Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly

In this paper we verified the submodeling technique applied in the thermomechanical reliability assessment of a flip-chip BGA under accelerated thermal cycling test conditions. Since the steady-state creep model was implemented for the solder bump to better represent its realistic mechanical behavior, submodeling procedures developed specifically for path-dependent thermomechanical problems were considered. A detailed global model for the flip-chip BGA was built up to verify submodeling solutions. This model also served as a benchmark to examine solution discrepancies caused by different simplifications of the global model.     

Toughening mechanism for a rubber-toughened epoxy resin with rubber/matrix interfacial modification

For a rubber-toughened piperidine-DGEBA epoxy resin, the interface between the rubber particle and the epoxy resin matrix was modified by an epoxide end-capped carboxyl terminated butadiene and acrylonitrile random copolymer (CTBN). The end-capping epoxides used were a rigid diglycidyl ether of bisphenol-A (Epon 828), a short-chain flexible diglycidyl ether of propylene glycol (DER 736), and a long-chain flexible diglycidyl ether of propylene glycol (DER 732). The microstructures and the fracture behaviour of these rubber-modified epoxy resins were studied by transmission electron microscopy and scanning electron microscopy. Their thermal and mechanical properties were also investigated. In the rubber-modified epoxy resins, if the added CTBNs were end-capped by a flexible diglycidyl ether of propylene glycol (DER 732 or DER 736) before curing, the interfacial zone of the undeformed rubber particle, the degree of cavitation of the cavitated rubber particle on the fracture surface and the fracture energy of the toughened epoxy resin were all significantly increased. The toughening mechanism based on cavitation and localized shear yielding was considered and a mechanism for the interaction between cavitation and localized shear yielding that accounts for all the observed characteristics is proposed.     

超分子主体化合物在分析化学中的应用研究进展

综述了近年来超分子主体化合物在分析化学领域的应用研究与进展。分别以冠醚、环糊精、杯芳烃、卟啉4类超分子为主体功能化合物的研究进行了详细的评述，并对这几类主体化合物在分析化学中的应用研究进行了展望。     

Ozonation of CI Reactive Black 5 using rotating packed bed and stirred tank reactor

This study investigates the ozonation of CI Reactive Black 5 (RB5) by using the rotating packed bed (RPB) and completely stirred tank reactor (CSTR) as ozone contactors. The RPB, which provides high gravitational force by adjusting the rotational speed, was employed as a novel ozone contactor. The same ozone dosage was separately introduced into either the RPB or the CSTR for the investigation, while the experimental solution was continuously circulated within the apparatus consisting of the RPB and CSTR. The decolorization and mineralization efficiencies of RB5 in the course of ozonation are compared for these two methods. Moreover, the dissolved and off‐gas ozone concentrations were simultaneously monitored for the further analysis. As a result, the ozone mass transfer rate per unit volume of the RPB was significantly higher because of its higher mass transfer coefficient and gas–liquid concentration driving force. Furthermore, ozonation kinetics was found to be independent of the gravitational magnitude of an ozone gas–liquid contactor. Therefore, the results suggest employing RPBs as ozone‐contacting devices with the advantage of volume reduction. The experimental results, which can be used for further modeling of the ozonation process in the RPB, also show the requirement of correct design for the RPB. Consequently, the present study is useful for the understanding of practical application of RPBs. Copyright © 2004 Society of Chemical Industry     

新型超微晶软磁合金FePCCuMoSi微观结构缺陷的正电子湮没研究

用正电子湮没方法研究了新型超微晶软磁合金的微观结构缺陷，样品选用的是在不同温度下退火的Ｆｅ８１Ｐ１２Ｃ３Ｃｕ１Ｍｏ０．５Ｓｉ２．５合金，结果表明，合金的微观结构构陷大小，密度随退火温度有规律地变化，这种现象可能与非晶的晶化过程有关。     

用保形样条方法求解非定常对流扩散方程

在欧拉-拉格朗日分裂方法的基础上,本文发展了一种固定网格上的欧拉-拉格朗日分裂方法.保形样条方法(SPSM)被用来解决倒特征线插值问题.通过求解几个有精确解的例子,说明SPSM方法的解是单调无振荡的,并且数值耗散也是比较小的.     

反应离化团束（RICB）法生长CN硬质薄膜

用反应离化团束（ＲＩＣＢ）法，以低分子量聚乙烯为蒸发材料，氨气为反应气体，在ＮａＣｌ（１００）和Ｓｉ（１００）衬底上淀积Ｃ－Ｎ薄膜，透射电子衍射（ＴＥＭ）分析表明薄膜中含有β－Ｃ３Ｎ４晶粒，Ｘ射线光电子谱（ＸＰＳ）和红外吸收谱（ＩＲ）表明存在Ｃ，Ｎ原子的化学键合。     

A novel proof of the Souriau-Frame-Faddeev algorithm

A simple and elegant proof is given for a recurrence relation that computes the coefficients of the characteristic polynomial of a linear system used in the Souriau-Frame-Faddeev algorithm     

以CGA卡为基础的智能显示系统

本文介绍了以微处理器与ＩＢＭ－ＰＣ上的彩色／图形适配器相结合构成的一种智能显示系统。本系统主要解决数控系统中主ＣＰＵ与６８４５ＣＲＴＣ争夺显示缓存的矛盾。保证了６８４５ＣＲＴＣ对显示缓存操作的时间要求；并且保证了数控系统中主ＣＰＵ对显示缓存操作的随意性。     

薄Si膜对基底表面粗糙度的影响

利用ＺＹＧＯ光学干涉测量仪，散射积分测量法观测了光学元件表面均方根粗糙度．详细分析了薄Ｓｉ膜对基底均方根粗糙度的影响，由此认为薄膜并不总是复制基底表面的粗糙度，结果出现了薄膜降低表面粗糙度的现象．提出了一定厚度范围的薄Ｓｉ膜的表面粗糙度存在着一个稳定值的新设想．