Humidity Sensor Characteristics of Woodceramics

The humidity sensor characteristics of Woodceramics were investigated. The Woodceramics used in this experiment were prepared at 650–900°C. The size of specimens selected was 1 × 1 × 10 mm . One was used as-cut and the other was polished. Above 700°C, the resistance of the specimen was below 50 and the decrease of resistance with increasing relative humidity was small. The specimen prepared at 650°C had a resistance of about 1 k. The resistance of as-cut specimens decreased with increase in relative humidity, but that of the polished specimen did not change significantly. The difference between as-cut and polished samples was explained by the differences in surface micro-structure.     

Preparation of water‐repellent silks by a reaction with octadecenylsuccinic anhydride

Silk fibers and membranes were acylated with octadecenylsuccinic anhydride (ODSA) at 75°C for different times. Swelling [N,N‐dimethylformamide (DMF) and dimethyl sulfoxide (DMSO)] and nonswelling (xylene) solvent media were used for the reaction. Silk membranes that reacted in DMF or DMSO displayed faster reaction kinetics and attained higher weight‐gain values than fibers. The effect of the solvent on the reaction yield was in the following order: DMSO > DMF ? xylene. The Fourier transform infrared spectra of acylated silk samples showed the characteristic absorption bands of the anhydride at 2990, 2852, 1780–1700, and 1170 cm^?1. The intensity of the latter band, which increased linearly with the weight gain, was used as a marker for evaluating the reaction kinetics of the samples acylated in the nonswelling medium. The moisture regain and water retention of silk fibers acylated with ODSA decreased significantly, regardless of the solvent system used. Accordingly, the water repellency increased. Acylation induced an increase in the thermal stability of the silk fibers and membranes. Fine particles adhering to the surfaces of the silk fibers acylated in xylene were detected by scanning electron microscopy. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 89: 324–332, 2003     

Poly(butylene succinate)/poly(vinyl phenol) blends. Part 1. Miscibility and crystallization

Miscibility has been investigated in blends of poly(butylene succinate) (PBSU) and poly(vinyl phenol) (PVPh) by differential scanning calorimetry in this work. PBSU is miscible with PVPh as shown by the existence of single composition dependent glass transition temperature over the entire composition range. In addition, the polymer–polymer interaction parameter, obtained from the melting depression of PBSU using the Nishi–Wang equation, is composition dependent, and its value is always negative. This indicates that PBSU/PVPh blends are thermodynamically miscible in the melt. Preliminary morphology study of PBSU/PVPh blends was also studied by optical microscopy (OM). OM experiments show the spherulites of PBSU become larger with the PVPh content, indicative of a decrease in the nucleation density, and the coarseness of PBSU spherulites increases too with increasing the PVPh content in the blends.     

高速气流冲击式粉体表面改性装置——HYBRIDIZATION系统及应用

利用高速气流冲击法进行粉体/粉体系表面改性技术,是迄今为止各种粉体材料开发中最为引人注目的技术之一。HYBRIDIZATION(下称HYB)系统是利用高速气流冲击法对微粉体进行干式/机械化处理,是使材料复合化的最实用的装置,可对各类有机物、无机物、金属等进行广泛组合,通用性很强,适用于许多行业领域。从本文所述的系统构成、型式,有关的典型球形化处理的运转特性,利用复合化高温粉体测定被处理粉体表面温度,利用颜料改变色调等的处理特点及该系统的适用性等(一部分是从已发表的学术论文及专利上摘录的),可以说明HYB系统的概况。     

Radical polymerization of methyl methacrylate with methyl 2,2-dimethyl-3,3-diphenyl-3-cyanopropionate as a thermal iniferter

Summary To clarify the mechanism of living radical polymerization of methyl methacrylate (MMA) with tetraphenylsuccinodinitrile (TPSN) as a thermal iniferter, a model compound for the end group of the poly(MMA) produced, methyl 2,2-dimethyl-3,3-diphenyl-3-cyanopropionate (2), was synthesized and found to initiate a living radical polymerization of MMA, indicating that the hexa-substituted C-C bond in 2 dissociated into radicals. The poly(MMA) thus obtained further initiated the radical polymerization of styrene (St) to give a block copolymer.     

Production of antimicrobially active silk proteins by use of metal‐containing dyestuffs

The work presented here discusses a new technique for preparing silk fibers and films with persistent antimicrobial activity through use of metallic dyestuffs during the fiber dyeing process. The length of the silk fibers investigated contracted when the fibers were immersed in concentrated neutral salt solutions, such as calcium or potassium nitrate, at elevated temperature levels. The birefringence and molecular orientation of the silk fibroin molecules became less ordered by the action of the neutral salt solutions, resulting in increased dyestuff absorption. Subsequently, contracted silk fibers were dyed with metallic dyestuffs containing Cr or Cu for the purpose of obtaining silk fibers with antimicrobial activity. Silk fibers dyed with metallic dyestuffs showed significant antimicrobial activity against the plant pathogen Cornebacterium and the human pathogen Coli bacillus. Tensile strength of the silk fibers after the salt shrinking and dyeing processes did not show a significant change, whereas the elongation at break was increased slightly. The techniques described here for preparing significantly active antimicrobial silk fibers are effective and economic ways of providing new materials for industrial and biomedical applications. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 86: 1181–1188, 2002     

Studies on sublimation of disperse dye out of dyed polymers. I. Rate of sublimation and amorphous transition points of poly(ethylene terephthalate)

Four samples of poly(ethylene terephthalate) film of various crystallinities and orientation were dyed with p-nitroaniline and disperse dyes. When these films were heated under a 2–3 × 10^?3 mm Hg vacuum at a specified temperature T, the dye sublimed out of the dyed specimen. The amount (M_t/M_∞) of sublimed dye is in linear proportion to the square root of the sublimation time, t^½, where M_t and M_∞ are the amounts of dye sublimed for times t and t = ∞. The diffusion coefficient D, calculated from the slope of the above plot, is independent of the dye concentration of the film. When log D is plotted against 1/T°K over the temperature range 320–520°K, the relation is composed of two to four intersecting lines with the slope decreasing with elevation of temperature and with the breaks at about 89°–98°, 122°–135°, 155° and 175°–176°C. These breaks are the amorphous transitions: the first is the glass transition temperature T_g, the second and the fourth are the amorphous transitions corresponding to the crystalline transition points, i.e., the cold crystallization temperature and the smectic–triclinic transition temperature. With some exceptions, these amorphous transitions are found also by dilatometry and electrical conductivity measurements. The apparent activation energy for diffusion decreases from about 100 kcal/mole for the glass state to 22–24 kcal/mole for the region above 180°C. The activation energy for each region changes slightly with the size of dye molecule and the crystallinity and orientation of the film.     

Interfacial Reactions between Sapphire and Silver—Copper—Titanium Thin Film Filler Metal

Wetting and brazing studies of sputtering-deposited, submicrometer thin film filler metal in an Ag—Cu—Ti/Al₂O₃ system were performed. The interfacial reaction layer between the filler metal and Al₂O₃ was investigated. It is possible to make a brazing joint even with a reaction layer of less than 100 nm thickness. Different types of interfacial reaction layers were observed when the Ti content in the filler metal was varied. The Cu—Ti—O system compounds were observed in the samples with high wetting capabilities, but not in the sample with low wetting characteristics. It was found that these compounds are substances that promote effective brazing.     

Preparation and characterization of electroplated amorphous gold-nickel alloy film for electrical contact applications

A process for electroplating amorphous gold-nickel alloy with the atomic ratio of unity was developed. The plating bath was prepared by adding potassium cyanoaurate(I) into a known plating bath which produces amorphous nickel-tungsten alloy. At a sufficiently high gold concentration, the alloy deposit did not contain any tungsten. The amorphous nature of the Au-Ni alloy produced in the new bath was confirmed by using TEM and THEED. Hardness, resistivity, and contact resistance of this new alloy were determined, and the results are discussed for applications as an electrical contact material.