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41.
Wha Sook Jeon Dong Geun Jeong 《Vehicular Technology, IEEE Transactions on》2000,49(6):2164-2173
This paper suggests an improved probabilistic location update (IPLU) scheme for advanced cellular mobile networks. The location management cost with IPLU is analyzed, and various performance characteristics of IPLU are investigated. It is shown that IPLU has the parameter q that can be used as a control parameter to achieve the best performance when the unit location update cost (U) and the unit paging cost (P) are given. In addition, this paper provides some recommendable values of q in two cases, P>U and P⩽U. As a result, we demonstrate a merit of IPLU, that is, simple implementation with an acceptable performance level, especially, under the future cellular mobile network environments where a vast number of microcells/picocells exist and the relative user mobility is very high 相似文献
42.
Kyoung-Sik Im Jae-HyokKo Suk-Jin Kim Chan-Hee Jeon Chang-Su Kim Ki-Tae Lee Han-Gu Kim Il-Hun Son 《Microelectronics Reliability》2006,46(9-11):1664-1668
This paper presents a novel ESD strategy for non-volatile memory (NVM) programming pin in a 0.13um/30V technology. Suggested scheme can provide not only a major current discharge path to protect the internal circuit from ESD damage but also a voltage clamping function to prevent the soft error of programmed data during the ESD event. It has been validated by TLP experiments and TCAD simulation. 相似文献
43.
Myung Lee Rui Zhang Chunhui Zhu Tae Rim Park Chang-Sub Shin Young-Ae Jeon Seong-Hee Lee Sang-Sung Choi Yong Liu Sung-Woo Park 《Communications Magazine, IEEE》2010,48(1):54-61
This article presents an overview of the IEEE project 802.15.5 that targets providing mesh capabilities to both high-rate and low-rate wireless personal area networks. Low-rate mesh is built on IEEE 802.15.4 MAC, while high-rate mesh utilizes IEEE 802.15.3 MAC. We seek to share our insights and motivations of the approach adopted in the major components of the standard instead of presenting a la carte items drawn in the specification. We hope this article helps readers of the 802.15.5 standard to better understand the rationale and intent of the protocol design. 相似文献
44.
A 9‐bit 80‐MS/s CMOS pipelined folding analog‐to‐digital converter employing offset‐canceled preamplifiers and a subranging scheme is proposed to extend the resolution of a folding architecture. A fully differential dc‐decoupled structure achieves high linearity in circuit design. The measured differential nonlinearity and integral nonlinearity of the prototype are ×0.6 LSB and ×1.6 LSB, respectively. 相似文献
45.
Hyoung-Goo Jeon Sung-Moon Shin Taewon Hwang Chang Eon Kang 《Vehicular Technology, IEEE Transactions on》2000,49(6):2158-2163
The demands for mobile communication services are growing rapidly. In heavily populated areas, cell splits are unavoidable to increase the capacity of the cellular system. Cell splitting makes a cellular system have mixed cell sizes. For cell planning, it is necessary to analyze the reverse link capacity of a code-division multiple-access (CDMA) cellular system with mixed cell sizes. In this paper, we propose a method to calculate the reverse link capacity of a CDMA cellular system with mixed cell sizes. When a macro cell is split into three micro cells, as an example, we calculate the reverse link capacities for the three micro cells and the neighboring macro cells. The results show that as the radius of a micro cell decreases, the reverse link capacity of the micro cell increases, while those of the neighboring macro cells decrease 相似文献
46.
Kun-Mo Chu Jung-Hwan Choi Jung-Sub Lee Han Seo Cho Seong-Ook Park Hyo-Hoon Park Duk Young Jeon 《Advanced Packaging, IEEE Transactions on》2006,29(3):409-414
This paper describes low-temperature flip-chip bonding for both optical interconnect and microwave applications. Vertical-cavity surface-emitting laser (VCSEL) arrays were flip-chip bonded onto a fused silica substrate to investigate the optoelectronic characteristics. To achieve low-temperature flip-chip bonding, indium solder bumps were used, which had a low melting temperature of 156.7/spl deg/C. The current-voltage (I-V) and light-current (L-I) characteristics of the flip-chip bonded VCSEL arrays were improved by Ag coating on the indium bump. The I-V and L-I curves indicate that optical and electrical performances of Ag-coated indium bumps are superior to those of uncoated indium solder bumps. The microwave characteristics of the solder bumps were investigated by using a flip-chip-bonded coplanar waveguide (CPW) structure and by measuring the scattering parameter with an on-wafer probe station for the frequency range up to 40 GHz. The indium solder bumps, either with or without the Ag coating, provided good microwave characteristics and retained the original characteristic of the CPW signal lines without degradation of the insertion and return losses by the solder bumps. 相似文献
47.
A loss of subchannel orthogonality due to time-variant multipath channels in orthogonal frequency division multiplexing (OFDM) systems leads to interchannel interference (ICI) which increases the error floor in proportion to the Doppler frequency. A simple frequency-domain equalization technique which can compensate for the effect of ICI in a multipath fading channel is proposed. In this technique, the equalization of the received OFDM signal is achieved by using the assumption that the channel impulse response (CIR) varies in a linear fashion during a block period and by compensating for the ICI terms that significantly affect the bit-error rate (BER) performance 相似文献
48.
Seong-Jeub Jeon Gyu-Hyeong Cho 《Electronics letters》1999,35(13):1043-1044
A new zero voltage and zero current switching (ZVZCS) full bridge DC-DC converter with transformer isolation is proposed for arc welding machines. The proposed DC-DC converter uses an auxiliary transformer to obtain ZCS for the leading leg, which provides load current control capability even under short circuit conditions. The power rating of the auxiliary transformer is ~10% or more of the main transformer. The operation is verified by experiments 相似文献
49.
50.
Jooyoung Jeon Youngwoo Kwon Hong-Shick Min 《Microwave and Wireless Components Letters, IEEE》2002,12(9):342-344
A new physics-based noise model of a GaAs PHEMT is developed using the characteristic potential method (CPM). The model calculates the intrinsic noise current sources using CPM. Combined with the extrinsic noise parameters extracted from the measured S-parameters, the model reproduces four noise parameters of the device accurately under low drain bias voltages without using any fitting parameters. The model is verified with a 0.2-/spl mu/m GaAs PHEMT and shows excellent agreement with the measurements for all the noise parameters up to a drain voltage of 1 V Also, the proposed method allows the simulation of the microscopic noise distribution and thus allows one to obtain a physical understanding of noise mechanisms inside the device. 相似文献