排序方式: 共有83条查询结果,搜索用时 15 毫秒
81.
Labiod Samir Smaani Billel Tayal Shubham Rahi Shiromani Balmukund Sedrati Hichem Latreche Saida 《SILICON》2023,15(3):1181-1191
Silicon - Within this paper, a total optoelectronic simulation of a PIN photodiode structure was presented. The microlens structure has been introduced on the top of the PIN photodiode to... 相似文献
82.
Shubham Jaiswal Jeet Vishwakarma Shubham Bhatt Saheb Karak Pankaj Bharti Chetna Dhand Rajeev Kumar Pradip Kumar Mohammad S. M. Saifullah Surajit Saha Rahul Mishra Neeraj Dwivedi 《Advanced Engineering Materials》2023,25(17):2300233
Stimuli-responsive materials can frequently tune between their temporary and original shapes, and have the potential for artificial intelligence-based technologies in robotics, aerospace, biomedical, engineering, security, etc. Shape memory polymers (SMPs) are promising for these technologies but their inadequate thermal and electrical characteristics causing slow shape recovery limit their practical applications. Herein, for the first time, comprehensively and precisely the shape memory polyurethane (PU), a promising SMP, via a variety of novel layered titanium carbides fillers, namely, Ti2AlC (MAX1), Ti3AlC2 (MAX2), and Ti3C2 (MXene), is engineered. The resultant PU-composites show 30–50% faster shape recovery in different environments, 20–25% greater extent of shape recovery in the load-constrained environment, 100–125% higher thermal conductivity, and 700–16 000× higher electrical current. Importantly, the reinforcement of even a small amount of MAX and MXene (such as 0.25 wt%) has largely boosted the performance of PU. Considering ease of processability and performance enhancement factors, the MAX-phase fillers may be preferred over MXene-phase fillers for next-generation composites development. Employing PU composite component as both heat-sensor and actuator, a unique heat detector/fire alarm device that works successfully in simulated heat and fire environments is demonstrated. This work is crucial for enabling futuristic technologies. 相似文献
83.
Nigam Kaushal Kondekar PN Chandan Bandi Venkata Kumar Satyendra Tikkiwal Vinay Anand Dharmender Singh Km. Sucheta Bhardwaj Eshaan Choubey Shubham Chaturvedi Savitesh 《SILICON》2022,14(4):1549-1558
Silicon - To overcome the fabrication complexity and achieve a better switching ratio is a major grave concern for applications in semiconductor devices. In this regards, a novel stack gate-oxide... 相似文献