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101.
Toru Nagaoka Yoshiaki Morisada Masao Fukusumi Tadashi Takemoto 《Metallurgical and Materials Transactions B》2010,41(4):864-871
To obtain sound butt-joints of 5056 aluminum alloy rods, ultrasonic-assisted soldering was conducted using Zn-18Sn and Zn-60Sn
alloys. Each solder foil was inserted between rods of 5056 aluminum alloy. Ultrasonic vibration was propagated to faying surfaces
at soldering temperatures below the liquidus temperature of the solder alloys, and then the samples were air cooled to room
temperature. The optimum vibration time at the soldering temperature must be more than 2 seconds to have complete wetting
and less than 4 seconds to avoid excessive dissolution of the 5056 alloy. The 5056 alloy joints soldered using quasi-melting.
Zn-Sn alloys showed greater strength than the joints soldered at the temperatures over its respective liquidus temperature.
As the soldering temperature was increased, the increased formation of the intermetallic compound Mg2Sn or phases containing Mg generated by dissolution of 5056 into the solder layer decreased the joint strength. Ultrasonic-assisted
soldering at an optimum temperature between solidus and liquidus of the Zn-Sn alloys is an important consideration for producing
sound joints with sufficient strength. 相似文献
102.
103.
Russell G. Keanini Jack L. Ferracane Toru Okabe 《Metallurgical and Materials Transactions B》2001,32(3):409-416
This article reports an experimental and theoretical investigation of mercury dissolution from dental amalgams immersed in
neutral (noncorrosive) and acidic (corrosive) flows. Atomic absorption spectrophotometric measurements of Hg loss indicate
that in neutral flow, surface oxide films formed in air prior to immersion persist and effectively suppress significant mercury
release. In acidic (pH 1) flows, by contrast, oxide films are unstable and dissolve; depending on the amalgam’s material composition,
particularly its copper content, two distinct mercury release mechanisms are initiated. In low copper amalgam, high initial
mercury release rates are observed and appear to reflect preferential mercury dissolution from unstable Sn8Hg (γ
2) grains within the amalgam matrix. In high copper amalgam, mercury release rates are initially low, but increase with time. Microscopic examination suggests that this feature reflects corrosion of copper from grains of Cu6Sn5 (η′) and consequent exposure of Ag2Hg3 (γ
1) grains; the latter serve as internal mercury release sites and become more numerous as corrosion proceeds. Three theoretical
models are proposed in order to explain observed dissolution characteristics. Model I, applicable to high and low copper amalgams
in neutral flow, assumes that mercury dissolution is mediated by solid diffusion within the amalgam, and that a thin oxide
film persists on the amalgam’s surface and lumps diffusive in-film transport into an effective convective boundary condition.
Model II, applicable to low copper amalgam in acidic flow, assumes that the amalgam’s external oxide film dissolves on a short
time scale relative to the experimental observation period; it neglects corrosive suppression of mercury transport. Model
III, applicable to high copper amalgam in acidic flow, assumes that internal mercury release sites are created by corrosion
of copper in η′ grains and that corrosion proceeds via an oxidation-reduction reaction involving bound copper and diffusing hydrogen ions. The models appear to capture the correct
time dependence of each dissolution mechanism and to provide reasonable fits to the experimental data. 相似文献
104.
105.
Osamu Nakagawa Haruo Shimamoto Tetsuya Ueda Kou Shimomura Tsutomu Hata Toru Tachikawa Jiro Fukushima Toshinobu Banjo Isamu Yamamoto 《Journal of Electronic Materials》1989,18(5):633-643
As electronic devices become more highly integrated, the demand for small, high pin count packages has been increasing. We
have developed two new types of IC packages in response to this demand. One is an ultra thin small outline package (TSOP)
which has been reduced in size from the standard SOP and the other, which uses Tape Automated Bonding (TAB) technology, is
a super thin, high pin count TAB in cap (T.I.C.) package. In this paper, we present these packages and their features along
with the technologies used to improve package reliability and TAB. Thin packages are vulnerable to high humidity exposure,
especially after heat shock.1 The following items were therefore investigated in order to improve humidity resistance: (1)
The molding compound thermal stress, (2) Water absorption into the molding compound and its effect on package cracking during
solder dipping, (3) Chip attach pad area and its affect on package cracking, (4) Adhesion between molding resin and chip attach
pad and its affect on humidity resistance. With the improvements made as a result of these investigations, the reliability
of the new thin packages is similar to that of the standard thicker plastic packages. 相似文献
106.
107.
H Tanigami N Yahagi K Kumon Y Watanabe M Haruna J Matsui H Hayashi 《Canadian Metallurgical Quarterly》1997,21(1):21-23
Eight new 0 (91-98) and H (46-49) antigens are described. Their reference strains come from Czech Republic, Cuba and USA. The majority of reference strains are of human origin. Some of the new antigens have been found in other strains coming mostly from water. 相似文献
108.
A method for the stereospecific analysis of triacyl-sn-glycerols by high-performance liquid chromatography (HPLC) on a chiral column is described. Triacyl-sn-glycerols were partially degraded with ethyl magnesium bromide, and the monoacylglycerols produced were separated as 1- and
2-monoacylglycerol fractions by thin-layer chromatography on boric acid-impregnated silica gel plates. The 1-monoacylglycerols
were resolved intosn-1 andsn-3 monoacylglycerol fractions by HPLC on a chiral column (Sumichiral OA-4100) after derivatization with 3,5-dinitrophenyl
isocyanate. Fatty acid methyl esters obtained from the original triacyl-sn-glycerols, 1- and 2-monoacylglycerol fractions, andsn-1 andsn-3 monoacylglycerol fractions were analyzed by gas chromatography on open-tubular columns. Stereospecific acyl distributions
in triacyl-sn-glycerols were calculated from the data. The acyl distributions of several oils were obtained. The method is rapid, simple
and gave reproducible results. 相似文献
109.
Akihiko Yamaguchi Kosuke Kurokawa Toru Uno Masaharu Takahashi 《Solar Energy Materials & Solar Cells》2003,75(3-4):679-686
In this paper, the authors investigated the reflection and absorption characteristics of a general photovoltaic (PV) module. As a result, the electromagnetic waves could be attenuated only 6 dB in typical PV module. However, if the PV module is installed in the outer wall of buildings, electromagnetic interference is caused by the surroundings. To reduce this electromagnetic interference, the authors suggested a method to absorb electromagnetic wave using multiple PV modules that have deference impedance, and simulation was performed. As a result, it was confirmed that using a typical PV module and the PV module including electronic device, the reflection waves of those PV modules could be attenuated up to 12 dB. 相似文献
110.
An experimental study on gas absorption into falling liquid film formed on inner surface of vertical tubes has been carried out in order to clarify fundamental characteristics of the gas absorption and enhancement by surface waves. The water supplied into the test tubes is periodically disturbed by fluctuating a silicon tube before the test section with a speaker and the wavy films absorb the oxygen filled in the tubes. Imposing the periodic disturbance enhances the gas absorption and the enhancement has a maximum at around 20-30 Hz, where the gas absorption is 20-30% higher. Mass transfer coefficients obtained with five tubes agree well with those obtained with single tube. Two-dimensional numerical simulations have also been conducted for gas absorption by wavy film and the enhancement mechanism of the gas absorption is discussed. 相似文献