordering and spinodal decomposition are thus closely related processes to each other